MY144186A - Device and method for encapsulating with encapsulating material an electronic component fixed on a carrier - Google Patents

Device and method for encapsulating with encapsulating material an electronic component fixed on a carrier

Info

Publication number
MY144186A
MY144186A MYPI20040030A MYPI20040030A MY144186A MY 144186 A MY144186 A MY 144186A MY PI20040030 A MYPI20040030 A MY PI20040030A MY PI20040030 A MYPI20040030 A MY PI20040030A MY 144186 A MY144186 A MY 144186A
Authority
MY
Malaysia
Prior art keywords
encapsulating
carrier
electronic component
encapsulating material
component fixed
Prior art date
Application number
MYPI20040030A
Inventor
Martin Herman Weggen
Michel Hendrikus Lambertus Teunissen
Wilhelmus Gerardus Jozef Gal
Original Assignee
Besi Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Besi Netherlands Bv filed Critical Besi Netherlands Bv
Publication of MY144186A publication Critical patent/MY144186A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/40—Removing or ejecting moulded articles
    • B29C45/4005—Ejector constructions; Ejector operating mechanisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H10W74/117—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations the substrate having spherical bumps for external connection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

THE INVENTION RELATES TO A DEVICE (1) FOR ENCAPSULATING WITH ENCAPSULATING MATERIAL AN ELECTRONIC COMPONENT, IN PARTICULAR A SEMICONDUCTOR, FIXED ON A CARRIER (4), COMPRISING:TWO CO-ACTING MOULD PARTS (2, 3) WHICH ARE DISPLACEABLE RELATIVE TO EACH OTHER BETWEEN AN ENCAPSULATING POSITION, IN WHICH THE MOULD PARTS (2, 3), WHEN CLOSING ONTO THE CARRIER (4), OCCUPY A POSITION FOR DEFINING AT LEAST ONE MOULD CAVITY, AND AN OPENED POSITION IN WHICH THE MOULD PARTS (2, 3) ARE SITUATED AT GREATER DISTANCE FROM EACH OTHER THAN IN THE ENCAPSULATING POSITION, AND FEED MEANS FOR ENCAPSULATING MATERIAL CONNECTING ONTO THE MOULD CAVITY.THE INVENTION ALSO RELATES TO A METHOD FOR ENCAPSULATING WITH ENCAPSULATING MATERIAL AN ELECTRONIC COMPONENT FIXED ON A CARRIER (4). FIGURE 1
MYPI20040030A 2003-01-08 2004-01-07 Device and method for encapsulating with encapsulating material an electronic component fixed on a carrier MY144186A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL1022323A NL1022323C2 (en) 2003-01-08 2003-01-08 Device and method for encapsulating an electronic component mounted on a carrier with encapsulating material.

Publications (1)

Publication Number Publication Date
MY144186A true MY144186A (en) 2011-08-15

Family

ID=32844959

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20040030A MY144186A (en) 2003-01-08 2004-01-07 Device and method for encapsulating with encapsulating material an electronic component fixed on a carrier

Country Status (9)

Country Link
US (1) US7608486B2 (en)
EP (1) EP1584109A2 (en)
JP (1) JP5204400B2 (en)
KR (1) KR101138561B1 (en)
CN (2) CN101667549B (en)
MY (1) MY144186A (en)
NL (1) NL1022323C2 (en)
TW (1) TWI341016B (en)
WO (1) WO2004070838A2 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1026670C2 (en) * 2004-07-16 2006-01-17 Fico Bv Encapsulation of electronic components, e.g. semiconductors, in mold by introducing part of conditioning gas into mold cavity during release of encapsulating material such that releasing gas pressure is exerted on encapsulating material
US7242573B2 (en) * 2004-10-19 2007-07-10 E. I. Du Pont De Nemours And Company Electroconductive paste composition
JP2007095804A (en) * 2005-09-27 2007-04-12 Towa Corp Resin sealing molding method and apparatus for electronic parts
JP4084844B2 (en) * 2005-09-27 2008-04-30 Ｔｏｗａ株式会社 Resin sealing molding method and apparatus for electronic parts
JP4855026B2 (en) * 2005-09-27 2012-01-18 Ｔｏｗａ株式会社 Resin sealing molding method and apparatus for electronic parts
NL2001818C2 (en) * 2008-07-17 2010-01-19 Fico Bv Method for encapsulating electronic components with a controllable closing force.
JP6218549B2 (en) * 2013-10-17 2017-10-25 Ｔｏｗａ株式会社 Semiconductor substrate supply method and semiconductor substrate supply apparatus for semiconductor encapsulated type
NL2013191B1 (en) * 2014-07-15 2016-07-14 Sencio B V Integrated circuit package moulding method and mould.
NL2013978B1 (en) * 2014-12-15 2016-10-11 Besi Netherlands Bv Device and method for controlled moulding and degating of a carrier with electronic components and moulded product.
NL2016011B1 (en) * 2015-12-23 2017-07-03 Besi Netherlands Bv Press, actuator set and method for encapsulating electronic components with at least two individual controllable actuators.

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57128930A (en) * 1981-02-04 1982-08-10 Yamagata Nippon Denki Kk Resin sealing
US4381384A (en) * 1981-08-17 1983-04-26 E. I. Du Pont De Nemours And Company Continuous polymerization process
JP2977889B2 (en) * 1990-11-20 1999-11-15 シチズン時計株式会社 IC resin sealing method
JPH0780895A (en) 1993-09-10 1995-03-28 Olympus Optical Co Ltd Cutting device for gate of molded member
JPH07183317A (en) * 1993-12-22 1995-07-21 Matsushita Electric Ind Co Ltd Electronic component manufacturing apparatus and manufacturing method
JPH07205214A (en) * 1994-01-12 1995-08-08 Pack Vision:Kk Mold for ball grid array
NL9500238A (en) * 1995-02-09 1996-09-02 Fico Bv Casing device with compensation element.
JP3572833B2 (en) * 1996-12-19 2004-10-06 株式会社デンソー Method for manufacturing resin-encapsulated semiconductor device
US6114189A (en) * 1997-09-10 2000-09-05 Lsi Logic Corp. Molded array integrated circuit package
JP3127889B2 (en) * 1998-06-25 2001-01-29 日本電気株式会社 Manufacturing method of semiconductor package and mold for molding the same
NL1012488C2 (en) * 1999-07-01 2001-01-03 Fico Bv Apparatus and method for encapsulating electronic components mounted on a support.
JP3423912B2 (en) * 2000-02-10 2003-07-07 Ｔｏｗａ株式会社 Electronic component, resin sealing method for electronic component, and resin sealing device
JP4358501B2 (en) * 2002-10-31 2009-11-04 Ｔｏｗａ株式会社 Resin sealing molding method for electronic parts and mold

Also Published As

Publication number Publication date
US7608486B2 (en) 2009-10-27
TWI341016B (en) 2011-04-21
CN1765017A (en) 2006-04-26
EP1584109A2 (en) 2005-10-12
KR101138561B1 (en) 2012-05-10
CN101667549B (en) 2012-04-04
NL1022323C2 (en) 2004-07-09
WO2004070838A2 (en) 2004-08-19
US20060160275A1 (en) 2006-07-20
KR20050098858A (en) 2005-10-12
TW200421573A (en) 2004-10-16
WO2004070838A3 (en) 2005-07-21
CN101667549A (en) 2010-03-10
JP2006516366A (en) 2006-06-29
JP5204400B2 (en) 2013-06-05

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