MY144568A - Polishing composition - Google Patents

Polishing composition

Info

Publication number: MY144568A
Authority: MY; Malaysia
Prior art keywords: acid; ammonium; reducing agent; polishing composition; polishing
Prior art date: 2003-07-03

Application number

MYPI20042628A

Other languages

English (en)

Inventor

Tomohide Kamiya

Noritaka Yokomichi

Toshiki Owaki

Original Assignee

Fujimi Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2003-07-03

Filing date

2004-07-01

Publication date

2011-10-14

2004-07-01 Application filed by Fujimi Inc filed Critical Fujimi Inc

2011-10-14 Publication of MY144568A publication Critical patent/MY144568A/en

Links

238000005498 polishing Methods 0.000 title abstract 5
BDAGIHXWWSANSR-UHFFFAOYSA-N Formic acid Chemical compound OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 abstract 3
MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 abstract 3
239000003638 chemical reducing agent Substances 0.000 abstract 3
CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 abstract 2
QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 abstract 2
239000002253 acid Substances 0.000 abstract 2
LNTHITQWFMADLM-UHFFFAOYSA-N gallic acid Chemical compound OC(=O)C1=CC(O)=C(O)C(O)=C1 LNTHITQWFMADLM-UHFFFAOYSA-N 0.000 abstract 2
WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 abstract 2
GEHJYWRUCIMESM-UHFFFAOYSA-L sodium sulfite Chemical compound [Na+].[Na+].[O-]S([O-])=O GEHJYWRUCIMESM-UHFFFAOYSA-L 0.000 abstract 2
XZXYQEHISUMZAT-UHFFFAOYSA-N 2-[(2-hydroxy-5-methylphenyl)methyl]-4-methylphenol Chemical compound CC1=CC=C(O)C(CC=2C(=CC=C(C)C=2)O)=C1 XZXYQEHISUMZAT-UHFFFAOYSA-N 0.000 abstract 1
PQUCIEFHOVEZAU-UHFFFAOYSA-N Diammonium sulfite Chemical compound [NH4+].[NH4+].[O-]S([O-])=O PQUCIEFHOVEZAU-UHFFFAOYSA-N 0.000 abstract 1
DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 abstract 1
239000002211 L-ascorbic acid Substances 0.000 abstract 1
235000000069 L-ascorbic acid Nutrition 0.000 abstract 1
ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical compound OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 abstract 1
239000004280 Sodium formate Substances 0.000 abstract 1
GJYJYFHBOBUTBY-UHFFFAOYSA-N alpha-camphorene Chemical compound CC(C)=CCCC(=C)C1CCC(CCC=C(C)C)=CC1 GJYJYFHBOBUTBY-UHFFFAOYSA-N 0.000 abstract 1
VZTDIZULWFCMLS-UHFFFAOYSA-N ammonium formate Chemical compound [NH4+].[O-]C=O VZTDIZULWFCMLS-UHFFFAOYSA-N 0.000 abstract 1
229940107816 ammonium iodide Drugs 0.000 abstract 1
VBIXEXWLHSRNKB-UHFFFAOYSA-N ammonium oxalate Chemical compound [NH4+].[NH4+].[O-]C(=O)C([O-])=O VBIXEXWLHSRNKB-UHFFFAOYSA-N 0.000 abstract 1
229960005070 ascorbic acid Drugs 0.000 abstract 1
235000019253 formic acid Nutrition 0.000 abstract 1
229940074391 gallic acid Drugs 0.000 abstract 1
235000004515 gallic acid Nutrition 0.000 abstract 1
235000006408 oxalic acid Nutrition 0.000 abstract 1
239000007800 oxidant agent Substances 0.000 abstract 1
ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical compound O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 abstract 1
229940079877 pyrogallol Drugs 0.000 abstract 1
229910052708 sodium Inorganic materials 0.000 abstract 1
239000011734 sodium Substances 0.000 abstract 1
HLBBKKJFGFRGMU-UHFFFAOYSA-M sodium formate Chemical compound [Na+].[O-]C=O HLBBKKJFGFRGMU-UHFFFAOYSA-M 0.000 abstract 1
235000019254 sodium formate Nutrition 0.000 abstract 1
235000010265 sodium sulphite Nutrition 0.000 abstract 1
239000000758 substrate Substances 0.000 abstract 1
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1

Classifications

- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
- G11B5/8404—Processes or apparatus specially adapted for manufacturing record carriers manufacturing base layers
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers

Landscapes

Chemical & Material Sciences (AREA)
Organic Chemistry (AREA)
Engineering & Computer Science (AREA)
Manufacturing & Machinery (AREA)
Manufacturing Of Magnetic Record Carriers (AREA)
Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

MYPI20042628A 2003-07-03 2004-07-01 Polishing composition MY144568A (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP2003191307A JP4202201B2 (ja)	2003-07-03	2003-07-03	研磨用組成物

Publications (1)

Publication Number	Publication Date
MY144568A true MY144568A (en)	2011-10-14

Family

ID=32844734

Family Applications (2)

Application Number	Title	Priority Date	Filing Date
MYPI20042628A MY144568A (en)	2003-07-03	2004-07-01	Polishing composition
MYPI2011001940A MY160322A (en)	2003-07-03	2004-07-01	Polishing composition

Family Applications After (1)

Application Number	Title	Priority Date	Filing Date
MYPI2011001940A MY160322A (en)	2003-07-03	2004-07-01	Polishing composition

Country Status (4)

Country	Link
JP (1)	JP4202201B2 (ja)
CN (1)	CN1576339B (ja)
GB (1)	GB2403954B (ja)
MY (2)	MY144568A (ja)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US8025808B2 (en)	2003-04-25	2011-09-27	Saint-Gobain Ceramics & Plastics, Inc.	Methods for machine ceramics
US7776230B2 (en) *	2006-08-30	2010-08-17	Cabot Microelectronics Corporation	CMP system utilizing halogen adduct
TWI386468B (zh)	2006-12-20	2013-02-21	Saint Gobain Ceramics	加工無機非金屬工件之方法
JP4614981B2 (ja) *	2007-03-22	2011-01-19	Ｊｓｒ株式会社	化学機械研磨用水系分散体および半導体装置の化学機械研磨方法
MY155533A (en)	2008-06-11	2015-10-30	Shinetsu Chemical Co	Polishing agent for synthetic quartz glass substrate
US8226841B2 (en) *	2009-02-03	2012-07-24	Cabot Microelectronics Corporation	Polishing composition for nickel-phosphorous memory disks
CN101955732B (zh) *	2009-07-13	2016-06-15	安集微电子（上海）有限公司	一种化学机械抛光液
CN102516887B (zh) *	2011-11-24	2014-01-08	珠海承鸥卫浴用品有限公司	抛光液与等离子抛光工艺
CN102746795B (zh) *	2012-06-18	2013-12-18	工业和信息化部电子第五研究所华东分所	一种印制电路金相切片用抛光液及其制备方法
CN103102811B (zh) *	2013-01-18	2014-07-09	上海森博新材料科技有限公司	机械研磨液及采用该研磨液的金属表面处理方法
JP2014101518A (ja) *	2014-01-06	2014-06-05	Fujimi Inc	研磨用組成物、研磨方法、及び研磨パッドの弾力性低下抑制方法
KR101943704B1 (ko) *	2016-06-27	2019-01-29	삼성에스디아이 주식회사	금속막용 cmp 슬러리 조성물 및 연마 방법
GB2562776A (en) *	2017-05-25	2018-11-28	Weatherford Uk Ltd	Pressure integrity testing of one-trip completion assembly
CN110629227A (zh) *	2019-08-14	2019-12-31	沈阳造币有限公司	一种造币铜合金坯饼电解质等离子抛光液及抛光工艺
CN111574927A (zh) *	2020-06-22	2020-08-25	宁波日晟新材料有限公司	一种含还原剂的碳化硅抛光液及其制备方法和应用
JPWO2023140049A1 (ja) *	2022-01-24	2023-07-27

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
MY124578A (en) *	1997-06-17	2006-06-30	Showa Denko Kk	Magnetic hard disc substrate and process for manufacturing the same
TW486514B (en) *	1999-06-16	2002-05-11	Eternal Chemical Co Ltd	Chemical mechanical abrasive composition for use in semiconductor processing
CN1288927A (zh) *	1999-09-21	2001-03-28	长兴化学工业股份有限公司	化学机械研磨组合物
US6258140B1 (en) *	1999-09-27	2001-07-10	Fujimi America Inc.	Polishing composition
JP4238951B2 (ja) *	1999-09-28	2009-03-18	株式会社フジミインコーポレーテッド	研磨用組成物およびそれを用いたメモリーハードディスクの製造方法
US6471884B1 (en) *	2000-04-04	2002-10-29	Cabot Microelectronics Corporation	Method for polishing a memory or rigid disk with an amino acid-containing composition
US6569215B2 (en) *	2000-04-17	2003-05-27	Showa Denko Kabushiki Kaisha	Composition for polishing magnetic disk substrate
TW528645B (en) *	2000-04-17	2003-04-21	Showa Denko Kk	Composition for polishing magnetic disk substrate
US6976905B1 (en) *	2000-06-16	2005-12-20	Cabot Microelectronics Corporation	Method for polishing a memory or rigid disk with a phosphate ion-containing polishing system
JP2002198331A (ja) *	2000-12-26	2002-07-12	Jsr Corp	研磨方法
JP4231632B2 (ja) *	2001-04-27	2009-03-04	花王株式会社	研磨液組成物
JP4462599B2 (ja) *	2001-08-21	2010-05-12	花王株式会社	研磨液組成物
JP4074126B2 (ja) *	2001-09-03	2008-04-09	昭和電工株式会社	研磨用組成物
AU2002334406A1 (en) *	2001-09-03	2003-03-18	Showa Denko K.K.	Polishing composition
JP3680022B2 (ja) *	2001-12-07	2005-08-10	東洋鋼鈑株式会社	磁気ディスク基板研磨液
US6755721B2 (en) *	2002-02-22	2004-06-29	Saint-Gobain Ceramics And Plastics, Inc.	Chemical mechanical polishing of nickel phosphorous alloys
JP2003286477A (ja) *	2002-03-28	2003-10-10	Sumitomo Bakelite Co Ltd	研磨用組成物並びに研磨方法
JP2004175904A (ja) *	2002-11-27	2004-06-24	Sumitomo Bakelite Co Ltd	研磨用組成物
JP3997152B2 (ja) *	2002-12-26	2007-10-24	花王株式会社	研磨液組成物
TWI254741B (en) *	2003-02-05	2006-05-11	Kao Corp	Polishing composition
JP4202172B2 (ja) *	2003-03-31	2008-12-24	株式会社フジミインコーポレーテッド	研磨用組成物

2003
- 2003-07-03 JP JP2003191307A patent/JP4202201B2/ja not_active Expired - Lifetime
2004
- 2004-06-30 GB GB0414656A patent/GB2403954B/en not_active Expired - Fee Related
- 2004-07-01 MY MYPI20042628A patent/MY144568A/en unknown
- 2004-07-01 MY MYPI2011001940A patent/MY160322A/en unknown
- 2004-07-02 CN CN2004100628680A patent/CN1576339B/zh not_active Expired - Fee Related

Also Published As

Publication number	Publication date
CN1576339A (zh)	2005-02-09
MY160322A (en)	2017-02-28
JP2005023228A (ja)	2005-01-27
GB2403954B (en)	2008-01-02
GB2403954A (en)	2005-01-19
JP4202201B2 (ja)	2008-12-24
CN1576339B (zh)	2012-03-28
GB0414656D0 (en)	2004-08-04

Publication	Publication Date	Title
MY160322A (en)	2017-02-28	Polishing composition
CN101180379A (zh)	2008-05-14	用于含有金属离子氧化剂的化学机械抛光组合物中的二羟基烯醇化合物
TW200500809A (en)	2005-01-01	Composition for formation of underlayer film for lithography containing epoxy compound and carboxylic acid compound
MY131759A (en)	2007-08-30	Lanthanide oxide dissolution from glass surface
TW476777B (en)	2002-02-21	Abrasive liquid for metal and method for polishing
EP1338922A3 (en)	2005-09-28	Positive resist composition
ATE556770T1 (de)	2012-05-15	Abgasreinigungskatalysator
WO2000028108A3 (en)	2001-10-18	Non-electrolytic gold plating compositions and methods of use thereof
JP2008518427A5 (ja)	2010-04-30
DE60141629D1 (de)	2010-05-06	Zusammensetzung zur reinigung nach einer chemisch-mechanischen planarisierung
TW200605212A (en)	2006-02-01	Method for enhancing fluorine utilization
TW200718763A (en)	2007-05-16	Polymeric barrier removal polishing slurry
WO2002094957A3 (en)	2003-10-23	Chemical mechanical polishing compositions and methods relating thereto
DE60002471D1 (de)	2003-06-05	Zusammensetzungen zur freisetzung von mundpflegewirkstoffen enthaltend organosiloxan harze durch verwendung eines wiederablösbaren trägerstreifens
CA2395424A1 (en)	2001-07-26	Methods of using polyphosphates to decrease erosive potential of acidic beverages
JP2011508462A5 (ja)	2012-02-16
MY119974A (en)	2005-08-30	Method for polishing a memory or rigid disk with an amino acid-containing composition
WO2005068572A3 (en)	2006-02-02	Chemical-mechanical polishing of metals in an oxidized form
JP2004526308A5 (ja)	2005-12-22
JP2012199531A5 (ja)	2015-04-09
MY137247A (en)	2009-01-30	Polishing composition
TW200745316A (en)	2007-12-16	Copper-based metal polishing compositions and polishing process
WO2008025030A3 (en)	2008-05-22	Method and system for point of use treatment of substrate polishing fluids
CN102268224A (zh)	2011-12-07	可控氧化硅去除速率的化学机械抛光液
CA2362652A1 (en)	2001-06-14	Coating composition and method for producing the same