MY149176A - Placement method of an electronic module on a substrate and device produced by said method - Google Patents

Placement method of an electronic module on a substrate and device produced by said method

Info

Publication number
MY149176A
MY149176A MYPI20060430A MYPI20060430A MY149176A MY 149176 A MY149176 A MY 149176A MY PI20060430 A MYPI20060430 A MY PI20060430A MY PI20060430 A MYPI20060430 A MY PI20060430A MY 149176 A MY149176 A MY 149176A
Authority
MY
Malaysia
Prior art keywords
substrate
placement
segment
electronic module
chip
Prior art date
Application number
MYPI20060430A
Inventor
Francois Droz
Original Assignee
Nagraid Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nagraid Sa filed Critical Nagraid Sa
Publication of MY149176A publication Critical patent/MY149176A/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Wire Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

THE INVENTION RELATES TO A PROCESS AND A DEVICE FOR PLACEMENT ON A SUBSTRATE (7), OF AT LEAST ONE ELECTRONIC ASSEMBLY COMPRISING A CHIP (4) INCLUDING AT LEAST ONE ELECTRIC CONTACT (5, 5') ON ONE OF ITS FACES, SAID CONTACT (5, 5') BEING CONNECTED TO A SEGMENT (3,3') OF CONDUCTIVE TRACK. THE PLACEMENT IS PERFORMED WITH A PLACEMENT DEVICE (6) HOLDING AND POSITIONING SAID ASSEMBLY ON THE SUBSTRATE (7). THE PROCESS COMPRISES STEPS OF FORMING A SEGMENT (3, 3') OF CONDUCTIVE TRACK HAVING A PREDETERMINED OUTLINE, TRANSFERRING THE TRACK SEGMENT (3, 3') ONTO THE PLACEMENT DEVICE (6), SEIZING THE CHIP (4) WITH THE PLACEMENT DEVICE (6) CARRYING THE TRACK SEGMENT (3, 3') IN SUCH A WAY THAT SAID TRACK SEGMENT (3, 3') IS PLACED ON AT LEAST ONE CONTACT (5, 5') OF THE CHIP (4), PLACING AND EMBEDDING THE ELECTRONIC ASSEMBLY THUS BUILT AT A PREDETERMINED POSITION ON THE SUBSTRATE (7).
MYPI20060430A 2005-02-01 2006-01-27 Placement method of an electronic module on a substrate and device produced by said method MY149176A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP05100694A EP1686512A1 (en) 2005-02-01 2005-02-01 method for placing an electronic device on a substrate and placing device

Publications (1)

Publication Number Publication Date
MY149176A true MY149176A (en) 2013-07-31

Family

ID=34938618

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20060430A MY149176A (en) 2005-02-01 2006-01-27 Placement method of an electronic module on a substrate and device produced by said method

Country Status (4)

Country Link
EP (1) EP1686512A1 (en)
AR (1) AR052369A1 (en)
MY (1) MY149176A (en)
TW (1) TWI420606B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2925969B1 (en) * 2007-12-26 2010-01-22 Datacard Corp METHOD AND DEVICE FOR INTEGRATING A MODULE OR CHIP

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5406699A (en) * 1992-09-18 1995-04-18 Matsushita Electric Industrial Co., Ltd. Method of manufacturing an electronics package
FR2701139B1 (en) * 1993-02-01 1995-04-21 Solaic Sa Method for implanting a micro-circuit on an intelligent card and / or memory card body, and card comprising a micro-circuit thus implanted.
WO2000002243A1 (en) * 1998-07-01 2000-01-13 Seiko Epson Corporation Semiconductor device, method of manufacture, circuit board, and electronic device
JP4421081B2 (en) * 1999-06-09 2010-02-24 パナソニック株式会社 Power module and manufacturing method thereof
DE10016715C1 (en) * 2000-04-04 2001-09-06 Infineon Technologies Ag Laminated smart card arrangement e.g. for telephone card
DE10136359C2 (en) * 2001-07-26 2003-06-12 Muehlbauer Ag Method for connecting microchip modules with antennas arranged on a first carrier tape for producing a transponder
US6838316B2 (en) * 2002-03-06 2005-01-04 Kabushiki Kaisha Toshiba Semiconductor device manufacturing method using ultrasonic flip chip bonding technique

Also Published As

Publication number Publication date
TWI420606B (en) 2013-12-21
EP1686512A1 (en) 2006-08-02
AR052369A1 (en) 2007-03-14
TW200711008A (en) 2007-03-16

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