MY150455A - Solder free from lead for additional supply and method of regulating cu concentration and ni concentration in solder bath - Google Patents

Solder free from lead for additional supply and method of regulating cu concentration and ni concentration in solder bath

Info

Publication number
MY150455A
MY150455A MYPI20080035A MY150455A MY 150455 A MY150455 A MY 150455A MY PI20080035 A MYPI20080035 A MY PI20080035A MY 150455 A MY150455 A MY 150455A
Authority
MY
Malaysia
Prior art keywords
concentration
solder
lead
free
regulating
Prior art date
Application number
Inventor
Tetsuro Nishimura
Original Assignee
Nihon Superior Sha Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Superior Sha Co Ltd filed Critical Nihon Superior Sha Co Ltd
Priority to MYPI20080035 priority Critical patent/MY150455A/en
Publication of MY150455A publication Critical patent/MY150455A/en

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Abstract

LEAD-FREE SOLDER IS REPLENISHED TO A SOLDER BATH TO RECEIVE A WORK HAVING COPPER, THE WORK TO BE PROCESSED SUBSEQUENT TO A SOLDERING PROCESS USING AN AIR KNIFE OR A DIE. THE REPLENISHED LEAD-FREE SOLDER INCLUDES SN AS A MAJOR COMPOSITION AND AT LEAST 0.01 TO 0.5 MASS PERCENT NI. BY REPLENISHING THE LEAD-FREE SOLDER HAVING THE ABOVE COMPOSITION, THE DENSITY OF THE SOLDER BATH, BEING SHARPLY CHANGED FOR USING ONE OF A HASL DEVICE AND A DIE, IS QUICKLY RESTORED BACK TO WITHIN AN APPROPRIATE RANGE.
MYPI20080035 2008-01-08 2008-01-08 Solder free from lead for additional supply and method of regulating cu concentration and ni concentration in solder bath MY150455A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
MYPI20080035 MY150455A (en) 2008-01-08 2008-01-08 Solder free from lead for additional supply and method of regulating cu concentration and ni concentration in solder bath

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
MYPI20080035 MY150455A (en) 2008-01-08 2008-01-08 Solder free from lead for additional supply and method of regulating cu concentration and ni concentration in solder bath

Publications (1)

Publication Number Publication Date
MY150455A true MY150455A (en) 2014-01-30

Family

ID=52595529

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20080035 MY150455A (en) 2008-01-08 2008-01-08 Solder free from lead for additional supply and method of regulating cu concentration and ni concentration in solder bath

Country Status (1)

Country Link
MY (1) MY150455A (en)

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