MY149802A - Device and method for testing electronic components - Google Patents

Device and method for testing electronic components

Info

Publication number
MY149802A
MY149802A MYPI20033937A MY149802A MY 149802 A MY149802 A MY 149802A MY PI20033937 A MYPI20033937 A MY PI20033937A MY 149802 A MY149802 A MY 149802A
Authority
MY
Malaysia
Prior art keywords
electronic component
testing
support
sides
electronic components
Prior art date
Application number
Inventor
Cretenet Davy
Original Assignee
Ismeca Semiconductor Holding
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ismeca Semiconductor Holding filed Critical Ismeca Semiconductor Holding
Publication of MY149802A publication Critical patent/MY149802A/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

DEVICE FOR AUTOMATICALLY TESTING ELECTRONIC COMPONENTS, COMPRISING A TESTING STATION (7) FOR TESTING AN ELECTRONIC COMPONENT (8) AND AT LEAST ONE SUPPORT (2) FOR HOLDING THE ELECTRONIC COMPONENT (8). THE SUPPORT HOLDS THE ELECTRONIC COMPONENT (8) BY ITS LOWER SIDE AND TWO OPPOSITE LATERAL SIDES SO THAT THE UPPER SIDE AND AT LEAST TWO LATERAL SIDES OF THE ELECTRONIC COMPONENT (8) ARE ENTIRELY ACCESSIBLE WHEN IT IS HELD ON THE SUPPORT (2). THESE SIDES BEING ENTIRELY ACCESSIBLE, THE POSSIBILITIES OF CONTACTING THE CONTACT POINTS (80) OF THE ELECTRONIC COMPONENT (8) TO BE TESTED AND LOCATED ON THESE SIDES ARE MORE NUMEROUS, ALLOWING SIMULTANEOUSLY FOR EXAMPLE AN ELECTRIC KELVIN-TYPE MEASURING AND AN OPTIC MEASURING ON LIGHT-EMITTING DIODES OF VERY SMALL SIZE.
MYPI20033937 2002-11-07 2003-10-16 Device and method for testing electronic components MY149802A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH01868/02A CH695871A5 (en) 2002-11-07 2002-11-07 Apparatus and method for testing electronic components.

Publications (1)

Publication Number Publication Date
MY149802A true MY149802A (en) 2013-10-14

Family

ID=34230853

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20033937 MY149802A (en) 2002-11-07 2003-10-16 Device and method for testing electronic components

Country Status (3)

Country Link
CN (1) CN100459086C (en)
CH (1) CH695871A5 (en)
MY (1) MY149802A (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100445708C (en) * 2005-02-17 2008-12-24 大赢数控设备(深圳)有限公司 Automation device for LED test table
CN100445709C (en) * 2005-03-07 2008-12-24 大赢数控设备(深圳)有限公司 Automatic device of LED testing table
EP2081034B1 (en) 2008-01-16 2014-03-12 ISMECA Semiconductor Holding SA Arrangement and method for handling electronic components
WO2013117265A1 (en) * 2012-02-10 2013-08-15 Ismeca Semiconductor Holding Sa Nest for testing electrical components
US10973161B2 (en) * 2017-01-13 2021-04-06 Raytheon Company Electronic component removal device
EP3687271A1 (en) * 2019-01-25 2020-07-29 Mycronic AB Eletrical verification of electronic components
CN111474903A (en) * 2020-03-31 2020-07-31 深圳精匠云创科技有限公司 Production data collection method, production apparatus, and computer-readable storage medium

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4721907A (en) * 1985-01-23 1988-01-26 Universal Instruments Corporation Apparatus for automated testing of surface mounted components
US4763405A (en) * 1986-08-21 1988-08-16 Matsushita Electric Industrial Co., Ltd. Chip-placement machine with test function
JP3012853B2 (en) * 1990-09-14 2000-02-28 株式会社富士通宮城エレクトロニクス Semiconductor test equipment handler
JP2855177B2 (en) * 1992-03-11 1999-02-10 コマツ電子金属株式会社 Control device for wafer removal device
JPH08334546A (en) * 1995-06-06 1996-12-17 Hitachi Ltd Semiconductor device test equipment
US6019564A (en) * 1995-10-27 2000-02-01 Advantest Corporation Semiconductor device transporting and handling apparatus
KR100486412B1 (en) * 2000-10-18 2005-05-03 (주)테크윙 Insert of test tray for test handler
CN1168129C (en) * 2000-11-23 2004-09-22 崇越科技股份有限公司 Wafer Test Carrier
CN2512112Y (en) * 2001-11-08 2002-09-18 致茂电子股份有限公司 Test equipment for electronic components
CN2518217Y (en) * 2001-11-14 2002-10-23 廖木山 Electronic component detection and positioning device

Also Published As

Publication number Publication date
CN100459086C (en) 2009-02-04
CH695871A5 (en) 2006-09-29
CN1501089A (en) 2004-06-02

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