MY143265A - Integrated getter for vacuum or inert gas packaged leds - Google Patents

Integrated getter for vacuum or inert gas packaged leds

Info

Publication number
MY143265A
MY143265A MYPI20051690A MY143265A MY 143265 A MY143265 A MY 143265A MY PI20051690 A MYPI20051690 A MY PI20051690A MY 143265 A MY143265 A MY 143265A
Authority
MY
Malaysia
Prior art keywords
vacuum
inert gas
packaged leds
getter
integrated getter
Prior art date
Application number
Inventor
Marco Amiotti
Ronald O Petersen
Original Assignee
Getters Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Getters Spa filed Critical Getters Spa
Publication of MY143265A publication Critical patent/MY143265A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Led Device Packages (AREA)
  • Preparation Of Clay, And Manufacture Of Mixtures Containing Clay Or Cement (AREA)

Abstract

A TECHNIQUE FOR CONTROLLING AN ATMOSPHERE WITHIN AN ENCLOSURE INVOLVES PROVIDING A GETTER WITHIN THE ATMOSPHERE OF THE ENCLOSURE. AN LED MANUFACTURED ACCORDING TO THE TECHNIQUE MAY INCLUDE A GETTER WITHIN AN ENCLOSED VOLUME OF THE LED DEVICE.
MYPI20051690 2004-04-15 2005-04-15 Integrated getter for vacuum or inert gas packaged leds MY143265A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US56289904P 2004-04-15 2004-04-15

Publications (1)

Publication Number Publication Date
MY143265A true MY143265A (en) 2011-04-15

Family

ID=38113185

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20051690 MY143265A (en) 2004-04-15 2005-04-15 Integrated getter for vacuum or inert gas packaged leds

Country Status (3)

Country Link
CN (1) CN100589226C (en)
MY (1) MY143265A (en)
TW (1) TWI373854B (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102820411B (en) * 2009-02-19 2016-08-24 光宝电子(广州)有限公司 Light-emitting diode chip for backlight unit, preparation method and method for packing
KR101747451B1 (en) * 2009-06-01 2017-06-27 스미또모 가가꾸 가부시키가이샤 Formulations for improved electrodes for electronic devices
CN102237319A (en) * 2010-04-23 2011-11-09 三星半导体(中国)研究开发有限公司 Package
CN102244178A (en) * 2010-05-14 2011-11-16 展晶科技(深圳)有限公司 Encapsulation structure of LED (light emitting diode)
EP2622272A2 (en) * 2010-09-28 2013-08-07 Koninklijke Philips Electronics N.V. Light-emitting arrangement
CN103050603B (en) * 2011-10-17 2016-03-23 展晶科技(深圳)有限公司 The manufacture method of LED encapsulation structure
US9666556B2 (en) 2015-06-29 2017-05-30 Taiwan Semiconductor Manufacturing Company, Ltd. Flip chip packaging
CN107346859A (en) * 2017-07-26 2017-11-14 江苏舒适照明有限公司 A kind of preparation method of white light source
WO2019052194A1 (en) * 2017-09-13 2019-03-21 厦门三安光电有限公司 Method for die-bonding semiconductor element and semiconductor element

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1396667A (en) * 2001-07-16 2003-02-12 诠兴开发科技股份有限公司 LED packaging
US6936131B2 (en) * 2002-01-31 2005-08-30 3M Innovative Properties Company Encapsulation of organic electronic devices using adsorbent loaded adhesives
US6887733B2 (en) * 2002-09-11 2005-05-03 Osram Opto Semiconductors (Malaysia) Sdn. Bhd Method of fabricating electronic devices

Also Published As

Publication number Publication date
TW200539487A (en) 2005-12-01
TWI373854B (en) 2012-10-01
CN1973355A (en) 2007-05-30
CN100589226C (en) 2010-02-10

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