MY138636A - mask sheet for assembly of semiconductor device and assembling method of semiconductor device - Google Patents

mask sheet for assembly of semiconductor device and assembling method of semiconductor device

Info

Publication number
MY138636A
MY138636A MYPI20020965A MY138636A MY 138636 A MY138636 A MY 138636A MY PI20020965 A MYPI20020965 A MY PI20020965A MY 138636 A MY138636 A MY 138636A
Authority
MY
Malaysia
Prior art keywords
adhesive
mask sheet
semiconductor device
semiconductor devices
assembly
Prior art date
Application number
Inventor
Katsuji Nakaba
Yuichi Moriya
Toshihiro Nakajima
Original Assignee
Tomoegawa Paper Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26611699&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=MY138636(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from JP2001081098A external-priority patent/JP4002736B2/en
Priority claimed from JP2001146606A external-priority patent/JP4002739B2/en
Application filed by Tomoegawa Paper Co Ltd filed Critical Tomoegawa Paper Co Ltd
Publication of MY138636A publication Critical patent/MY138636A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/137—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being directly on the semiconductor body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)

Abstract

THE INVENTION PROVIDES A MASK SHEET WHICH CAN PREVENT OOZING OF A RESIN SEALANT AND ADHESIVE TRANSFER OF AN ADHESIVE UPON FABRICATION OF SEMICONDUCTOR DEVICES TO STABLY PRODUCE SEMICONDUCTOR PACKAGES SUCH AS QFNS. THE MASK SHEET (10) IS RELEASABLY STUCK TO A LEAD FRAME (20) AND COMPRISES A HEAT-RESISTANT FILM (11) HAVING A GLASS TRANSITION TEMPERATURE OF AT LEAST 150°C AND A COEFFICIENT OF THERMAL EXPANSION OF 10 TO 50 PPMJOC AT 150 TO 200°C AND AN ADHESIVE LAYER (12) FORMED OF A SILICONE ADHESIVE PROVIDED ON ONE SURFACE OF THE HEAT-RESISTANT FILM. THE ADHESIVE LAYER HAS A PERCENT LOSS ON WEIGHT OF AT MOST 5% WHEN HEATED AT 180°C FOR 1 HOUR. THE SILICONE ADHESIVE IS PREFERABLY AN ADHESIVE COMPRISING POLYDIMETHYLSILOXANE AS A MAIN COMPONENT OR AN ADHESIVE COMPRISING POLYALKYLALKENYLSILOXANE AND POLYALKY1HYDROGENSILOXANE AS MAIN COMPONENTS. WHEN THE MASK SHEET IS USED IN ASSEMBLY OF SEMICONDUCTOR DEVICES, THE MASK SHEET IS FIRST STUCK TO A LEAD FRAME AND RELEASED AFTER THE SEMICONDUCTOR DEVICES ARE FABRICATED.
MYPI20020965 2001-03-21 2002-03-19 mask sheet for assembly of semiconductor device and assembling method of semiconductor device MY138636A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001081098A JP4002736B2 (en) 2001-03-21 2001-03-21 Mask sheet for assembling semiconductor device and assembling method of semiconductor device
JP2001146606A JP4002739B2 (en) 2001-05-16 2001-05-16 Adhesive sheet for semiconductor device manufacturing

Publications (1)

Publication Number Publication Date
MY138636A true MY138636A (en) 2009-07-31

Family

ID=26611699

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20020965 MY138636A (en) 2001-03-21 2002-03-19 mask sheet for assembly of semiconductor device and assembling method of semiconductor device

Country Status (5)

Country Link
KR (1) KR100572191B1 (en)
CN (1) CN1280899C (en)
MY (1) MY138636A (en)
TW (1) TW540131B (en)
WO (1) WO2002075809A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100635053B1 (en) 2005-06-21 2006-10-16 도레이새한 주식회사 Adhesive tape for electronic parts
JP4881044B2 (en) * 2006-03-16 2012-02-22 株式会社東芝 Manufacturing method of stacked semiconductor device
KR100910672B1 (en) * 2007-08-03 2009-08-04 도레이새한 주식회사 Heat resistant adhesive sheet
CN101585666B (en) * 2009-06-22 2011-08-31 浙江新康药用玻璃有限公司 Inner surface coating technique of medicinal glass bottle
CN106816202B (en) * 2017-02-15 2018-12-04 山东圣泉新材料股份有限公司 A kind of graphene denatured conductive silver paste and preparation method thereof
KR102032767B1 (en) * 2017-05-12 2019-10-17 (주)인랩 QFN semiconductor package, method of fabricating the same and mask sheet for manufacturing the same
CN115491136A (en) * 2022-09-21 2022-12-20 江门市优彼思半导体材料有限公司 Mask belt and preparation method thereof

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4205260B2 (en) * 1999-07-12 2009-01-07 パナソニック株式会社 Manufacturing method of resin-encapsulated semiconductor device and intermediate of semiconductor device

Also Published As

Publication number Publication date
WO2002075809A1 (en) 2002-09-26
CN1498420A (en) 2004-05-19
KR20030093247A (en) 2003-12-06
KR100572191B1 (en) 2006-04-18
TW540131B (en) 2003-07-01
CN1280899C (en) 2006-10-18

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