MY153048A - Phenol resin mixture, epoxy resin mixture, epoxy resin composition and cured product - Google Patents
Phenol resin mixture, epoxy resin mixture, epoxy resin composition and cured productInfo
- Publication number
- MY153048A MY153048A MYPI20111931A MY153048A MY 153048 A MY153048 A MY 153048A MY PI20111931 A MYPI20111931 A MY PI20111931A MY 153048 A MY153048 A MY 153048A
- Authority
- MY
- Malaysia
- Prior art keywords
- epoxy resin
- resin mixture
- phenol
- resin composition
- composition containing
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title abstract 12
- 239000003822 epoxy resin Substances 0.000 title abstract 10
- 229920000647 polyepoxide Polymers 0.000 title abstract 10
- 239000005011 phenolic resin Substances 0.000 title abstract 3
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 abstract 2
- 239000000047 product Substances 0.000 abstract 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 abstract 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract 1
- 235000010290 biphenyl Nutrition 0.000 abstract 1
- 239000004305 biphenyl Substances 0.000 abstract 1
- 239000006227 byproduct Substances 0.000 abstract 1
- 238000006243 chemical reaction Methods 0.000 abstract 1
- 239000007795 chemical reaction product Substances 0.000 abstract 1
- 238000004132 cross linking Methods 0.000 abstract 1
- 238000006735 epoxidation reaction Methods 0.000 abstract 1
- 239000003063 flame retardant Substances 0.000 abstract 1
- 125000001570 methylene group Chemical class [H]C([H])([*:1])[*:2] 0.000 abstract 1
- 239000003566 sealing material Substances 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G61/02—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
- C08G59/063—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with epihalohydrins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L65/00—Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
THE PRESENT INVENTION RELATES TO A PHENOL RESIN MIXTURE OBTAINED BY METHYLENE CROSS-LINKING REACTION OF, WITH PHENOL, A REACTION PRODUCT WHICH IS OBTAINED BY HALOMETHYLATION OF BIPHENYL AND CONTAINS A SIDE PRODUCT, AN EPOXY RESIN MIXTURE OBTAINED BY EPOXIDATION OF SAID PHENOL RESIN MIXTURE, AND AN EPOXY RESIN COMPOSITION CONTAINING SAID EPOXY RESIN MIXTURE; THE EPOXY RESIN MIXTURE OF THE PRESENT INVENTION AND THE CURED PRODUCT OF THE EPOXY RESIN COMPOSITION CONTAINING IT HAVE NOT ONLY EXCELLENT FLAME RETARDANCY BUT ALSO A LOWER STORAGE ELASTIC MODULUS AT 250°C WITHIN A CERTAIN RANGE THAN CONVENTIONAL FLAME RETARDANT EPOXY RESIN CURED PRODUCTS, WHEREBY SAID EPOXY RESIN MIXTURE OR THE EPOXY RESIN COMPOSITION CONTAINING IT IS USEFUL AS A SEMICONDUCTOR SEALING MATERIAL WHERE HIGH FLAME RETARDANCY AND EXCELLENT LEAD-FREE SOLDER DURABILITY ARE REQUIRED.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008285856 | 2008-11-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY153048A true MY153048A (en) | 2014-12-31 |
Family
ID=42152691
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI20111931 MY153048A (en) | 2008-11-06 | 2009-10-30 | Phenol resin mixture, epoxy resin mixture, epoxy resin composition and cured product |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JP5486505B2 (en) |
| KR (1) | KR101564957B1 (en) |
| CN (1) | CN102209742B (en) |
| MY (1) | MY153048A (en) |
| TW (1) | TWI530511B (en) |
| WO (1) | WO2010052877A1 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4939521B2 (en) * | 2008-12-12 | 2012-05-30 | Ｊｆｅケミカル株式会社 | Method for producing 4,4'-biphenyldiylmethylene-phenol resin |
| JP2013237715A (en) * | 2012-05-11 | 2013-11-28 | Sumitomo Bakelite Co Ltd | Resin composition, prepreg, circuit board, and semiconductor apparatus |
| TWI666307B (en) * | 2015-06-04 | 2019-07-21 | 日商住友電木股份有限公司 | Resin composition for encapsulation, semiconductor device and structure |
| JP6708242B2 (en) * | 2018-11-14 | 2020-06-10 | 日立化成株式会社 | Resin composition for mold underfill and electronic component device |
| CN114276650B (en) * | 2021-11-05 | 2025-01-07 | 衡所华威电子有限公司 | Epoxy resin composition and preparation method thereof |
| TWI901332B (en) * | 2024-09-03 | 2025-10-11 | 長春人造樹脂廠股份有限公司 | Epoxy resin and applications thereof |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3122834B2 (en) * | 1994-09-20 | 2001-01-09 | 明和化成株式会社 | New phenol novolak condensate |
| JP3845977B2 (en) * | 1997-09-12 | 2006-11-15 | 宇部興産株式会社 | Method for producing 4,4'-bischloromethylbiphenyl |
| JPH11130706A (en) * | 1997-10-31 | 1999-05-18 | Ube Ind Ltd | Method for producing 4,4'-bischloromethylbiphenyl |
| JPH11140277A (en) * | 1997-11-10 | 1999-05-25 | Sumitomo Bakelite Co Ltd | Epoxy resin composition and semiconductor device using the same |
| JP3934829B2 (en) * | 1999-07-26 | 2007-06-20 | 日本化薬株式会社 | 4,4'-biphenyldiyldimethylene-phenol resin and process for producing the same |
| JP2001064340A (en) * | 1999-08-30 | 2001-03-13 | Nippon Kayaku Co Ltd | 4,4'-biphenydiyldimethylene-phenolic resin epoxy resin, epoxy resin composition, and its cured product |
| JP2006124492A (en) * | 2004-10-28 | 2006-05-18 | Nippon Kayaku Co Ltd | Epoxy resin and phenol resin |
| KR101229854B1 (en) * | 2005-02-25 | 2013-02-05 | 니폰 가야꾸 가부시끼가이샤 | Epoxy resin, hardenable resin composition containing the same and use thereof |
| WO2007015591A1 (en) * | 2005-08-02 | 2007-02-08 | Cheil Industries Inc. | Epoxy resin composition for packaging semiconductor device |
| WO2007063894A1 (en) * | 2005-11-30 | 2007-06-07 | Nippon Kayaku Kabushiki Kaisha | Phenolic resin, process for production thereof, epoxy resin, and use thereof |
| JP4979251B2 (en) * | 2006-03-24 | 2012-07-18 | エア・ウォーター株式会社 | Phenol polymer, its production method and its use |
-
2009
- 2009-10-30 MY MYPI20111931 patent/MY153048A/en unknown
- 2009-10-30 WO PCT/JP2009/005783 patent/WO2010052877A1/en not_active Ceased
- 2009-10-30 KR KR1020117010791A patent/KR101564957B1/en not_active Expired - Fee Related
- 2009-10-30 JP JP2010536675A patent/JP5486505B2/en not_active Expired - Fee Related
- 2009-10-30 CN CN200980144467.0A patent/CN102209742B/en not_active Expired - Fee Related
- 2009-11-03 TW TW098137197A patent/TWI530511B/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| JP5486505B2 (en) | 2014-05-07 |
| KR101564957B1 (en) | 2015-11-13 |
| TWI530511B (en) | 2016-04-21 |
| JPWO2010052877A1 (en) | 2012-04-05 |
| TW201026737A (en) | 2010-07-16 |
| CN102209742B (en) | 2013-03-27 |
| WO2010052877A1 (en) | 2010-05-14 |
| KR20110094278A (en) | 2011-08-23 |
| CN102209742A (en) | 2011-10-05 |
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