MY140455A - Process for producing electronic components - Google Patents

Process for producing electronic components

Info

Publication number
MY140455A
MY140455A MYPI20031841A MYPI20031841A MY140455A MY 140455 A MY140455 A MY 140455A MY PI20031841 A MYPI20031841 A MY PI20031841A MY PI20031841 A MYPI20031841 A MY PI20031841A MY 140455 A MY140455 A MY 140455A
Authority
MY
Malaysia
Prior art keywords
electronic components
die
support
active
producing
Prior art date
Application number
MYPI20031841A
Inventor
Florian Bieck
Original Assignee
Schott Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schott Ag filed Critical Schott Ag
Publication of MY140455A publication Critical patent/MY140455A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/40—Optical elements or arrangements
    • H10F77/407—Optical elements or arrangements indirectly associated with the devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/42—Arrays of surface emitting lasers
    • H01S5/423—Arrays of surface emitting lasers having a vertical cavity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/04—Optical MEMS
    • B81B2201/047—Optical MEMS not provided for in B81B2201/042 - B81B2201/045
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Led Device Packages (AREA)
  • Wire Bonding (AREA)
  • Packaging Frangible Articles (AREA)
  • Micromachines (AREA)
  • Light Receiving Elements (AREA)

Abstract

TO ACHIEVE AN INTEGRATION OF FUNCTIONAL STRUCTURES INTO THE PACKAGING OF ELECTRONIC COMPONENTS (1), A PROCESS IS PROVIDED FOR PRODUCING AN ELECTRONIC COMPONENT (1) WHICH COMPRISES AT LEAST ON SEMICONDUCTOR ELEMENT (3) WHICH HAS AT LEAST ON SENSORILLY ACTIVE AND/OR EMITTING DEVICES (7) ON AT LEAST ON SIDE, THE PROCESS COMPRISING THE STEPS OF: -PROVIDING AT LEAST ON DIE ON A WATER (35), -PRODUCING AT LEAST ON STRUCTURED (11) SUPPORT WHICH HAS AT LEAST ONE FUNCTIONAL STRUCTURE FOR THE SENSORILY ACTIVE AND/OR EMITTING DEVICES (7), -JOINING THE WAFER (35) TOGETHER WITH THE AT LEAST ON SUPPORT (19), SO THAT THE SIDE OF THE DIE WHICH HAS THE SENORILY ACTIVE AND/OR EMITTING DEVICE (7) IS FACING THE SUPPORT, AND -SEPARATING THE DIE.
MYPI20031841A 2002-05-23 2003-05-19 Process for producing electronic components MY140455A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10222960A DE10222960A1 (en) 2002-05-23 2002-05-23 Making electronic component comprising semiconductor elements with device for sensing or emitting

Publications (1)

Publication Number Publication Date
MY140455A true MY140455A (en) 2009-12-31

Family

ID=29432251

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20031841A MY140455A (en) 2002-05-23 2003-05-19 Process for producing electronic components

Country Status (3)

Country Link
DE (1) DE10222960A1 (en)
MY (1) MY140455A (en)
TW (1) TWI230424B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1419530B1 (en) 2001-08-24 2007-08-08 Schott Ag Method for producing electronic components
DE102004049233A1 (en) 2004-10-09 2006-04-20 Schott Ag Process for the microstructuring of substrates made of flat glass
TWI463860B (en) * 2010-08-04 2014-12-01 Asia Tech Image Inc Fixing method of lens group

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4862231A (en) * 1983-11-18 1989-08-29 Harris Corporation Non-contact I/O signal transmission in integrated circuit packaging
US4875750A (en) * 1987-02-25 1989-10-24 Siemens Aktiengesellschaft Optoelectronic coupling element and method for its manufacture
GB9116307D0 (en) * 1991-07-29 1991-11-06 Philips Electronic Associated Infrared detectors
US5500540A (en) * 1994-04-15 1996-03-19 Photonics Research Incorporated Wafer scale optoelectronic package
DE19620940A1 (en) * 1995-11-17 1997-05-22 Werner Prof Dr Buff Electronic component for e.g. high frequency resonator based on surface acoustic wave

Also Published As

Publication number Publication date
DE10222960A1 (en) 2003-12-11
TWI230424B (en) 2005-04-01
TW200408016A (en) 2004-05-16

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