MY141236A - Silicone resin composition, curable resin composition, and cured resin - Google Patents
Silicone resin composition, curable resin composition, and cured resinInfo
- Publication number
- MY141236A MY141236A MYPI20071044A MY141236A MY 141236 A MY141236 A MY 141236A MY PI20071044 A MYPI20071044 A MY PI20071044A MY 141236 A MY141236 A MY 141236A
- Authority
- MY
- Malaysia
- Prior art keywords
- resin composition
- silicone resin
- cured
- silicone
- curable
- Prior art date
Links
- 239000011342 resin composition Substances 0.000 title abstract 4
- 229920005989 resin Polymers 0.000 title abstract 3
- 239000011347 resin Substances 0.000 title abstract 3
- 229920002050 silicone resin Polymers 0.000 title abstract 3
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 abstract 1
- 229910020485 SiO4/2 Inorganic materials 0.000 abstract 1
- 229910000410 antimony oxide Inorganic materials 0.000 abstract 1
- 239000003063 flame retardant Substances 0.000 abstract 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical class C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
- 239000011541 reaction mixture Substances 0.000 abstract 1
- 230000009257 reactivity Effects 0.000 abstract 1
Landscapes
- Silicon Polymers (AREA)
Abstract
A SILICONE RESIN COMPOSITION COMPRISING A MIXTURE OR A REACTION MIXTURE OF (A) A SILICONE RESIN HAVING A SOFTENING POINT ABOVE 25°C AND REPRESENTED BY THE FOLLOWING AVERAGE UNIT FORMULA: (R1SiO3/2)a (R22SiO2/2)b (R33SiO1/2)c (SiO4/2)d (XO1/2)e, AND (B) AN EPOXY-CONTAINING ALKOXYSILANE, IS CHARACTERIZED BY LOW MELT VISCOSITY, EXCELLENT REACTIVITY AND DISPERSIBILITY IN ORGANIC RESINS; TO PROVIDE A CURABLE RESIN COMPOSITION WHICH IS CAPABLE OF FORMING A CURED RESIN WITH EXCELLENT FLAME RETARDANT PROPERTIES AND IS FREE OF ANTIMONY OXIDES OR HALOGENATED EPOXY RESINS AND THEREFORE DOES NOT PRODUCE A HARMFUL INFLUENCE ON THE HUMAN BODY OR THE ENVIRONMENT.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| MYPI20071044 MY141236A (en) | 2007-06-29 | 2007-06-29 | Silicone resin composition, curable resin composition, and cured resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| MYPI20071044 MY141236A (en) | 2007-06-29 | 2007-06-29 | Silicone resin composition, curable resin composition, and cured resin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY141236A true MY141236A (en) | 2010-03-31 |
Family
ID=47320759
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI20071044 MY141236A (en) | 2007-06-29 | 2007-06-29 | Silicone resin composition, curable resin composition, and cured resin |
Country Status (1)
| Country | Link |
|---|---|
| MY (1) | MY141236A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107501942A (en) * | 2017-08-29 | 2017-12-22 | 北京康美特科技股份有限公司 | It can be molded organic siliconresin, composition and its semiconductor light-emitting elements of shaping |
-
2007
- 2007-06-29 MY MYPI20071044 patent/MY141236A/en unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107501942A (en) * | 2017-08-29 | 2017-12-22 | 北京康美特科技股份有限公司 | It can be molded organic siliconresin, composition and its semiconductor light-emitting elements of shaping |
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