MY146268A - Cleaning agent composition for electronic device substrate and electronic device substrate cleaning method - Google Patents
Cleaning agent composition for electronic device substrate and electronic device substrate cleaning methodInfo
- Publication number
- MY146268A MY146268A MYPI20094029A MYPI20094029A MY146268A MY 146268 A MY146268 A MY 146268A MY PI20094029 A MYPI20094029 A MY PI20094029A MY PI20094029 A MYPI20094029 A MY PI20094029A MY 146268 A MY146268 A MY 146268A
- Authority
- MY
- Malaysia
- Prior art keywords
- electronic device
- device substrate
- agent composition
- cleaning agent
- cleaning
- Prior art date
Links
- 238000004140 cleaning Methods 0.000 title abstract 3
- 239000012459 cleaning agent Substances 0.000 title abstract 3
- 239000000758 substrate Substances 0.000 title abstract 3
- 238000000034 method Methods 0.000 title abstract 2
- 238000005498 polishing Methods 0.000 abstract 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 1
- 229910052783 alkali metal Inorganic materials 0.000 abstract 1
- 150000001340 alkali metals Chemical class 0.000 abstract 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical class OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 abstract 1
- 239000008119 colloidal silica Substances 0.000 abstract 1
- 150000004679 hydroxides Chemical class 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 239000002245 particle Substances 0.000 abstract 1
- 150000003839 salts Chemical class 0.000 abstract 1
- 239000004094 surface-active agent Substances 0.000 abstract 1
Landscapes
- Detergent Compositions (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
A CLEANING AGENT COMPOSITION FOR AN ELECTRONIC DEVICE THAT HAS SUPERIOR CLEANING PERFORMANCE EVEN WHEN COLLOIDAL SILICA IS USED FOR THE POLISHING MATERIAL AND IS ABLE TO ADEQUATELY REMOVE ABRASIVE PARTICLES AND POLISHING DEBRIS, AND AN ELECTRONIC DEVICE SUBSTRATE CLEANING METHOD, ARE PROVIDED. THE CLEANING AGENT COMPOSITION CONTAINS 0.01 TO 5.00% BY WEIGHT OF A COMPONENT (A) IN THE FORM OF A HYDROXIDE OF AN ALKALI METAL AND 0.10 TO 10.00% BY WEIGHT OF A COMPONENT (B) IN THE FORM OF A HYDROXYCARBOXYLIC ACID AND/OR SALT THEREOF, AND THE CONTENT OF SURFACTANT IS LESS THAN 1.00% BY WEIGHT.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008257298 | 2008-10-02 | ||
| JP2009184568A JP5518392B2 (en) | 2008-10-02 | 2009-08-07 | Electronic device substrate cleaning composition, and electronic device substrate cleaning method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY146268A true MY146268A (en) | 2012-07-31 |
Family
ID=42298432
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI20094029A MY146268A (en) | 2008-10-02 | 2009-09-28 | Cleaning agent composition for electronic device substrate and electronic device substrate cleaning method |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5518392B2 (en) |
| MY (1) | MY146268A (en) |
| TW (1) | TWI468511B (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6050580B2 (en) * | 2010-11-30 | 2016-12-21 | 三洋化成工業株式会社 | Electronic material cleaner |
| TW201439312A (en) * | 2012-11-16 | 2014-10-16 | Lion Corp | Semiconductor substrate cleaning method and semiconductor substrate manufacturing method |
| JP2014141668A (en) * | 2012-12-27 | 2014-08-07 | Sanyo Chem Ind Ltd | Cleaner for electronic material |
| JP2014141669A (en) * | 2012-12-27 | 2014-08-07 | Sanyo Chem Ind Ltd | Electronic material cleaner |
| CN106605291B (en) | 2014-09-11 | 2020-05-05 | 株式会社德山 | Method for cleaning aluminum nitride single crystal substrate and laminate |
| JP7817939B2 (en) * | 2020-09-30 | 2026-02-19 | 株式会社フジミインコーポレーテッド | Polishing and cleaning method, cleaning agent, and polishing and cleaning set |
| JP7603441B2 (en) * | 2020-12-23 | 2024-12-20 | ニッタ・デュポン株式会社 | Polishing composition and method for polishing silicon wafer |
| CN113755251A (en) * | 2021-10-13 | 2021-12-07 | 常州智高化学科技有限公司 | Substrate cleaning solution for water-based electronic material |
| CN116180097A (en) * | 2022-12-20 | 2023-05-30 | 广州三孚新材料科技股份有限公司 | A kind of phosphorus-free corrosion inhibitor cleaning agent for nickel alloy and its preparation method and application method |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6110883A (en) * | 1996-11-13 | 2000-08-29 | The Procter & Gamble Company | Aqueous alkaline peroxygen bleach-containing compositions |
| EP0906950A1 (en) * | 1997-10-03 | 1999-04-07 | The Procter & Gamble Company | Peroxygen bleach-containing compositions comprising a particular chelating agent system |
| TWI276682B (en) * | 2001-11-16 | 2007-03-21 | Mitsubishi Chem Corp | Substrate surface cleaning liquid mediums and cleaning method |
| JP2005251936A (en) * | 2004-03-03 | 2005-09-15 | St Lcd Kk | Chemical treatment apparatus |
| JP4912791B2 (en) * | 2006-08-21 | 2012-04-11 | Ｊｓｒ株式会社 | Cleaning composition, cleaning method, and manufacturing method of semiconductor device |
-
2009
- 2009-08-07 JP JP2009184568A patent/JP5518392B2/en not_active Expired - Fee Related
- 2009-09-24 TW TW98132271A patent/TWI468511B/en not_active IP Right Cessation
- 2009-09-28 MY MYPI20094029A patent/MY146268A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW201022432A (en) | 2010-06-16 |
| TWI468511B (en) | 2015-01-11 |
| JP5518392B2 (en) | 2014-06-11 |
| JP2010109329A (en) | 2010-05-13 |
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