MY154043A - Taping unit and electronic component inspection apparatus - Google Patents

Taping unit and electronic component inspection apparatus

Info

Publication number
MY154043A
MY154043A MYPI2013701576A MYPI2013701576A MY154043A MY 154043 A MY154043 A MY 154043A MY PI2013701576 A MYPI2013701576 A MY PI2013701576A MY PI2013701576 A MYPI2013701576 A MY PI2013701576A MY 154043 A MY154043 A MY 154043A
Authority
MY
Malaysia
Prior art keywords
unit
electronic component
inspection
pocket
inspection apparatus
Prior art date
Application number
MYPI2013701576A
Inventor
Masato Miyata
Original Assignee
Ueno Seiki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ueno Seiki Co Ltd filed Critical Ueno Seiki Co Ltd
Publication of MY154043A publication Critical patent/MY154043A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3202—Mechanical details, e.g. rollers or belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects

Landscapes

  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

A TAPING UNIT (1) INCLUDES A CARRIER UNIT (10) AND A VISUAL INSPECTION UNIT (20), AND A HOLDER UNIT (30). THE CARRIER UNIT (10) FEEDS AN ELECTRONIC COMPONENT (D) RETAINED IN A POCKET (U) AT A RETAINING POSITION (P1) ALONG A CARRYING PATH (L). THE VISUAL INSPECTION UNIT (20) IS DISPOSED AT AN INSPECTION POSITION (P1) AT A DOWNSTREAM SIDE IN THE CARRYING DIRECTION WITH RESPECT TO THE RETAINING POSITION (P1), AND PERFORMS AN INSPECTION ON THE FED ELECTRONIC COMPONENT (D). THE HOLDER UNIT (30) MOVES LINEARLY BETWEEN THE RETAINING POSITION (P1) AND THE INSPECTION POSITION (P2) AND ABOVE THE CARRYING PATH (L). THE HOLDER UNIT (30) REMOVES THE ELECTRONIC COMPONENT (D) FROM THE POCKET (U) LOCATED AT THE INSPECTION POSITION (P2) IN ACCORDANCE WITH AN INSPECTION RESULT BY THE VISUAL INSPECTION UNIT (20). THE HOLDER UNIT (30) TAKES OUT AND HOLDS ANOTHER ELECTRONIC COMPONENT (D) FROM A POCKET (U) LOCATED AT THE RETAINING POSITION (P1), AND RETAINS THE TAKEN-OUT ELECTRONIC COMPONENT (D) IN THE POCKET (U) LOCATED AT THE INSPECTION POSITION (P2). (FIG. 1)
MYPI2013701576A 2012-09-06 2013-09-04 Taping unit and electronic component inspection apparatus MY154043A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012196593A JP5219056B1 (en) 2012-09-06 2012-09-06 Taping unit and electronic component inspection device

Publications (1)

Publication Number Publication Date
MY154043A true MY154043A (en) 2015-04-27

Family

ID=48778711

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2013701576A MY154043A (en) 2012-09-06 2013-09-04 Taping unit and electronic component inspection apparatus

Country Status (5)

Country Link
JP (1) JP5219056B1 (en)
KR (1) KR20140032323A (en)
CN (1) CN103476236B (en)
MY (1) MY154043A (en)
TW (1) TWI571188B (en)

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TWI541169B (en) * 2014-06-30 2016-07-11 All Ring Tech Co Ltd Method and device for conveying material
JP5835825B1 (en) * 2014-11-19 2015-12-24 上野精機株式会社 Carrier tape traveling device and electronic component conveying device
CN104459511B (en) * 2014-12-30 2017-03-22 常州银河电器有限公司 Braid diode screening and detecting device
JP2016156715A (en) * 2015-02-25 2016-09-01 セイコーエプソン株式会社 Electronic component conveying device and electronic component inspection device
CN105957819B (en) * 2016-06-30 2018-11-16 南通康比电子有限公司 Diode braid appearance test tooling and its method
DE202016004428U1 (en) * 2016-07-20 2017-10-23 Barry-Wehmiller Papersystems, Inc. Device for applying data carriers to a carrier web
CN107719738A (en) * 2016-08-11 2018-02-23 深圳安博电子有限公司 One kind carrier band heat-sealing device
JP6796363B2 (en) * 2016-10-05 2020-12-09 株式会社Ｆｕｊｉ Parts mounting machine
JP6926579B2 (en) * 2017-03-27 2021-08-25 Tdk株式会社 Parts packing device
WO2018188731A1 (en) * 2017-04-11 2018-10-18 Muehlbauer GmbH & Co. KG Component receiving device with optical sensor
CN108169608A (en) * 2017-12-13 2018-06-15 格力电器（武汉）有限公司 Braid component detection equipment
CN108033050B (en) * 2017-12-27 2019-10-22 福建省将乐县长兴电子有限公司 A kind of crystal oscillator packing machine
EP3506340B1 (en) * 2017-12-28 2020-10-21 Nexperia B.V. Bonding and indexing apparatus
CN110435957A (en) * 2019-08-22 2019-11-12 广东利扬芯片测试股份有限公司 Integrated circuit surveys volume all-in-one machine from carrier band is moved
CN112810873B (en) * 2021-02-06 2025-10-31 东莞市台工电子机械科技有限公司 SMD crystal full-automatic packaging machine
CN114563352B (en) * 2022-04-27 2022-07-19 深圳市标谱半导体科技有限公司 Light source installation component and braid detection device
CN117382966B (en) * 2023-11-30 2025-12-26 苏州东京熔接有限公司 Tape and reel equipment and tape and reel methods

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JPH04267711A (en) * 1991-02-23 1992-09-24 Dainippon Printing Co Ltd Electronic component taping equipment
JP3561279B2 (en) * 1992-07-21 2004-09-02 ローム株式会社 Refilling device for taping electronic components
JPH085454B2 (en) * 1993-04-28 1996-01-24 株式会社コオエイ Transfer device for small parts
JPH07329915A (en) * 1994-06-10 1995-12-19 Rohm Co Ltd Continuous taping apparatus for electronic parts
JPH1159615A (en) * 1997-08-26 1999-03-02 Seiwa Sangyo Kk Taping equipment for electronic parts
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JP2001228098A (en) * 2000-02-14 2001-08-24 Sony Corp Inspection and taping equipment
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JP4297350B2 (en) * 2003-04-28 2009-07-15 Ｔｄｋ株式会社 Chip component conveying method and apparatus, and appearance inspection method and apparatus
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Also Published As

Publication number Publication date
CN103476236A (en) 2013-12-25
JP2014052269A (en) 2014-03-20
KR20140032323A (en) 2014-03-14
CN103476236B (en) 2017-11-14
JP5219056B1 (en) 2013-06-26
TWI571188B (en) 2017-02-11
TW201412207A (en) 2014-03-16

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