MY147335A - An integrated packaged environmental sensor and roic and a method of fabricating the same - Google Patents

An integrated packaged environmental sensor and roic and a method of fabricating the same

Info

Publication number
MY147335A
MY147335A MYPI20097023A MYPI20097023A MY147335A MY 147335 A MY147335 A MY 147335A MY PI20097023 A MYPI20097023 A MY PI20097023A MY PI20097023 A MYPI20097023 A MY PI20097023A MY 147335 A MY147335 A MY 147335A
Authority
MY
Malaysia
Prior art keywords
environmental sensor
roic
fabricating
same
integrated packaged
Prior art date
Application number
MYPI20097023A
Inventor
Mohd Ismahadi Syono
Daniel Bien Chia Sheng
Lee Hing Wah
Original Assignee
Mimos Berhad
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mimos Berhad filed Critical Mimos Berhad
Priority to MYPI20097023A priority Critical patent/MY147335A/en
Priority to PCT/MY2009/000196 priority patent/WO2011053108A1/en
Priority to PCT/MY2010/000182 priority patent/WO2011053110A2/en
Publication of MY147335A publication Critical patent/MY147335A/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24—Housings ; Casings for instruments
    • G01D11/245—Housings for sensors
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0716—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising a sensor or an interface to a sensor
    • G06K19/0717—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising a sensor or an interface to a sensor the sensor being capable of sensing environmental conditions such as temperature history or pressure

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Pressure Sensors (AREA)
  • Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)

Abstract

AN INTEGRATED PACKAGED MICROCHIP (100) INCLUDING AT LEAST ONE ENVIRONMENTAL SENSOR (104) AND AT LEAST ONE READ-OUT INTEGRATED CHIP (ROIC) (102) IS PROVIDED, CHARACTERIZED IN THAT, THE INTEGRATED PACKAGED MICROCHIP (100) FURTHER INCLUDES AN ETCHED OPENING (108) OF THE ENVIRONMENTAL SENSOR (104) EXPOSED TO A SENSABLE ENVIRONMENT, USING AT LEAST ONE LAYER OF GLASS WAFER (101,106) AND AT LEAST ONE LAYER OF SILICON WAFER (107).
MYPI20097023A 2009-10-27 2009-10-27 An integrated packaged environmental sensor and roic and a method of fabricating the same MY147335A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
MYPI20097023A MY147335A (en) 2009-10-27 2009-10-27 An integrated packaged environmental sensor and roic and a method of fabricating the same
PCT/MY2009/000196 WO2011053108A1 (en) 2009-10-27 2009-11-19 An integrated packaged environmental sensor and roic and a method of fabricating the same
PCT/MY2010/000182 WO2011053110A2 (en) 2009-10-27 2010-09-30 An integrated packaged environmental sensor and roic and a method of fabricating the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
MYPI20097023A MY147335A (en) 2009-10-27 2009-10-27 An integrated packaged environmental sensor and roic and a method of fabricating the same

Publications (1)

Publication Number Publication Date
MY147335A true MY147335A (en) 2012-11-30

Family

ID=43922292

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20097023A MY147335A (en) 2009-10-27 2009-10-27 An integrated packaged environmental sensor and roic and a method of fabricating the same

Country Status (2)

Country Link
MY (1) MY147335A (en)
WO (2) WO2011053108A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108501657A (en) * 2018-06-04 2018-09-07 泰铂（上海）环保科技股份有限公司 A kind of novel and multifunctional engineering car air-conditioner and control method

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5822473A (en) * 1996-02-29 1998-10-13 Texas Instruments Incorporated Integrated microchip chemical sensor
GB9710843D0 (en) * 1997-05-28 1997-07-23 Secr Defence A thermal detector array
ES2420279T3 (en) * 2000-03-02 2013-08-23 Microchips, Inc. Microfabricated devices and methods for storage and selective exposure of chemicals
US7554085B2 (en) * 2003-10-09 2009-06-30 Ocas Corp. Bolometric infrared sensor having two-layer structure and method for manufacturing the same
US7592594B2 (en) * 2006-11-13 2009-09-22 Raytheon Company Method of construction of CTE matching structure with wafer processing and resulting structure

Also Published As

Publication number Publication date
WO2011053110A3 (en) 2011-08-18
WO2011053108A1 (en) 2011-05-05
WO2011053110A2 (en) 2011-05-05

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