MY152852A - Liquid epoxy resin composition and adhesive using same - Google Patents

Liquid epoxy resin composition and adhesive using same

Info

Publication number
MY152852A
MY152852A MYPI20082644A MY152852A MY 152852 A MY152852 A MY 152852A MY PI20082644 A MYPI20082644 A MY PI20082644A MY 152852 A MY152852 A MY 152852A
Authority
MY
Malaysia
Prior art keywords
epoxy resin
liquid epoxy
resin composition
adhesive
composition
Prior art date
Application number
Inventor
Masa Taniguchi
Yuichi Watanabe
Hideki Kikuchi
Yasuo Matsumura
Original Assignee
Somar Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Somar Corp filed Critical Somar Corp
Publication of MY152852A publication Critical patent/MY152852A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H10W72/07338—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy hardening the adhesive by curing, e.g. thermosetting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)

Abstract

A LIQUID EPOXY RESIN COMPOSITION CONTAINS AT LEAST AN EPOXY RESIN AND A CURING AGENT. IN THE LIQUID EPOXY RESIN COMPOSITION, THE ADHESION STRENGTH (A) AFTER CURING THE COMPOSITION FOR 60 SECONDS AT 150°C ANDTHE ADHESION STRENGTH (B) AFTER CURING THE COMPOSITION FOR 1 HOUR AT 150°C SATISFY THE FOLLOWING RELATION: 0. 6B<A. PREFERABLY, THERE IS ALSO PROVIDED AN ADHESIVE CONTAINING A LIQUID EPOXY RESIN COMPOSITION WHERE THE ADHESION STRENGTH (A) AFTER CURING THE COMPOSITION FOR 60 SECONDS AT 150°C AND THE ADHESION STRENGTH (B) AFTER CURING THE COMPOSITION FOR 1 HOUR AT 150°C SATISFY THE FOLLOWING RELATION: 0.6B<A.
MYPI20082644 2006-01-17 2007-01-17 Liquid epoxy resin composition and adhesive using same MY152852A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006009303 2006-01-17
PCT/JP2006/301894 WO2007083397A1 (en) 2006-01-17 2006-02-03 Liquid epoxy resin composition and adhesive using the same

Publications (1)

Publication Number Publication Date
MY152852A true MY152852A (en) 2014-11-28

Family

ID=38287359

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20082644 MY152852A (en) 2006-01-17 2007-01-17 Liquid epoxy resin composition and adhesive using same

Country Status (4)

Country Link
JP (2) JPWO2007083673A1 (en)
CN (1) CN101400715B (en)
MY (1) MY152852A (en)
WO (1) WO2007083397A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6231256B2 (en) * 2011-12-15 2017-11-15 デクセリアルズ株式会社 Anisotropic conductive adhesive and method for connecting electronic parts
CN107111193A (en) * 2015-05-20 2017-08-29 积水化学工业株式会社 Sealing material for liquid crystal display device, up and down conductive material and liquid crystal display cells
JP6813313B2 (en) * 2016-09-09 2021-01-13 旭化成株式会社 Thermosetting adhesive
CN106987095B (en) * 2017-05-16 2018-09-28 广东博汇新材料科技股份有限公司 High transparency epoxy resin composition for prepreg and preparation method thereof
CN111518499A (en) * 2020-06-08 2020-08-11 武汉市三选科技有限公司 Underfill adhesive with stable adhesive force at high temperature and preparation method thereof

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6096617A (en) * 1983-10-31 1985-05-30 Asahi Chem Ind Co Ltd Curing of epoxy resin
JPS6372722A (en) * 1986-09-12 1988-04-02 Matsushita Electric Ind Co Ltd One-pack thermosetting epoxy resin composition
JPS6436672A (en) * 1987-07-31 1989-02-07 Somar Corp Epoxy polymer composition for bonding chip part
JPS6475555A (en) * 1987-09-17 1989-03-22 Ajinomoto Kk Epoxy resin composition
JPH07119273B2 (en) * 1990-05-30 1995-12-20 ソマール株式会社 Method for producing epoxy resin composition
JPH069758A (en) * 1992-06-23 1994-01-18 Mitsubishi Rayon Co Ltd Epoxy resin composition
JP3261749B2 (en) * 1992-08-04 2002-03-04 味の素株式会社 One-part epoxy resin composition
JP3351060B2 (en) * 1993-11-09 2002-11-25 松下電器産業株式会社 Adhesive for forming electronic circuit and method of applying adhesive
JPH07196999A (en) * 1993-12-28 1995-08-01 Kawasaki Steel Corp Epoxy adhesive and heavy anticorrosion coated steel using the same
JPH11256013A (en) * 1998-03-12 1999-09-21 Ajinomoto Co Inc Epoxy resin composition
JP2003133672A (en) * 2001-10-25 2003-05-09 Sanei Kagaku Kk Hole-filling material, printed wiring board with filled holes and method of manufacturing the same

Also Published As

Publication number Publication date
CN101400715B (en) 2012-01-25
JP2013100525A (en) 2013-05-23
JPWO2007083673A1 (en) 2009-06-11
CN101400715A (en) 2009-04-01
WO2007083397A1 (en) 2007-07-26
JP5739917B2 (en) 2015-06-24

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