MY138584A - Sputter target having modified surface texture - Google Patents

Sputter target having modified surface texture

Info

Publication number
MY138584A
MY138584A MYPI20043923A MY138584A MY 138584 A MY138584 A MY 138584A MY PI20043923 A MYPI20043923 A MY PI20043923A MY 138584 A MY138584 A MY 138584A
Authority
MY
Malaysia
Prior art keywords
sputter
sputter target
surface texture
modified surface
roughening
Prior art date
Application number
Inventor
Steven Roger Kennedy
Yuanda R Cheng
Philip D Corno
Francois Dary
Original Assignee
Heraeus Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heraeus Inc filed Critical Heraeus Inc
Publication of MY138584A publication Critical patent/MY138584A/en

Links

Landscapes

  • Physical Vapour Deposition (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)

Abstract

THE EFFECTS OF SPUTTER RE-DEPOSITION ARE REDUCED BY MACROSCOPICALLY ROUGHENING THE NON-SPUTTER AREAS (3, 4) OF THE SPUTTER TARGET. THE MACROSCOPIC ROUGHENING IS OBTAINED BY FORMING A MACROSCOPIC TROUGH PATTERN IN THE NON-SPUTTER AREAS (3, 4) OF THE SPUTTER TARGET. A VARIETY OF PATTERNS MAY BE USED FOR THE TROUGH PATTERN. IN ADDITION TO MACROSCOPICALLY ROUGHING THE NON-SPUTTER AREAS (3, 4) OF THE SPUTTER TARGET, MICROSCOPIC ROUGHENING OF THE TROUGH PATTERNS MAY BE PERFORMED USING CONVENTIONAL SHOT, BEAD OR GRIT BLASTING TECHNIQUES.
MYPI20043923 2003-10-06 2004-09-24 Sputter target having modified surface texture MY138584A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US50831703P 2003-10-06 2003-10-06

Publications (1)

Publication Number Publication Date
MY138584A true MY138584A (en) 2009-07-31

Family

ID=34549193

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20043923 MY138584A (en) 2003-10-06 2004-09-24 Sputter target having modified surface texture

Country Status (2)

Country Link
JP (1) JP2005113267A (en)
MY (1) MY138584A (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100654364B1 (en) 2005-07-01 2006-12-06 (주) 스필코리아 Surface treatment method and surface treatment apparatus of expanded polystyrene beads
JP5540948B2 (en) * 2010-07-07 2014-07-02 三菱マテリアル株式会社 Sputtering target
EP2699708B1 (en) 2011-04-21 2018-11-14 View, Inc. Lithium sputter target
CN109097746A (en) 2011-06-30 2018-12-28 唯景公司 sputtering target and sputtering method
JP6567048B2 (en) * 2014-06-27 2019-08-28 プランゼー コンポジット マテリアルズ ゲーエムベーハー Sputtering target
WO2017154888A1 (en) * 2016-03-09 2017-09-14 Ｊｘ金属株式会社 Sputtering target capable of stabilizing ignition
JP7769490B2 (en) * 2021-07-29 2025-11-13 田中貴金属工業株式会社 Sputtering target and method of manufacturing the same
CN115205929B (en) * 2022-06-23 2023-07-28 池州市安安新材科技有限公司 Authentication method and system for avoiding misoperation of workbench of electric spark cutting machine tool
JP7813262B2 (en) * 2023-06-01 2026-02-12 Ｊｘ金属株式会社 Sputtering targets for magnetic materials and sputtering target assemblies for magnetic materials
CN116619247A (en) * 2023-07-13 2023-08-22 宁波江丰电子材料股份有限公司 A kind of technological method for reducing the spalling of anti-sputtering object layer

Also Published As

Publication number Publication date
JP2005113267A (en) 2005-04-28

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