MY155143A - Mold cleaning rubber composition - Google Patents

Mold cleaning rubber composition

Info

Publication number
MY155143A
MY155143A MYPI2010000928A MYPI20100928A MY155143A MY 155143 A MY155143 A MY 155143A MY PI2010000928 A MYPI2010000928 A MY PI2010000928A MY PI20100928 A MYPI20100928 A MY PI20100928A MY 155143 A MY155143 A MY 155143A
Authority
MY
Malaysia
Prior art keywords
rubber
seconds
cure
rubber composition
hardness
Prior art date
Application number
MYPI2010000928A
Inventor
Nomura Hiroaki
Hiromitsu Kiyohito
Sunago Osamu
Original Assignee
Nippon Carbide Kogyo Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Carbide Kogyo Kk filed Critical Nippon Carbide Kogyo Kk
Publication of MY155143A publication Critical patent/MY155143A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/70—Maintenance
    • B29C33/72—Cleaning
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/16—Ethylene-propylene or ethylene-propylene-diene copolymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2021/00—Use of unspecified rubbers as moulding material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/14—Peroxides

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

A RUBBER COMPOSITION FOR CLEANING A MOLD TO REMOVE STAINS DEPOSITED DURING MOLDING OF A CURING RESIN, IN WHICH AN UNVULCANIZED RUBBER COMPRISING AN ETHYLENE-PROPYLENE RUBBER AND A BUTADIENE RUBBER IN A MIXING RATIO OF 90/10 TO 50/50 IS USED AS A BASE RESIN. THE UNVULCANIZED RUBBER HAS A 90% CURE TIME (OPTIMUM CURE POINT) TC(90) OF FROM 50 TO 100 SECONDS OR FROM 200 TO 400 SECONDS AT A MOLD TEMPERATURE OF 175°C AND, AFTER CURE, AN ELONGATION OF 80% TO 800%, A TENSILE STRENGTH OF 3 TO 10 MPA, AND A RUBBER HARDNESS (DUROMETER A HARDNESS) OF 60 TO 95. FOR USE TO MOLDS HAVING DEEP CAVITIES FOR SMALL PACKAGES, SUCH AS PDIPS AND SOICS, PARTICULARLY THOSE FOR SMALL PACKAGES WITH A SMALL NUMBER OF PINS, THE COMPOSITION PREFERABLY COMPRISES THE UNVULCANIZED RUBBER HAVING TC(90) OF 200 TO 400 SECONDS AND A RELEASE AGENT.
MYPI2010000928A 2007-10-29 2008-10-21 Mold cleaning rubber composition MY155143A (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007279837 2007-10-29
JP2008075044 2008-03-24
JP2008075045 2008-03-24
JP2008242103 2008-09-22

Publications (1)

Publication Number Publication Date
MY155143A true MY155143A (en) 2015-09-15

Family

ID=40590871

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2010000928A MY155143A (en) 2007-10-29 2008-10-21 Mold cleaning rubber composition

Country Status (6)

Country Link
JP (1) JP5391072B2 (en)
KR (1) KR101491757B1 (en)
CN (1) CN101821075B (en)
MY (1) MY155143A (en)
TW (1) TWI428384B (en)
WO (1) WO2009057479A1 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009122955A1 (en) * 2008-03-31 2009-10-08 日本カーバイド工業株式会社 Rubber composition for recovering mold releasability
MY177272A (en) * 2009-07-17 2020-09-10 Nitto Denko Corp Mold cleaner composition and mold cleaning material, and mold cleaning method using the same
JP5604822B2 (en) * 2009-07-17 2014-10-15 日立化成株式会社 Semiconductor device molding die cleaning composition, semiconductor device molding die cleaning material, and semiconductor device molding die cleaning method using the same
JP5975991B2 (en) * 2011-06-13 2016-08-23 日本カーバイド工業株式会社 Mold cleaning resin composition
CN103304901B (en) * 2012-03-14 2017-03-01 日本电石工业株式会社 Resin composition for cleaning mold and cleaning mold method
CN102775656B (en) * 2012-07-15 2015-06-03 湖州师范学院 Rubber composition used for cleaning integrated circuit (IC) die
JP6188697B2 (en) * 2012-09-14 2017-08-30 日本カーバイド工業株式会社 Mold release recovery resin composition and mold release recovery method
CN104955627B (en) * 2013-01-31 2018-02-13 日本电石工业株式会社 Resin composition for cleaning mold and cleaning mold method
CN103205032A (en) * 2013-03-14 2013-07-17 西北工业大学 Mold cleaning rubber for in-place mold cleaning and preparation method of mold cleaning rubber
KR101656255B1 (en) * 2014-04-04 2016-09-12 (주)휴이노베이션 Eco-friendly and high functional Rubber Composition for Cleaning and Releasing Mold of Enhanced detergency
CN107022424A (en) * 2017-03-08 2017-08-08 安徽国晶微电子有限公司 A kind of cleaning reagent for integrated circuit packaging mould
CN109957186A (en) * 2017-12-22 2019-07-02 四川素恩吉科技有限公司 A kind of mold composition
KR102304403B1 (en) 2019-12-18 2021-09-17 황진상 Resin composition for mold cleaning and manufacturing method thereof
KR102325676B1 (en) 2019-12-18 2021-11-11 황진상 Resin composition for mold cleaning and manufacturing method thereof
CN114456504A (en) * 2022-01-28 2022-05-10 厦门市麦华橡胶制品有限公司 Environment-friendly peroxide vulcanized EPDM material suitable for automatic demolding and preparation method thereof

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH069827B2 (en) * 1987-07-24 1994-02-09 日東電工株式会社 Mold cleaning composition
JPH0381110A (en) * 1989-08-24 1991-04-05 Matsushita Electric Works Ltd Molding material and method for cleaning of die
JP2974267B2 (en) * 1991-09-30 1999-11-10 日本カーバイド工業株式会社 Rubber composition for mold cleaning
JP2967842B2 (en) * 1991-10-24 1999-10-25 日本カーバイド工業株式会社 Rubber material for mold cleaning
JPH09262842A (en) * 1996-03-28 1997-10-07 Nitto Denko Corp Mold cleaning method
JP3764239B2 (en) * 1996-12-10 2006-04-05 日東電工株式会社 Mold cleaning composition for molding semiconductor device and mold cleaning method using the same

Also Published As

Publication number Publication date
CN101821075A (en) 2010-09-01
KR101491757B1 (en) 2015-02-11
JP5391072B2 (en) 2014-01-15
KR20100085025A (en) 2010-07-28
HK1143565A1 (en) 2011-01-07
TWI428384B (en) 2014-03-01
CN101821075B (en) 2013-11-20
TW200930757A (en) 2009-07-16
JPWO2009057479A1 (en) 2011-03-10
WO2009057479A1 (en) 2009-05-07

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