MY143145A - Semiconductor package singulating system and method - Google Patents

Semiconductor package singulating system and method

Info

Publication number
MY143145A
MY143145A MYPI20042234A MYPI20042234A MY143145A MY 143145 A MY143145 A MY 143145A MY PI20042234 A MYPI20042234 A MY PI20042234A MY PI20042234 A MYPI20042234 A MY PI20042234A MY 143145 A MY143145 A MY 143145A
Authority
MY
Malaysia
Prior art keywords
substrate
saw
vacuum
jig
chips
Prior art date
Application number
MYPI20042234A
Inventor
Liu Fulin
Lim Kok Yeow Eddy
Chew Hwee Seng Jimmy
Original Assignee
Advanced Systems Automation Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Systems Automation Ltd filed Critical Advanced Systems Automation Ltd
Publication of MY143145A publication Critical patent/MY143145A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices

Landscapes

  • Dicing (AREA)

Abstract

INTEGRATED CIRCUIT (IC) CHIPS ARE FABRICATED WITH MULTIPLE IC CHIPS BEING TYPICALLY ARRANGED ON A SINGLE SUBSTRATE WHICH IS SINGULATED TO OBTAIN INDIVIDUALLY SEPARATED PACKAGES OF IC CHIPS THEREFROM. GENERALLY, THE PACKAGES FORMING THE SUBSTRATE ARE SEPARATED USING A SAW, A DICING SAW OR THE LIKE CUTTING DEVICES. THE SUBSTRATES IS OFTEN SUPPORTED ON A RUBBER PAD WHICH INTERFACES THE SUBSTRATE AND A SAW JIG OR THE LIKE SUPPORT. AIR IS THE EXTRACTED THROUGH A PLURALITY OF HOLES FORMED IN THE RUBBER PAD FOR CREATING A VACUUM THERETHROUGH. THE VACUUM SECURES THE SUBSTRATES TO THE SAW JIG BOTH BEFORE AND AFTER THE PACKAGES ARE SEPARATED AND DURING THE SAWING THEREOF. IN ADDITION TO THE USE OF VACUUM,TYPICAL METHODS AND SYSTEMS USE ADHESIVE PADS FOR FURTHER SECURING THE SUBSTRATE. HOWEVER, THESE CONVENTIONAL METHODS AND SYSTEMS SUFFER FROM THE NEED FOR AN ADDITIONAL STEP OF SUBSTRATE REMOVAL.AN EMBODIMENT OF THE INVENTION DISCLOSES A SAW JIG FOR SUPPORTING A SUBSTRATE ON A COMPRESSIBLE SUPPORT PAD. A CLAMP IS MOUNTABLE ONTO THE SAW JIG FOR CLAMPING THE SUBSTRATE THEREBETWEEN WITHOUT IMPEDING ACCESS OF A SAW BLADE TO THE SUBSTRATE. VACUUM THROUGH CHANNELS FORMED IN THE SUPPORT PAD AND SAW JIG GENERATES SUCTION FORCES FOR POSITIONALLY IMMOBILISING THE SUBSTRATE IN COMBINATION WITH THE CLAMPING FORCES OF THE CLAMP DURING SINGULATION OF THE SUBSTRATE BY THE SAW BLADE.
MYPI20042234A 2004-03-12 2004-06-10 Semiconductor package singulating system and method MY143145A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200401337-1A SG145540A1 (en) 2004-03-12 2004-03-12 Semiconductor package singulating system and method

Publications (1)

Publication Number Publication Date
MY143145A true MY143145A (en) 2011-03-15

Family

ID=34957445

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20042234A MY143145A (en) 2004-03-12 2004-06-10 Semiconductor package singulating system and method

Country Status (5)

Country Link
KR (1) KR100693334B1 (en)
MY (1) MY143145A (en)
SG (1) SG145540A1 (en)
TW (1) TWI250621B (en)
WO (1) WO2005087471A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI410329B (en) * 2009-03-09 2013-10-01 財團法人工業技術研究院 Removal device of flexible device and removal method thereof
CN102658394B (en) * 2012-04-25 2014-03-26 深南电路有限公司 Method and device for profile forming of packaging substrate
CN102903679B (en) * 2012-11-09 2014-11-05 日月光半导体制造股份有限公司 Cutting fixture
US9618653B2 (en) 2013-03-29 2017-04-11 Stmicroelectronics Pte Ltd. Microelectronic environmental sensing module
US9082681B2 (en) 2013-03-29 2015-07-14 Stmicroelectronics Pte Ltd. Adhesive bonding technique for use with capacitive micro-sensors
US10429330B2 (en) 2016-07-18 2019-10-01 Stmicroelectronics Pte Ltd Gas analyzer that detects gases, humidity, and temperature
US10254261B2 (en) 2016-07-18 2019-04-09 Stmicroelectronics Pte Ltd Integrated air quality sensor that detects multiple gas species
US10557812B2 (en) 2016-12-01 2020-02-11 Stmicroelectronics Pte Ltd Gas sensors
US11260679B2 (en) * 2018-12-21 2022-03-01 Kateeva, Inc. Gripping for print substrates
CN118358951A (en) * 2024-05-15 2024-07-19 安徽明致科技有限公司 Lead frame feeding device and method

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3976288A (en) * 1975-11-24 1976-08-24 Ibm Corporation Semiconductor wafer dicing fixture
US6165232A (en) * 1998-03-13 2000-12-26 Towa Corporation Method and apparatus for securely holding a substrate during dicing
US6150240A (en) * 1998-07-27 2000-11-21 Motorola, Inc. Method and apparatus for singulating semiconductor devices
TW423113B (en) * 1998-09-18 2001-02-21 Towa Corp Arrangement configured to support substrate during dicing process, and apparatus and method for cutting tapeless substrate using the arrangement
US6688300B2 (en) * 1999-04-08 2004-02-10 Intercon Technologies, Inc. Techniques for dicing substrates during integrated circuit fabrication
JP4680362B2 (en) * 2000-09-22 2011-05-11 株式会社石井工作研究所 Electronic component manufacturing method and manufacturing apparatus
US20020185121A1 (en) * 2001-06-06 2002-12-12 Farnworth Warren M. Group encapsulated dicing chuck

Also Published As

Publication number Publication date
TWI250621B (en) 2006-03-01
KR100693334B1 (en) 2007-03-09
SG145540A1 (en) 2008-09-29
TW200531224A (en) 2005-09-16
KR20050091614A (en) 2005-09-15
WO2005087471A1 (en) 2005-09-22

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