MY153473A - Method and system for cooling resin-sealed substrate, system for conveying such substrate, and resin-sealing system - Google Patents

Method and system for cooling resin-sealed substrate, system for conveying such substrate, and resin-sealing system

Info

Publication number
MY153473A
MY153473A MYPI2011003881A MYPI2011003881A MY153473A MY 153473 A MY153473 A MY 153473A MY PI2011003881 A MYPI2011003881 A MY PI2011003881A MY PI2011003881 A MYPI2011003881 A MY PI2011003881A MY 153473 A MY153473 A MY 153473A
Authority
MY
Malaysia
Prior art keywords
resin
sealed substrate
substrate
cooling
cooling member
Prior art date
Application number
MYPI2011003881A
Inventor
Takada Naoki
Izutani Kohei
Mizuma Keita
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Publication of MY153473A publication Critical patent/MY153473A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/16—Cooling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/02—Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/16—Cooling
    • B29C2035/1608—Cooling using Peltier-effect
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2791/00—Shaping characteristics in general
    • B29C2791/004—Shaping under special conditions
    • B29C2791/006—Using vacuum

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Oral & Maxillofacial Surgery (AREA)
  • Thermal Sciences (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A SYSTEM FOR COOLING A RESIN-SEALED SUBSTRATE WHILE PREVENTING ITS WARPING IS PROVIDED.THE SYSTEM INCLUDES: A HOLDER (40) FOR HOLDING A RESIN-SEALED SUBSTRATE (21A); AN ATTRACTING DEVICE, PROVIDED IN THE HOLDER, FOR ATTRACTING THE RESIN-SEALED SUBSTRATE 21A; AND A COOLING MEMBER (31), LOCATED AT A POSITION TOWARD WHICH THE ATTRACTING DEVICE ATTRACTS THE RESIN-SEALED SUBSTRATE, THE COOLING MEMBER HAVING A CONTACT SURFACE WITH WHICH THE RESIN-SEALED SUBSTRATE TIGHTLY CONTACTS.THE ATTRACTING DEVICE INCLUDES: AN ELASTIC SUPPORT (32) FOR FORMING A CLOSED SPACE BETWEEN THE RESIN-SEALED SUBSTRATE AND THE CONTACT SURFACE; A THROUGH-HOLE 33A WHICH IS PROVIDED IN THE COOLING MEMBER AT A POSITION WITHIN THE AFOREMENTIONED CLOSED SPACE AND PENETRATES THROUGH THE COOLING MEMBER IN THE THICKNESS DIRECTION THEREOF AND AN AIR-SUCKING DEVICE (33C) FOR DRAWING AIR FROM THE CLOSED SPACE THROUGH THE THROUGH-HOLE AND THE AIR-SUCKING CHANNEL (33B).
MYPI2011003881A 2010-08-27 2011-08-18 Method and system for cooling resin-sealed substrate, system for conveying such substrate, and resin-sealing system MY153473A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010190946A JP5411094B2 (en) 2010-08-27 2010-08-27 Resin-sealed substrate cooling device, cooling method and transfer device, and resin sealing device

Publications (1)

Publication Number Publication Date
MY153473A true MY153473A (en) 2015-02-13

Family

ID=45820973

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2011003881A MY153473A (en) 2010-08-27 2011-08-18 Method and system for cooling resin-sealed substrate, system for conveying such substrate, and resin-sealing system

Country Status (6)

Country Link
JP (1) JP5411094B2 (en)
KR (1) KR101614970B1 (en)
CN (1) CN102380937B (en)
MY (1) MY153473A (en)
SG (1) SG178687A1 (en)
TW (1) TWI542462B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102626978B (en) * 2012-04-28 2014-06-25 天津博信汽车零部件有限公司 Lower core block used in shaping of injection molded plastic product, and shaping device
TWI602267B (en) * 2014-06-13 2017-10-11 矽品精密工業股份有限公司 Package structure and its manufacturing method
JP6284996B1 (en) * 2016-11-04 2018-02-28 Ｔｏｗａ株式会社 Inspection method, resin sealing device, resin sealing method, and resin-sealed product manufacturing method
CN106965355A (en) * 2017-05-12 2017-07-21 浙江帝仕电子科技有限公司 Die assembly forming machine
JP6804409B2 (en) * 2017-08-04 2020-12-23 Ｔｏｗａ株式会社 Resin molding equipment and resin molded product manufacturing method
JP6923423B2 (en) * 2017-11-21 2021-08-18 Ｔｏｗａ株式会社 Manufacturing method of transport equipment, resin molding equipment and resin molded products

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57143833A (en) * 1981-02-27 1982-09-06 Nec Corp Manufacture of semiconductor device
JP2669698B2 (en) * 1989-10-16 1997-10-29 アピックヤマダ株式会社 Mold package and lead frame warpage prevention device
JP3099707B2 (en) * 1995-11-30 2000-10-16 日本電気株式会社 Resin sealing device for semiconductor device
JPH11329925A (en) * 1998-05-11 1999-11-30 Dainippon Screen Mfg Co Ltd Substrate heat treatment apparatus and substrate heat treatment method
JP3837736B2 (en) * 2001-07-02 2006-10-25 ウシオ電機株式会社 Work stage of resist curing equipment
JP4470199B2 (en) * 2003-09-25 2010-06-02 Ｓｍｃ株式会社 Semiconductor substrate temperature control device
JP4403960B2 (en) * 2004-12-15 2010-01-27 株式会社デンソー Resin molded product removal equipment
JP4084844B2 (en) * 2005-09-27 2008-04-30 Ｔｏｗａ株式会社 Resin sealing molding method and apparatus for electronic parts
JP5156579B2 (en) * 2008-10-31 2013-03-06 Ｔｏｗａ株式会社 Board loading / unloading device

Also Published As

Publication number Publication date
JP2012045839A (en) 2012-03-08
KR20120020089A (en) 2012-03-07
SG178687A1 (en) 2012-03-29
CN102380937B (en) 2015-08-05
KR101614970B1 (en) 2016-04-29
CN102380937A (en) 2012-03-21
TW201213081A (en) 2012-04-01
TWI542462B (en) 2016-07-21
JP5411094B2 (en) 2014-02-12

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