MY141502A - Latent catalysts, cure-inhibited epoxy resin compositions and laminates prepared therefrom - Google Patents

Latent catalysts, cure-inhibited epoxy resin compositions and laminates prepared therefrom

Info

Publication number
MY141502A
MY141502A MYPI91000833A MYPI9100833A MY141502A MY 141502 A MY141502 A MY 141502A MY PI91000833 A MYPI91000833 A MY PI91000833A MY PI9100833 A MYPI9100833 A MY PI9100833A MY 141502 A MY141502 A MY 141502A
Authority
MY
Malaysia
Prior art keywords
acid
polyepoxide
boric acid
mixture
catalyst
Prior art date
Application number
MYPI91000833A
Inventor
James L Bertram
Charlie Z Hotz
Louis L Walker
Joseph Gan
Original Assignee
Dow Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US07/526,488 external-priority patent/US5169473A/en
Application filed by Dow Chemical Co filed Critical Dow Chemical Co
Publication of MY141502A publication Critical patent/MY141502A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/203—Electrical connections
    • H10W44/206—Wires

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
  • Paints Or Removers (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Professional, Industrial, Or Sporting Protective Garments (AREA)
  • Wrappers (AREA)
  • Retarders (AREA)

Abstract

IN SUMMARY, THE INVENTION IS RELATED TO THE DISCOVERY OF A CLASS OF COMPOUNDS WHICH COMPRISES BORIC ACID OR MALEIC ACID OR A MIXTURE OF BORIC ACID WITH AT LEAST ONE ACID HAVING A WEAK NUCLEOPHILIC ANION, WHICH INHIBITS THE REACTION OF A POLYEPOXIDE WITH A CURING AGENT AT LOW TEMPERATURES. IN ANOTHER EMBODIMENT THE INVENTION IS A LATENT CATALYST SYSTEM ADAPTED FOR CURING A POLYEPOXIDE RESULTING FROM CONTACTING I) A CATALYST FOR THE CURE OF A POLYEPOXIDE COMPOUND COMPRISING AN AMINE, HETEROCYCLIC NITROGEN PHOSPHINE, SULFIDE, PHOSPHINE, SULFIDE, AMMONIUM, PHOSPHONIUM, SULFONIUM, ARSONIUM, CONTAINING COMPOUND OR A MIXTURE THEREOF; WITH II) BORIC ACID, OR A MIXTURE OF BORIC ACID WITH AT LEAST AN ACID HAVING A WEAK NUCLEOPHILIC ANION. FURTHER THE INVENTION RELATES TO EPOXY RESIN COMPOSITIONS CONTAINING THE INHIBITOR OR LATENT CATALYTIC COMPOSITION. IN STILL ANOTHER EMBODIMENT THE INVENTION RELATES TO A COMPOSITION USEFUL FOR CURING A POLYEPOXIDE WHICH CONTAINS: A) AN INHIBITING AMOUNT OF BORIC ACID OR MALEIC ACID OR A MIXTURE OF BORIC ACID WITH AT LEAST ONE ACID HAVING A WEAK NUCLEOPHILIC ANION; AND OPTIONALLY B) A CATALYTIC AMOUNT OF A CATALYST USEFUL FOR ACCELERATING THE REACTION OF A POLYEPOXIDE WITH THE CURING AGENT, WHEREIN THE INHIBITOR AND CATALYST MAY BE PRESENT IN COMPLEX FORM.
MYPI91000833A 1990-05-21 1991-05-17 Latent catalysts, cure-inhibited epoxy resin compositions and laminates prepared therefrom MY141502A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US52648790A 1990-05-21 1990-05-21
US07/526,488 US5169473A (en) 1990-05-21 1990-05-21 Latent catalysts, epoxy compositions incorporating same, and coating, impregnating and bonding methods employing the compositions

Publications (1)

Publication Number Publication Date
MY141502A true MY141502A (en) 2010-05-14

Family

ID=27062123

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI91000833A MY141502A (en) 1990-05-21 1991-05-17 Latent catalysts, cure-inhibited epoxy resin compositions and laminates prepared therefrom

Country Status (15)

Country Link
EP (1) EP0458502B1 (en)
JP (5) JP3080245B2 (en)
KR (1) KR100229301B1 (en)
CN (3) CN1035823C (en)
AT (1) ATE243227T1 (en)
AU (1) AU657264B2 (en)
BR (1) BR9102108A (en)
CA (1) CA2042858A1 (en)
DE (1) DE69133280T2 (en)
FI (1) FI912435A7 (en)
IL (1) IL98185A (en)
MY (1) MY141502A (en)
NO (1) NO911933L (en)
PT (1) PT97724A (en)
SG (1) SG43193A1 (en)

Families Citing this family (71)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4981926A (en) * 1990-02-06 1991-01-01 The Dow Chemical Company Composition of epoxy resin, amino group-containing phosphonium catalyst and curing agent
GB9103402D0 (en) * 1991-02-19 1991-04-03 Pilkington Plc Fire resistance
GB9208955D0 (en) * 1992-04-24 1992-06-10 Dow Europ Sa Dicyandiamide solution
US5407977A (en) * 1993-04-20 1995-04-18 The Dow Chemical Company Solvent system
US5464910A (en) * 1993-12-22 1995-11-07 Shikoku Chemicals Corporation Epoxy resin adduct combined with a borate ester and phenolic compound
GB9421407D0 (en) * 1994-10-21 1994-12-07 Dow Chemical Co Curable epoxy resin accelerated by boric acid and its analogs
GB9421405D0 (en) * 1994-10-21 1994-12-07 Dow Chemical Co Low voc laminating formulations
US5508328A (en) * 1994-11-17 1996-04-16 Alliedsignal Inc. Curing epoxy resins using dicy, imidazole and acid
US6613839B1 (en) 1997-01-21 2003-09-02 The Dow Chemical Company Polyepoxide, catalyst/cure inhibitor complex and anhydride
WO1998031750A1 (en) † 1997-01-21 1998-07-23 The Dow Chemical Company Latent catalysts for epoxy curing systems
US6353080B1 (en) 1997-06-26 2002-03-05 The Dow Chemical Company Flame retardant epoxy resin composition
GB9817799D0 (en) * 1998-08-14 1998-10-14 Dow Deutschland Inc Viscosity modifier for thermosetting resin compositioning
WO2001042253A2 (en) 1999-12-13 2001-06-14 The Dow Chemical Company Phosphorus element-containing crosslinking agents and flame retardant phosphorus element-containing epoxy resin compositions prepared therewith
CN1423678B (en) 1999-12-13 2010-11-10 陶氏环球技术公司 Phosphorous element flame retardant epoxy resin composition
KR100419063B1 (en) * 2000-06-10 2004-02-14 주식회사 엘지화학 Epoxy resin composition and laminate using the same
JP4534344B2 (en) * 2000-11-27 2010-09-01 住友ベークライト株式会社 Flame retardant resin composition, prepreg and laminate using the same
KR100854544B1 (en) * 2001-09-12 2008-08-26 다우 글로벌 테크놀로지스 인크. Networked polymers comprising epoxy-terminated esters
EP1391490A1 (en) * 2002-08-23 2004-02-25 Vantico Gmbh Modified epoxy resins for triboelectric coating processes
ATE346877T1 (en) * 2003-04-16 2006-12-15 Huntsman Adv Mat Switzerland CURING ACCELERATOR FOR LOW TEMPERATURE CURING EPOXY RESIN COMPOSITIONS
JP4895487B2 (en) * 2003-08-05 2012-03-14 一般財団法人川村理化学研究所 Thermosetting resin composition, method for producing the same, and method for producing molded product
US20060247334A1 (en) * 2003-08-05 2006-11-02 Akira Ohbayashi Epoxy resin composition and method for producing heat-resistant laminate sheet
JP4558359B2 (en) * 2004-03-22 2010-10-06 財団法人川村理化学研究所 Epoxy resin composition and copper-clad laminate using the same
EP1753772B1 (en) 2004-05-28 2016-12-28 Blue Cube IP LLC Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers
WO2006109744A1 (en) 2005-04-07 2006-10-19 Asahi Kasei Chemicals Corporation Epoxy resin composition
DE102005029146A1 (en) * 2005-06-23 2006-12-28 Cognis Ip Management Gmbh Hardeners for water based floor coating composition is obtained by reacting an epoxy intermediate with a polyamine to form intermediate, while allowing primary amino groups to react off; and reacting intermediate with specific Lewis acid
EP1754733A1 (en) * 2005-07-26 2007-02-21 Huntsman Advanced Materials (Switzerland) GmbH Composition
US7998653B2 (en) 2005-09-15 2011-08-16 Ciba Corp. Coating compositions comprising a latent activator for marking substrates
WO2007037024A1 (en) * 2005-09-27 2007-04-05 Sumitomo Bakelite Co., Ltd. Process for producing latent catalyst and epoxy resin composition
KR20080077639A (en) * 2005-12-22 2008-08-25 다우 글로벌 테크놀로지스 인크. Curable epoxy resin composition and laminates prepared therefrom
JP5114111B2 (en) * 2006-09-07 2013-01-09 日東シンコー株式会社 Resin composition, heat conductive sheet, high heat conductive adhesive sheet with metal foil, and high heat conductive adhesive sheet with metal plate
JP5114112B2 (en) * 2006-09-07 2013-01-09 日東シンコー株式会社 Resin composition, heat conductive sheet, high heat conductive adhesive sheet with metal foil, and high heat conductive adhesive sheet with metal plate
MY146613A (en) 2007-06-11 2012-09-14 Basf Se Catalyst for curing epoxides
CN101679607B (en) 2007-06-12 2012-05-30 巴斯夫欧洲公司 Catalyst for curing epoxides
ES2354399T3 (en) 2007-06-13 2011-03-14 Basf Se CATALYST FOR THE ENDURING OF Epoxides.
CN101687977B (en) * 2007-06-14 2012-08-15 巴斯夫欧洲公司 Catalyst for curing epoxides
JP5581208B2 (en) 2007-07-18 2014-08-27 データレース リミテッド Laser sensitive coating formulation
EP2174969A4 (en) * 2007-07-26 2012-07-25 Ajinomoto Kk Resin composition
US20110136993A1 (en) 2008-08-28 2011-06-09 Dow Global Technologies Llc Phosphorus-containing compounds and polymeric compositions comprising same
KR101782567B1 (en) 2008-10-23 2017-09-27 데이터레이즈 리미티드 Heat absorbing additives
US9267042B2 (en) 2008-10-27 2016-02-23 Datalase Ltd. Coating composition for marking substrates
KR20110139271A (en) * 2009-03-17 2011-12-28 다우 글로벌 테크놀로지스 엘엘씨 Curable compositions containing cyclic diamines and cured products therefrom
DE102009027826A1 (en) 2009-04-29 2010-11-04 Evonik Degussa Gmbh Catalysis of Epoxy Formulations
KR100925986B1 (en) 2009-06-20 2009-11-10 정송옥 The manufacturing method of latent medium temperature fast curing type epoxy resin composition for water and sewage old pipe regeneration.
US8871892B2 (en) * 2009-11-12 2014-10-28 Dow Global Technologies Llc Polyoxazolidone resins
CN101728038A (en) * 2009-12-04 2010-06-09 上海长园维安电子线路保护股份有限公司 Method for manufacturing thermosetting positive temperature coefficient thermistor and conductive adhesive therewith
EP2452978A1 (en) 2010-11-16 2012-05-16 Basf Se Method for producing epoxy resin moulded substances filled with carbon fillers
US9499653B2 (en) * 2011-02-23 2016-11-22 Alzchem Ag Curing agents for epoxy resins
WO2012136273A1 (en) 2011-04-08 2012-10-11 Basf Se Hyperbranched polymers for modifying the toughness of anionically cured epoxy resin systems
CN102443168B (en) * 2011-10-10 2016-03-09 苏州科技学院 A kind of porous solid amine and preparation method thereof
WO2013188071A1 (en) * 2012-06-15 2013-12-19 Dow Global Technologies Llc Latent catalyst for curable compositions
DK2695903T3 (en) * 2012-08-08 2019-01-14 Siemens Ag Process for modifying the rate of temperature change of an epoxy resin composition in a resin container in a casting process
RU2015120176A (en) * 2012-12-11 2017-01-19 Клариент Дайагностик Сервисез, Инк. Photoactivated chemical dye discoloration
JP5758463B2 (en) * 2013-03-26 2015-08-05 太陽インキ製造株式会社 Epoxy resin composition, hole filling composition, and printed wiring board using the same
KR101885703B1 (en) * 2013-05-14 2018-08-06 쓰리엠 이노베이티브 프로퍼티즈 컴파니 Epoxy resins comprising a pyrazine-containing compound
DE102013008723A1 (en) 2013-05-23 2014-11-27 Deutsche Institute Für Textil- Und Faserforschung Denkendorf Polymerizable reaction mixture for the production of epoxy resins and their use
US10253136B2 (en) 2014-02-06 2019-04-09 Adeka Corporation Compound and epoxy resin composition containing same
JP6240940B2 (en) * 2014-02-06 2017-12-06 株式会社Adeka Epoxy resin composition
EP3137560B1 (en) * 2014-04-29 2020-06-03 Akzo Nobel Coatings International B.V. Coating method for surfaces in chemical installations
US10556985B2 (en) * 2015-11-17 2020-02-11 Evonik Operations Gmbh Nitrogen-containing heterocyclic epoxy curing agents, compositions and methods
US10465039B2 (en) 2015-11-17 2019-11-05 Evonik Degussa Gmbh Epoxy curing agents, compositions and uses thereof
CN107446535A (en) * 2017-08-16 2017-12-08 浙江林境新材料科技有限公司 A kind of composite plate
CN108565041B (en) * 2018-04-20 2020-04-28 四川省银河化学股份有限公司 High-conductivity soldering-resistant low-temperature silver paste and preparation method thereof
EP3569629B1 (en) * 2018-05-17 2022-07-06 Evonik Operations GmbH Fast curing epoxy systems
WO2020050200A1 (en) 2018-09-05 2020-03-12 三菱ケミカル株式会社 Sheet molding compound and fiber-reinforced composite material
JP7261563B2 (en) * 2018-11-02 2023-04-20 谷川油化興業株式会社 heat exchange medium
KR102161362B1 (en) * 2018-12-24 2020-10-05 주식회사 하이플럭스 Fireproof and fire-retardant composition
DE102019121195A1 (en) * 2019-08-06 2021-02-11 Alzchem Trostberg Gmbh Storage-stable epoxy resin composition
CN111892695B (en) * 2020-07-13 2022-12-30 四川省玻纤集团有限公司 Gamma irradiation resistant modified resin and preparation method thereof, laminated board and preparation process and application thereof
KR102906330B1 (en) * 2023-01-12 2025-12-30 도레이첨단소재 주식회사 Epoxy resin composition with improved tensile elongation and reinforced fiber composite materials manufactured therefrom
CN117124521B (en) * 2023-07-25 2026-02-03 中国工程物理研究院化工材料研究所 Method for regulating dynamic performance of hot-press molding epoxy vitrimer composite material through V-shaped oriented filler content
CN118421192B (en) * 2024-07-04 2024-08-30 湖南飘峰电气股份有限公司 Fireproof high-temperature-resistant polyimide electromagnetic wire and preparation method thereof

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4001156A (en) * 1972-08-03 1977-01-04 Ppg Industries, Inc. Method of producing epoxy group-containing, quaternary ammonium salt-containing resins
US4594291A (en) * 1984-07-17 1986-06-10 The Dow Chemical Company Curable, partially advanced epoxy resins
IL75806A (en) * 1984-07-17 1988-10-31 Dow Chemical Co Partially advanced epoxy resin compositions and products resulting from reacting and curing said compositions
US4668758A (en) * 1985-09-30 1987-05-26 Shell Oil Company Cure rate control in epoxy resin compositions

Also Published As

Publication number Publication date
SG43193A1 (en) 1997-10-17
JP2000309626A (en) 2000-11-07
EP0458502A2 (en) 1991-11-27
CN1050617C (en) 2000-03-22
KR100229301B1 (en) 1999-11-01
AU657264B2 (en) 1995-03-09
CN1118794A (en) 1996-03-20
IL98185A (en) 1994-06-24
JP2000136288A (en) 2000-05-16
CN1050618C (en) 2000-03-22
JP3269621B2 (en) 2002-03-25
IL98185A0 (en) 1992-06-21
ATE243227T1 (en) 2003-07-15
JP3080245B2 (en) 2000-08-21
EP0458502B1 (en) 2003-06-18
CN1118793A (en) 1996-03-20
NO911933D0 (en) 1991-05-16
CN1035823C (en) 1997-09-10
PT97724A (en) 1992-03-31
DE69133280D1 (en) 2003-07-24
JP2002178342A (en) 2002-06-26
BR9102108A (en) 1991-12-24
DE69133280T2 (en) 2004-05-06
JPH11310627A (en) 1999-11-09
AU7721191A (en) 1991-11-21
JP3321429B2 (en) 2002-09-03
EP0458502A3 (en) 1992-12-02
CN1056699A (en) 1991-12-04
FI912435A7 (en) 1991-11-22
KR910020060A (en) 1991-12-19
JP3383658B2 (en) 2003-03-04
CA2042858A1 (en) 1991-11-22
JP3333762B2 (en) 2002-10-15
NO911933L (en) 1991-11-22
JPH04227924A (en) 1992-08-18
FI912435A0 (en) 1991-05-20

Similar Documents

Publication Publication Date Title
MY141502A (en) Latent catalysts, cure-inhibited epoxy resin compositions and laminates prepared therefrom
ES2074991T3 (en) RESIN COMPOSITION FOR COATING.
MY114313A (en) Halogen-free flame-retardant epoxy resin composition as well as prepreg and laminate containing the same
KR850003154A (en) Fire Insurance, Inflatable Mastic Composition
ES480574A1 (en) PROCEDURE FOR PREPARING A COMPLEX CATALYTIC COMPOSITION CONTAINING A RESIN, A TRANSITIONAL METAL AND AN ORGANIC LINK COMPOUND.
TW364006B (en) Tackified substrates for resin transfer molding and methods to use thereof, tackifier formulations and matrix resin formulations
ES8702941A1 (en) A PROCEDURE FOR PREPARING AN ADDICT FROM AN EPHROXIDIC RESIN, A POLYHYDROXYLATED PHENOL AND A HYDROXYAMINE COMPOUND.
EP0075827A3 (en) Polyepoxide curing by polymercaptans plus catalytic co-curing agents
GB1260642A (en) The use of quaternary ammonium and phosphonium thiocyanates as accelerators for the curing of epoxy resins
ES8800321A1 (en) Additive for heated bitumen.
AU682006B2 (en) Method and composition for using substituted melamines as novolak resin curing agents
MY129866A (en) Catalyst and epoxy resin composition containing the same.
MY130069A (en) Precatalysed catalyst compositions, process for preparing epoxy resins, curable compositions,articles resulting from curing the resultant compositions
ES8301256A1 (en) "A PROCEDURE FOR PREPARING A COATING COMPOSITION THAT HAS A DOUBLE CURING MECHANISM."
DE3563749D1 (en) Heat-curable epoxy resin compositions
EP0328411A3 (en) Composition for vibration damper, process for manufacture thereof, and vibration damper
JPS571441A (en) Deodorizing agent
BR9811165A (en) Processes for the production of compounds and epoxy compounds, and epoxy resin obtainable by the same
ES2118074T3 (en) CATALYTIC PROCEDURE FOR THE PREPARATION OF COMPOUNDS CONTAINING NITROGEN BRIDGES.
JPS5454199A (en) Epoxy resin composition
JPS54160496A (en) Curable composition
ES8302005A1 (en) Procedure for preparing cephalosporanic compounds (Machine-translation by Google Translate, not legally binding)
DE59813301D1 (en) EPOXY RESIN MIXTURE, COMPOSITE MATERIALS DERIVED FROM THEREOF AND THEIR USE
DE3381765D1 (en) CURABLE EPOXY RESIN MIXTURES.
ATE149553T1 (en) BINDER FOR STORAGE COATING COMPOUNDS