MY151817A - Release film for semiconductor resin molds - Google Patents

Release film for semiconductor resin molds

Info

Publication number
MY151817A
MY151817A MYPI20090646A MY151817A MY 151817 A MY151817 A MY 151817A MY PI20090646 A MYPI20090646 A MY PI20090646A MY 151817 A MY151817 A MY 151817A
Authority
MY
Malaysia
Prior art keywords
release film
resin molds
semiconductor resin
release
plastic support
Prior art date
Application number
Inventor
Okuya Tamao
Aruga Hiroshi
Higuchi Yoshiaki
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Publication of MY151817A publication Critical patent/MY151817A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/68—Release sheets
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H10W74/017—Auxiliary layers for moulds, e.g. release layers or layers preventing residue

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Laminated Bodies (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

TO PROVIDE A RELEASE FILM FOR SEMICONDUCTOR RESIN MOLDS HAVING LOW GAS PERMEABILITY, LITTLE MOLD CONTAMINATION BY A MOLD RESIN AND A HIGH RELEASABILITY. A GAS BARRIER RELEASE FILM FOR SEMICONDUCTOR RESIN MOLDS, WHICH IS A RELEASE FILM COMPRISING AT LEAST A RELEASE LAYER (I) HAVING EXCELLENT RELEASABILITY AND A PLASTIC SUPPORT LAYER (II) SUPPORTING THE RELEASE LAYER, WHEREIN THE PLASTIC SUPPORT LAYER (II) HAS A STRESS AT A 200% ELONGATION OF FROM 1MPa TO 50 MPa AT 170°C, AND THE RELEASE FILM HAS A XYLENE GAS PERMEABILITY OF AT MOST 5X1O¯¹? (KMOL.M/ (S.M² .KPA)). THE RELEASE FILM (I) IS PREFERABLY FORMED FROM A FLUORORESIN SUCH AS AN ETHYLENE/TETRAFLUOROETHYLENE COPOLYMER, AND THE PLASTIC SUPPORT LAYER (II) IS PREFERABLY FORMED FROM AN ETHYLENE/VINYL ALCOHOL COPOLYMER.
MYPI20090646 2006-08-18 2007-07-30 Release film for semiconductor resin molds MY151817A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006223565 2006-08-18

Publications (1)

Publication Number Publication Date
MY151817A true MY151817A (en) 2014-07-14

Family

ID=39082069

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20090646 MY151817A (en) 2006-08-18 2007-07-30 Release film for semiconductor resin molds

Country Status (6)

Country Link
JP (1) JP5110440B2 (en)
KR (1) KR101395520B1 (en)
CN (1) CN101506961B (en)
MY (1) MY151817A (en)
TW (1) TWI428226B (en)
WO (1) WO2008020543A1 (en)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5476680B2 (en) * 2008-05-29 2014-04-23 ダイキン工業株式会社 Release film
CN102271887B (en) * 2009-01-08 2014-03-05 旭硝子株式会社 Mold-releasing film and method for manufacturing light emitting diode
JP5297233B2 (en) * 2009-03-09 2013-09-25 三井化学株式会社 Release film for semiconductor encapsulation process and method for producing resin-encapsulated semiconductor using the same
JP5874632B2 (en) * 2010-12-07 2016-03-02 東洋紡株式会社 Mold release polyester film for molding process
JP5541468B2 (en) * 2012-02-20 2014-07-09 信越ポリマー株式会社 Release film
JP5822810B2 (en) * 2012-09-26 2015-11-24 信越ポリマー株式会社 Release film
JP5822811B2 (en) * 2012-09-26 2015-11-24 信越ポリマー株式会社 Release film
JP2014179593A (en) * 2013-02-15 2014-09-25 Nitto Denko Corp Sealing sheet for semiconductor elements, semiconductor device, and method for manufacturing semiconductor device
CN105340069B (en) * 2013-06-18 2018-06-08 积水化学工业株式会社 Mold release film
KR101486052B1 (en) * 2013-07-03 2015-01-23 고병수 Mold release sheet for semiconductor package manufacturing and manufacturing method thereof
CN104425290B (en) * 2013-08-27 2017-08-08 硕正科技股份有限公司 Released components for wafer packaging
WO2015068807A1 (en) 2013-11-07 2015-05-14 旭硝子株式会社 Mold release film and semiconductor package manufacturing method
DE112014005100B4 (en) * 2013-11-07 2024-01-11 AGC Inc. Mold release film and method for producing a semiconductor package
DE112015001137B4 (en) * 2014-03-07 2026-03-19 AGC Inc. Mold release film and method for producing an encapsulated body
JP6515933B2 (en) * 2014-11-20 2019-05-22 Ａｇｃ株式会社 Release film, method of manufacturing the same, and method of manufacturing semiconductor package
DE102015208980A1 (en) * 2015-05-15 2016-11-17 Infiana Germany Gmbh & Co. Kg An evacuable mold for fiber composite plastic components
SG11201806570SA (en) * 2016-02-01 2018-08-30 3M Innovative Properties Co Barrier composites
JP6738672B2 (en) * 2016-07-04 2020-08-12 倉敷紡績株式会社 Release film and method for manufacturing semiconductor package
CN106166863A (en) * 2016-08-11 2016-11-30 苏州柯创电子材料有限公司 High temperature resistant compound mould release membrance
JP6423399B2 (en) * 2016-09-27 2018-11-14 アピックヤマダ株式会社 Resin molding method, film conveying apparatus, and resin molding apparatus
JP6493628B2 (en) * 2017-03-24 2019-04-03 住友ベークライト株式会社 Release film for molding and molding method
KR20210018185A (en) * 2018-06-08 2021-02-17 구라시키 보세키 가부시키가이샤 Release film and release film manufacturing method
MX2020013655A (en) * 2018-06-22 2021-03-02 Kobayashi & Co Ltd Release film and method of manufacturing release film.
MY208460A (en) * 2018-06-22 2025-05-10 Kobayashi & Co Ltd Release film and method of manufacturing release film
CN112292263A (en) * 2018-06-22 2021-01-29 小林股份有限公司 Release film and method for producing release film
CN110718474B (en) * 2019-09-03 2022-08-16 富联裕展科技(深圳)有限公司 Packaging method, release part and manufacturing method thereof
JP6751974B1 (en) 2019-10-16 2020-09-09 株式会社コバヤシ Release film and method for manufacturing release film
KR102226153B1 (en) 2019-11-18 2021-03-10 실리콘밸리(주) release film for semiconductor mold with adjustable roughness, and manufacturing method thereof
JP7427480B2 (en) * 2020-03-09 2024-02-05 キオクシア株式会社 semiconductor equipment
KR102280585B1 (en) * 2021-01-15 2021-07-23 씰테크 주식회사 Release film for semiconductor package and method of manufacturing the same
KR102559027B1 (en) 2021-07-02 2023-07-24 (주)제론텍 Heatproof separator film for epoxy mold compound process of semiconductor

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001310336A (en) * 2000-04-28 2001-11-06 Asahi Glass Co Ltd Release film for resin molding
JP2002361643A (en) * 2001-06-01 2002-12-18 Hitachi Chem Co Ltd Release sheet for semiconductor mold
JP2004079566A (en) * 2002-08-09 2004-03-11 Hitachi Chem Co Ltd Release sheet for molding semiconductor element
JPWO2005115751A1 (en) * 2004-05-27 2008-03-27 三菱樹脂株式会社 Release film
JP2006049850A (en) * 2004-06-29 2006-02-16 Asahi Glass Co Ltd Release film for semiconductor chip sealing

Also Published As

Publication number Publication date
JP5110440B2 (en) 2012-12-26
KR20090042898A (en) 2009-05-04
TW200815175A (en) 2008-04-01
TWI428226B (en) 2014-03-01
JPWO2008020543A1 (en) 2010-01-07
KR101395520B1 (en) 2014-05-14
WO2008020543A1 (en) 2008-02-21
CN101506961A (en) 2009-08-12
CN101506961B (en) 2011-01-05

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