MY136708A - A method for removing surface contaminants on moulds used in semiconductor packaging tools - Google Patents

A method for removing surface contaminants on moulds used in semiconductor packaging tools

Info

Publication number
MY136708A
MY136708A MYPI98002099A MYPI9802099A MY136708A MY 136708 A MY136708 A MY 136708A MY PI98002099 A MYPI98002099 A MY PI98002099A MY PI9802099 A MYPI9802099 A MY PI9802099A MY 136708 A MY136708 A MY 136708A
Authority
MY
Malaysia
Prior art keywords
laser
contaminants
mould
remove
semiconductor packaging
Prior art date
Application number
MYPI98002099A
Inventor
Lu Yongfeng
Song Wendong
Gow Cheng Pak
Chen Qiong
Tay Huck Wee
Hwa Teik Hing Thomas
Lim Lui Ching Dawn
Jason Ngin Yan Koon
Jason Sim Yak Hui
Original Assignee
Advanced Systems Automation Ltd
Inst Data Storage
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Systems Automation Ltd, Inst Data Storage filed Critical Advanced Systems Automation Ltd
Publication of MY136708A publication Critical patent/MY136708A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • B08B7/0042—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by laser

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Cleaning In General (AREA)
  • Laser Beam Processing (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

THE PRESENT INVENTION UTILIZES LASER TO REMOVE THE SURFACE CONTAMINANTS SUCH AS A GREASE, WAX, AND RESIN RESIDUE FROM A MOULD USED IN SEMICONDUCTOR PACKAGING TOOLS. THE CONTAMINANT REMOVAL PROCESS UTILIZING THE LASER INVOLVES SHOOTING A BEAM OF LASER ONTO THE SURFACE OF THE MOULD HAVING THE CONTAMINANTS. THE LASER IS DELIVERED AS A PULSE WHICH LAST ONLY A SHORT DURATION. MULTIPLE PULSES MAY BE REQUIRED TO COMPLETELY REMOVE THE CONTAMINANTS. BECAUSE THE AREA OF CONVERAGE FOR EACH PULSE IS USUALLY MUCH SMALLER THAN THE TOTAL AREA OF THE MOULD SURFACE, THE LASER NEEDS TO BE MOVED AROUND UNTIL THE ENTIRE MOULD SURFACE HAS BEEN EXPOSED TO THE LASER. BECAUSE FUMES ARE PRODUCED AS THE LASER DISINTEGRATES THE CONTAMINANTS, SOME TYPE OF VACUUM SHOULD BE USED TO REMOVE THE RESIDUAL GAS AND OTHER DEBRIS.
MYPI98002099A 1997-12-18 1998-05-08 A method for removing surface contaminants on moulds used in semiconductor packaging tools MY136708A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG1997004544A SG78282A1 (en) 1997-12-18 1997-12-18 A method for removing surface contaminants on moulds used in semiconductor packaging tools

Publications (1)

Publication Number Publication Date
MY136708A true MY136708A (en) 2008-11-28

Family

ID=20429813

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI98002099A MY136708A (en) 1997-12-18 1998-05-08 A method for removing surface contaminants on moulds used in semiconductor packaging tools

Country Status (7)

Country Link
EP (1) EP1039977A4 (en)
JP (1) JP2002508249A (en)
CN (1) CN1210113C (en)
MY (1) MY136708A (en)
SG (1) SG78282A1 (en)
TW (1) TW480689B (en)
WO (1) WO1999030845A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110696241A (en) * 2018-07-10 2020-01-17 东和株式会社 Mold cleaning device and method, resin molding device, and method for manufacturing resin molded product

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JP4630442B2 (en) * 2000-10-19 2011-02-09 Ｔｏｗａ株式会社 Resin molding apparatus and resin molding method
JP3789349B2 (en) * 2001-11-16 2006-06-21 Ｔｏｗａ株式会社 Method and apparatus for cleaning mold for resin molding
TW552188B (en) * 2001-11-16 2003-09-11 Towa Corp Apparatus and method for evaluating degree of adhesion of adherents to mold surface, apparatus and method for surface treatment of mold surface and method and apparatus for cleaning mold used for molding resin
JP2004230750A (en) * 2003-01-31 2004-08-19 Sumitomo Heavy Ind Ltd Mold cleaning method and mold cleaning device
KR100626037B1 (en) 2004-11-18 2006-09-20 삼성에스디아이 주식회사 Mask cleaning method
JP2006317726A (en) * 2005-05-13 2006-11-24 Nec Lcd Technologies Ltd Disconnection correcting method, active matrix substrate manufacturing method, and display device
JP5314876B2 (en) * 2006-11-22 2013-10-16 アピックヤマダ株式会社 Resin molding apparatus and resin molding method
CN104043617A (en) * 2014-05-19 2014-09-17 南京南车浦镇城轨车辆有限责任公司 Laser cleaning equipment for oil stain on metallic surface
US11362473B2 (en) 2016-09-26 2022-06-14 Saint-Gobain Glass France Device and method for producing a patterned functional coating for a glass layer
GB201701607D0 (en) * 2017-01-31 2017-03-15 Advanced Laser Tech Ltd Scanning and cleaning of moulds
CN107377532A (en) * 2017-08-25 2017-11-24 济南高能清扬激光清洗有限公司 A kind of compound cleaning method of rubber mould
CN108816960B (en) * 2018-06-14 2020-06-26 爱阔特(上海)清洗设备制造有限公司 Semiconductor photoetching plate cleaning device
CN108807129B (en) * 2018-06-21 2020-09-01 北京蜃景光电科技有限公司 Coating chamber cleaning device and coating chamber cleaning method
CN108787631A (en) * 2018-07-09 2018-11-13 江苏峰钛激光科技有限公司 A kind of laser cleaning method of heavy corrosion layer
JP6930946B2 (en) * 2018-07-10 2021-09-01 Ｔｏｗａ株式会社 Mold cleaning equipment, mold cleaning method, resin molding equipment, and resin molded product manufacturing method
CN111375603A (en) * 2018-12-29 2020-07-07 膳魔师（江苏）家庭制品有限公司 A method and device for fading paint of a thermos cup
CN110303009B (en) 2019-06-26 2020-10-16 深圳市华星光电技术有限公司 Ultraviolet light cleaning device
KR102249069B1 (en) * 2020-01-14 2021-05-07 주식회사 아이엠티 Apparatus for cleaning of semiconductor mold
JP7614987B2 (en) * 2021-09-14 2025-01-16 株式会社東芝 Surface cleaning method and system

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DD242760A1 (en) * 1985-11-19 1987-02-11 Akad Wissenschaften Ddr METHOD FOR TESTING THE PURITY OF SUBSTRATE SURFACES AND CLEANING THE SAME
ES2019931B3 (en) * 1986-02-14 1991-07-16 Amoco Corp ULTRAVIOLET LASER TREATMENT OF MOLDED SURFACES.
DE3721940A1 (en) * 1987-07-02 1989-01-12 Ibm Deutschland REMOVAL OF PARTICLES FROM SURFACES OF SOLID BODY BY LASER Bombardment
JPH01122417A (en) * 1987-11-06 1989-05-15 Rohm Co Ltd Cleaning method for mold for synthetic resin molding
US5023424A (en) * 1990-01-22 1991-06-11 Tencor Instruments Shock wave particle removal method and apparatus
US5373140A (en) * 1993-03-16 1994-12-13 Vernay Laboratories, Inc. System for cleaning molding equipment using a laser
IT1282722B1 (en) * 1996-03-01 1998-03-31 Pirelli METHOD AND APPARATUS FOR THE CLEANING OF VULCANIZATION MOLDS OF ELASTOMERIC MATERIAL ARTICLES

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110696241A (en) * 2018-07-10 2020-01-17 东和株式会社 Mold cleaning device and method, resin molding device, and method for manufacturing resin molded product
CN110696241B (en) * 2018-07-10 2021-09-28 东和株式会社 Mold cleaning device and method, resin molding device, and method for manufacturing resin molded product

Also Published As

Publication number Publication date
EP1039977A4 (en) 2003-08-13
WO1999030845A1 (en) 1999-06-24
CN1210113C (en) 2005-07-13
EP1039977A1 (en) 2000-10-04
CN1282277A (en) 2001-01-31
TW480689B (en) 2002-03-21
JP2002508249A (en) 2002-03-19
SG78282A1 (en) 2001-02-20

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