MY144642A - Multilayered lead frame for a semiconductor light-emitting device - Google Patents

Multilayered lead frame for a semiconductor light-emitting device

Info

Publication number
MY144642A
MY144642A MYPI20040108A MYPI20040108A MY144642A MY 144642 A MY144642 A MY 144642A MY PI20040108 A MYPI20040108 A MY PI20040108A MY PI20040108 A MYPI20040108 A MY PI20040108A MY 144642 A MY144642 A MY 144642A
Authority
MY
Malaysia
Prior art keywords
lead frame
plating
package
emitting device
semiconductor light
Prior art date
Application number
MYPI20040108A
Inventor
Hidekazu Tomohiru
Masayuki Fujii
Norio Satou
Tomoyuki Yamada
Tomio Kusano
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Publication of MY144642A publication Critical patent/MY144642A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/456—Materials
    • H10W70/457—Materials of metallic layers on leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Led Device Packages (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

A LEADFRAME (100) FOR A SEMICONDUCTOR DEVICE IS FORMED BY APPLYING NICKEL PLATING (102), PALLADIUM PLATING (103), AND GOLD FLASH PLATING (104) SUBSTANTIALLY ENTIRELY TO LEAD FRAME BODY (101) SUCH AS COPPER THIN PLATE IN THIS ORDER, AND FURTHER APPLYING SILVER PLATING (105) SELECTIVELY TO PART OF AN INNER PART THAT IS TO BE ENCLOSED WITH A PACKAGE OF THE SEMICONDUCTOR DEVICE. THE LEAD FRAME (100) MAY ALSO INCLUDE A BASE OF THE PACKAGE. THE SILVER PLATING CONTRIBUTES TO AN EXCELLENT LIGHT REFLECTANCE AND WIRE BONDING EFFICIENCY OF THE INNER PART, WHEREAS THE GOLD FLASH PLATING CONTRIBUTES TO AN EXCELLENT RESISTANCE TO CORROSION AND SOLDERING EFFICIENCY OF AN OUTER PART THAT IS OUTSIDE THE PACKAGE.
MYPI20040108A 2003-01-16 2004-01-15 Multilayered lead frame for a semiconductor light-emitting device MY144642A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003007988 2003-01-16

Publications (1)

Publication Number Publication Date
MY144642A true MY144642A (en) 2011-10-31

Family

ID=32709142

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20040108A MY144642A (en) 2003-01-16 2004-01-15 Multilayered lead frame for a semiconductor light-emitting device

Country Status (7)

Country Link
US (3) US7692277B2 (en)
KR (1) KR101059361B1 (en)
CN (2) CN100499099C (en)
DE (1) DE112004000155B4 (en)
MY (1) MY144642A (en)
TW (1) TWI264105B (en)
WO (1) WO2004064154A1 (en)

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CN102257647B (en) * 2008-12-19 2014-07-23 古河电气工业株式会社 Lead frame for optical semiconductor device and manufacturing method thereof
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KR101718575B1 (en) * 2010-06-15 2017-03-21 후루카와 덴키 고교 가부시키가이샤 Leadframe for optical semiconductor device, method for manufacturing leadframe for optical semiconductor device, and optical semiconductor device
TW201230417A (en) * 2011-01-11 2012-07-16 Lextar Electronics Corp Leadframe, packaging cup incorporating the leadframe and light emitting diode lamp having the leadframe
KR101802850B1 (en) 2011-01-11 2017-11-29 해성디에스 주식회사 Semiconductor package
JP5682341B2 (en) * 2011-02-01 2015-03-11 日亜化学工業株式会社 Light emitting device and manufacturing method thereof
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KR101217308B1 (en) * 2011-05-27 2012-12-31 앰코 테크놀로지 코리아 주식회사 Lead frame for semiconductor device
DE102011083691B4 (en) * 2011-09-29 2020-03-12 Osram Gmbh OPTOELECTRONIC SEMICONDUCTOR COMPONENT
US20130098659A1 (en) * 2011-10-25 2013-04-25 Yiu Fai KWAN Pre-plated lead frame for copper wire bonding
TWI483437B (en) * 2012-03-27 2015-05-01 Lextar Electronics Corp Light emitting diode package and method for fabricating the same
TWI447961B (en) * 2012-04-16 2014-08-01 隆達電子股份有限公司 Light-emitting diode package
CN102903823A (en) * 2012-07-17 2013-01-30 孙百贵 Novel TOP LED (Light-Emitting Diode) metal bracket and manufacturing method thereof
CN102956795A (en) * 2012-07-17 2013-03-06 孙百贵 TOP LED (Light Emitting Diode) metal support and manufacturing method thereof
KR101802851B1 (en) 2013-03-11 2017-11-29 해성디에스 주식회사 Lead frame, semiconductor package including the lead frame, and method of manufacturing the lead frame
KR101511032B1 (en) * 2013-09-25 2015-04-10 앰코 테크놀로지 코리아 주식회사 Leadframe for manufacturing LED package and LED package using the same
DE102014101155A1 (en) * 2014-01-30 2015-07-30 Osram Opto Semiconductors Gmbh Optoelectronic component
DE102014101154A1 (en) * 2014-01-30 2015-07-30 Osram Opto Semiconductors Gmbh Optoelectronic arrangement
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Also Published As

Publication number Publication date
KR101059361B1 (en) 2011-08-24
US20100155770A1 (en) 2010-06-24
DE112004000155T5 (en) 2008-03-20
TWI264105B (en) 2006-10-11
US7994616B2 (en) 2011-08-09
WO2004064154A1 (en) 2004-07-29
DE112004000155B4 (en) 2019-06-19
US8541871B2 (en) 2013-09-24
KR20050097926A (en) 2005-10-10
TW200416993A (en) 2004-09-01
US20090283791A1 (en) 2009-11-19
CN101546803A (en) 2009-09-30
CN100499099C (en) 2009-06-10
CN101546803B (en) 2010-12-08
US20060102936A1 (en) 2006-05-18
CN1795554A (en) 2006-06-28
US7692277B2 (en) 2010-04-06

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