MY142899A - Method for producing plated molded product - Google Patents

Method for producing plated molded product

Info

Publication number
MY142899A
MY142899A MYPI20020502A MYPI20020502A MY142899A MY 142899 A MY142899 A MY 142899A MY PI20020502 A MYPI20020502 A MY PI20020502A MY PI20020502 A MYPI20020502 A MY PI20020502A MY 142899 A MY142899 A MY 142899A
Authority
MY
Malaysia
Prior art keywords
molded product
plating
layer
forming
electroplating
Prior art date
Application number
MYPI20020502A
Other languages
English (en)
Inventor
Ichiro Hayashi
Kazuhiro Miyokai
Original Assignee
Taiyo Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2001041029A external-priority patent/JP3685999B2/ja
Priority claimed from JP2001192023A external-priority patent/JP3722724B2/ja
Priority claimed from JP2001322754A external-priority patent/JP3710408B2/ja
Application filed by Taiyo Mfg Co Ltd filed Critical Taiyo Mfg Co Ltd
Publication of MY142899A publication Critical patent/MY142899A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/04—Electroplating: Baths therefor from solutions of chromium
    • C25D3/06—Electroplating: Baths therefor from solutions of chromium from solutions of trivalent chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C25D5/14—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)
MYPI20020502A 2001-02-16 2002-02-14 Method for producing plated molded product MY142899A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001041029A JP3685999B2 (ja) 2001-02-16 2001-02-16 メッキ成形品の製造方法
JP2001192023A JP3722724B2 (ja) 2001-06-25 2001-06-25 メッキ成形品の製造方法
JP2001322754A JP3710408B2 (ja) 2001-10-19 2001-10-19 メッキ成形品の製造方法

Publications (1)

Publication Number Publication Date
MY142899A true MY142899A (en) 2011-01-31

Family

ID=27346013

Family Applications (2)

Application Number Title Priority Date Filing Date
MYPI20020502A MY142899A (en) 2001-02-16 2002-02-14 Method for producing plated molded product
MYPI20080007A MY148983A (en) 2001-02-16 2002-02-14 Method for producing plated molded product

Family Applications After (1)

Application Number Title Priority Date Filing Date
MYPI20080007A MY148983A (en) 2001-02-16 2002-02-14 Method for producing plated molded product

Country Status (5)

Country Link
EP (1) EP1360347A2 (fr)
CN (1) CN100360716C (fr)
MY (2) MY142899A (fr)
TW (1) TW554086B (fr)
WO (1) WO2002064862A2 (fr)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004256876A (ja) * 2003-02-26 2004-09-16 Taiyo Manufacturing Co Ltd メッキ成形品の製造方法
JP2004327306A (ja) * 2003-04-25 2004-11-18 Sunarrow Ltd モバイル機器用の多色樹脂成形部品
CN100431080C (zh) * 2005-04-29 2008-11-05 乐金电子（昆山）电脑有限公司 按钮组件
EP1876268B1 (fr) * 2006-06-13 2013-05-15 Wolf-Dieter Franz Procédé pour le dépot de chromium noir exempt de Cr-VI
KR101136180B1 (ko) * 2006-06-14 2012-04-17 엘지전자 주식회사 정전기 방지 부품 및 그 제작방법
CN101210334B (zh) * 2006-12-29 2010-04-21 佛山市顺德区汉达精密电子科技有限公司 塑料表面处理工艺
CN101246989A (zh) * 2007-02-15 2008-08-20 上海安费诺永亿通讯电子有限公司 一种天线的制造方法以及天线结构
US8763173B2 (en) * 2008-09-26 2014-07-01 Kohler Co. Stainless steel plumbing fixtures with resistant coatings
US20120156443A1 (en) * 2010-12-15 2012-06-21 David Reeder Methods of multi-shot injection molding and metal-plated surface coated polymeric articles made therefrom
US9062386B2 (en) 2011-03-01 2015-06-23 Srg Global, Inc. Methods of multi-shot injection molding and metal-plated polymeric articles made therefrom
FR2985741B1 (fr) 2012-01-12 2015-05-29 Albea Services Produit plastique metallise or ou argent exempt d'element or et argent et procede pour sa fabrication.
CN104073846B (zh) * 2014-06-25 2016-05-18 陕西华夏粉末冶金有限责任公司 一种树脂电镀、气氛还原的铜镍合金薄板零件制备方法
CN104626448A (zh) * 2015-01-15 2015-05-20 温兵 一种壳体的制造工艺
DE102015109506B4 (de) * 2015-06-15 2018-12-20 Dr. Schneider Kunststoffwerke Gmbh Verfahren zur selektiven Metallisierung von Kunststoffteilen und Bauteil
CN108683762B (zh) * 2018-05-22 2021-07-06 Oppo广东移动通信有限公司 装饰圈、功能组件、电子装置及装饰圈的加工方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL111001C (fr) * 1957-12-03
DE2113244C3 (de) * 1970-03-16 1984-05-17 Photocircuits Division of Kollmorgen Corp., Glen Cove, N.Y. Verfahren zum direkten Metallisieren freiliegender Flächen auf einem eine Epoxydharzoberfläche aufweisenden, isolierenden Material
US3655433A (en) * 1970-07-06 1972-04-11 Standard Oil Co Platable polymers
US3689303A (en) * 1970-12-21 1972-09-05 Crown City Plating Co Process for electroless plating of abs resins
US4002595A (en) * 1973-12-27 1977-01-11 E. I. Du Pont De Nemours And Company Electroplatable polypropylene compositions
US4038042A (en) * 1975-12-18 1977-07-26 E. I. Du Pont De Nemours And Company Electroplating of polypropylene compositions
US4199491A (en) * 1977-12-23 1980-04-22 Idemitsu Kosan Company Limited Polyolefin resin composition
GB2109816B (en) * 1981-11-18 1985-01-23 Ibm Electrodeposition of chromium
US4466865A (en) * 1982-01-11 1984-08-21 Omi International Corporation Trivalent chromium electroplating process
EP0102133A3 (fr) * 1982-03-26 1985-04-10 General Electric Company Article métallisé composé de résine polyphénylèneéther, de polystyrène à haut impact, d'alumine et, éventuellement, d'un copolymère styrène-butadiène "teleblock" radial
US4395313A (en) * 1982-07-29 1983-07-26 General Motors Corporation Vacuum pretreatment process for durable electroplated coatings on ABS and PPO plastics
FR2544341A1 (fr) * 1983-04-15 1984-10-19 Rhone Poulenc Rech Procede de metallisation de films souples electriquement isolants et articles obtenus
US4673469A (en) * 1984-06-08 1987-06-16 Mcgean-Rohco, Inc. Method of plating plastics
JPS60155257A (ja) * 1984-09-14 1985-08-15 住友ノ−ガタツク株式会社 メツキ製品
US4604168A (en) * 1984-12-20 1986-08-05 General Motors Corporation Pretreatment for electroplating mineral-filled nylon
US5510195A (en) * 1991-03-01 1996-04-23 Nikko Kogyo Kabushiki Kaisha Resin membrane having metallic layer and method of producing the same
CA2051604A1 (fr) * 1991-09-17 1993-03-18 Guy St-Amant Feuillards metalliques supportes sur plastique obtenu par metallisation-placage
WO1998047328A1 (fr) * 1997-04-15 1998-10-22 Ibiden Co., Ltd. Adhesif utile pour effectuer le depot autocatalytique, composition de matiere brute utile pour preparer l'adhesif pour depot autocatalytique et carte imprimee
JP3785548B2 (ja) 1998-06-01 2006-06-14 ユケン工業株式会社 ６価クロム・フッ素フリー化成処理剤
DE19904217A1 (de) * 1999-02-03 2000-08-10 Bayer Ag Galvanisierbares Formteil

Also Published As

Publication number Publication date
EP1360347A2 (fr) 2003-11-12
WO2002064862A3 (fr) 2003-08-28
MY148983A (en) 2013-06-28
CN100360716C (zh) 2008-01-09
WO2002064862A2 (fr) 2002-08-22
TW554086B (en) 2003-09-21
CN1527892A (zh) 2004-09-08

Similar Documents

Publication Publication Date Title
MY148983A (en) Method for producing plated molded product
CN105345985A (zh) 一种具有三维金属纹理的塑料壳件及其制造方法
WO2001092596A3 (fr) Procede de fabrication de pieces tridimensionnelles metallisees de maniere selective et piece tridimensionnelle metallisee de maniere selective
EP1311010A4 (fr) Plaque d'acier a traitement de surface pour boitier de batterie et etui de batterie
SG11201909369RA (en) Electroless plating process
KR20150087225A (ko) 다중 금속 층들을 갖는 피가공재 제조 방법
JP3685999B2 (ja) メッキ成形品の製造方法
TW200500505A (en) Method for producing plated molded products
WO2003023087A1 (fr) Moulage de resine deposee et procede de production correspondant
MY134571A (en) Metal mold for forming, method for the preparation of the metal mold for forming and molded article obtained on forming by the metal mold for forming
US20100039745A1 (en) Method of antistatic deposition on components of mobile phone
CN201270846Y (zh) 锌合金压铸拉链的改进结构
CN210416450U (zh) 一种二次注塑的字标装饰件
CN201136321Y (zh) 复合塑料结构件
EP1617428A4 (fr) Matrice de pressage et son procede de production
KR101010943B1 (ko) 레이저 각인을 이용한 문자 패드 도금 방법
KR101151590B1 (ko) 전주도금을 이용한 금형 제조방법
CN223467100U (zh) 一种车标
JP2015172221A (ja) めっき加工された樹脂成形品および製造方法
CN207415856U (zh) 具有挡电部件的塑胶件以及模具
CN85100323A (zh) 生产电铸零件的模具制造法
TW200709494A (en) In-mold antenna and method for manufacturing the same
CN214491896U (zh) 一种采用金铜合金的镀层结构
KR101090724B1 (ko) 메탈리제이션을 이용하여 안테나 패턴을 구현하는 내장형 안테나의 제조방법
Miller In-Mold Plating Research by Battelle Continues