MY150334A - Composition for preventing wicking of soldering flux, electronic component adapted for soldering which is coated with the composition, method of soldering the component, and electric appliance - Google Patents

Composition for preventing wicking of soldering flux, electronic component adapted for soldering which is coated with the composition, method of soldering the component, and electric appliance

Info

Publication number
MY150334A
MY150334A MYPI2010003394A MYPI20103394A MY150334A MY 150334 A MY150334 A MY 150334A MY PI2010003394 A MYPI2010003394 A MY PI2010003394A MY PI20103394 A MYPI20103394 A MY PI20103394A MY 150334 A MY150334 A MY 150334A
Authority
MY
Malaysia
Prior art keywords
soldering
composition
wicking
flux
polymer
Prior art date
Application number
MYPI2010003394A
Inventor
Ryo Hirabayashi
Fusae Ishiwata
Original Assignee
Agc Seimi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agc Seimi Chemical Co Ltd filed Critical Agc Seimi Chemical Co Ltd
Publication of MY150334A publication Critical patent/MY150334A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Soldering of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/203—Fluxing, i.e. applying flux onto surfaces
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/22—Esters containing halogen
    • C08F220/24—Esters containing halogen containing perhaloalkyl radicals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PROVIDED IS A COMPOSITION FOR PREVENTING WICKING OF A SOLDERING FLUX WHICH HAS A FLUX WICKING PREVENTION EFFECT COMPARABLE TO THAT OF A CONVENTIONAL FLUX WICKING INHIBITOR INCLUDING A POLYMER CONTAINING A POLYFLUOROALKYL GROUP WITH A CARBON NUMBER OF 8 OR MORE AND, AT THE SAME TIME, SIGNIFICANTLY REDUCES BIOLOGICAL AND ENVIRONMENTAL RISKS. THE COMPOSITION FOR PREVENTING WICKING OF A SOLDERING FLUX INCLUDES A POLYMER HAVING AT LEAST ONE REPEATING UNIT (A) AS A (METH) ACRYLATE CONTAINING A PERFLUOROALKYL GROUP WITH A CARBON NUMBER OF 6 OR LESS AND AT LEAST ONE REPEATING UNIT (B) DERIVED FROM AN UNSATURATED COMPOUND CONTAINING A HYDROXY GROUP, WITH THE WEIGHT-AVERAGE MOLECULAR WEIGHT OF THE POLYMER BEING 150,000 OR MORE (POLYMETHYL METHACRYLATE STANDARDS).
MYPI2010003394A 2008-01-18 2008-11-25 Composition for preventing wicking of soldering flux, electronic component adapted for soldering which is coated with the composition, method of soldering the component, and electric appliance MY150334A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008008923 2008-01-18

Publications (1)

Publication Number Publication Date
MY150334A true MY150334A (en) 2013-12-31

Family

ID=40885200

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2010003394A MY150334A (en) 2008-01-18 2008-11-25 Composition for preventing wicking of soldering flux, electronic component adapted for soldering which is coated with the composition, method of soldering the component, and electric appliance

Country Status (4)

Country Link
JP (1) JP5295131B2 (en)
CN (1) CN101952082B (en)
MY (1) MY150334A (en)
WO (1) WO2009090798A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102471405B (en) * 2009-08-20 2014-06-25 Agc清美化学股份有限公司 Fluoroalkyl group-containing n-substituted (meth)acrylamide compound, polymer thereof, and use thereof
JPWO2011105223A1 (en) * 2010-02-26 2013-06-20 アルプス電気株式会社 Surface treatment agent for electrical contacts
JP4947244B2 (en) * 2010-06-02 2012-06-06 Ｄｉｃ株式会社 Cationic polymerizable composition, adhesive containing the same, and cured product and polarizing plate obtained using the same
CN108250338B (en) * 2017-12-27 2020-11-20 兰州大学 Polymer with anti-climbing properties and preparation method thereof

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3516148B2 (en) * 1993-12-28 2004-04-05 大日本インキ化学工業株式会社 How to prevent flux from entering electronic components
JP3529489B2 (en) * 1995-05-12 2004-05-24 千住金属工業株式会社 Flux bleeding inhibitor for soldering
WO1999003637A1 (en) * 1997-07-15 1999-01-28 Seimi Chemical Co., Ltd. Composition for preventing creeping of a flux for soldering
JPH1133708A (en) * 1997-07-15 1999-02-09 Seimi Chem Co Ltd Soldering flux climb preventive, its composition, and application
JP4343354B2 (en) * 1999-11-02 2009-10-14 Ａｇｃセイミケミカル株式会社 Solder flux creeping-up inhibitor composition and its use
CN101389443B (en) * 2006-03-01 2011-05-25 Agc清美化学股份有限公司 Anti-flux migration composition for solder

Also Published As

Publication number Publication date
CN101952082A (en) 2011-01-19
JP5295131B2 (en) 2013-09-18
JPWO2009090798A1 (en) 2011-05-26
CN101952082B (en) 2013-03-13
WO2009090798A1 (en) 2009-07-23

Similar Documents

Publication Publication Date Title
EP2289956A3 (en) Oil-repellent copolymer, method for producing the same and oil-repellent processing liquid
BR112013002202A2 (en) Polyalkyl (meth) acrylate to improve the properties of lubricating oils
EA201171235A1 (en) TARGET ON THE BASIS OF MOLYBDEN AND THE METHOD OF OBTAINING BY THERMOPAPULATION
MY171821A (en) Lignin based coating compositions
EP2261201A4 (en) TRIFUNCTIONAL (METH) ACRYLATE COMPOUND AND POLYMERIZABLE COMPOSITION CONTAINING THE COMPOUND
EA201491337A1 (en) COMPOSITIONS AND METHODS FOR TREATMENT RESIN IN THE WELL
TW200833608A (en) Indium compositions
WO2010049322A3 (en) Adhesion promoters containing phosphonic esters for coating, film or adhesive
MY151223A (en) Fluorocarbon polymer compositions and methods of coating coils therewith
GB0907278D0 (en) A seal arrangement and a method of repairing a seal arrangement
TW200602454A (en) Thermosetting adhesive or pressure-sensitive adhesive tape or sheet, and process of producing the same
BRPI0818353A2 (en) Aqueous dispersions including alkyd resin and addition polymer having (meth) acrylate segment
MY158763A (en) Solder paste
ZA200810805B (en) Branched polyester containing powder coating composition
CO2017013348A2 (en) Carbon binder composition
ATE460441T1 (en) COMPOSITIONS CONTAINING UNSATURATED POLYESTER RESIN OR VINYLESTER RESIN
AR070691A1 (en) LUBRICATING COMPOSITION
MY132762A (en) Composition and method for preventing fouling in (meth)acrylic acid processes
DE60302334D1 (en) REACTIVE THINNER AND COATINGS THAT CONTAIN THEM
BR112012019564A8 (en) composition
MX2012004826A (en) Coating compositions and methods for using the same as a spot blender.
WO2009004952A1 (en) Silicone-containing cosmetic
EP2554181A3 (en) Methods of protecting against apoptosis using lipopeptides
MX356261B (en) Strapping and methods of making the same.
MY182814A (en) Flux activator agent, flux, and solder