MY155995A - Prepreg, laminate, printed wiring board, and semiconductor device - Google Patents

Prepreg, laminate, printed wiring board, and semiconductor device

Info

Publication number
MY155995A
MY155995A MYPI2013002669A MYPI2013002669A MY155995A MY 155995 A MY155995 A MY 155995A MY PI2013002669 A MYPI2013002669 A MY PI2013002669A MY PI2013002669 A MYPI2013002669 A MY PI2013002669A MY 155995 A MY155995 A MY 155995A
Authority
MY
Malaysia
Prior art keywords
prepreg
semiconductor device
wiring board
printed wiring
laminate
Prior art date
Application number
MYPI2013002669A
Inventor
Ohigashi Noriyuki
Original Assignee
Sumitomo Bakelite Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co filed Critical Sumitomo Bakelite Co
Publication of MY155995A publication Critical patent/MY155995A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B32B5/024—Woven fabric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/102—Oxide or hydroxide
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/14—Semiconductor wafers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/029—Woven fibrous reinforcement or textile

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Textile Engineering (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

PREPREG RELATED TO THE INVENTION IS PREPREG (40) FORMED BY IMPREGNATING FIBER WOVEN FABRIC (20) CONSTITUTED BY STRANDS WITH A RESIN COMPOSITION. IN THE PREPREG (40) RELATED TO THE INVENTION, SILICA PARTICLES ARE PRESENT IN THE STRAND. ACCORDING TO THIS, PREPREG (40) IN WHICH IMPREGNATION PROPERTIES OF THE RESIN COMPOSITION WITH RESPECT TO THE FIBER WOVEN FABRIC (20) IS EXCELLENT MAY BE OBTAINED. IN ADDITION, A PRINTED WIRING BOARD AND A SEMICONDUCTOR DEVICE MAY BE MANUFACTURED USING THE PREPREG (40) AND/OR A METAL-CLAD LAMINATE (51, 52) MANUFACTURED USING THE PREPREG (40). (FIGURES 1(A), (B) AND (C))
MYPI2013002669A 2011-01-24 2012-01-19 Prepreg, laminate, printed wiring board, and semiconductor device MY155995A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011012166 2011-01-24

Publications (1)

Publication Number Publication Date
MY155995A true MY155995A (en) 2015-12-31

Family

ID=46580569

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2013002669A MY155995A (en) 2011-01-24 2012-01-19 Prepreg, laminate, printed wiring board, and semiconductor device

Country Status (6)

Country Link
JP (1) JP5234195B2 (en)
KR (1) KR101355777B1 (en)
CN (1) CN103347938B (en)
MY (1) MY155995A (en)
TW (1) TWI539869B (en)
WO (1) WO2012101991A1 (en)

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JP6008104B2 (en) * 2012-09-04 2016-10-19 住友ベークライト株式会社 Prepreg and metal-clad laminate
JP6217069B2 (en) * 2012-10-26 2017-10-25 住友ベークライト株式会社 Resin substrate, metal-clad laminate, printed wiring board, and semiconductor device
JP2014111719A (en) * 2012-11-12 2014-06-19 Panasonic Corp Laminate, metal-clad laminate, printed wiring board, and multilayer printed wiring board
JP6226232B2 (en) * 2012-11-12 2017-11-08 パナソニックＩｐマネジメント株式会社 Metal-clad laminate, metal-clad laminate production method, printed wiring board, multilayer printed wiring board
DE102012025409A1 (en) * 2012-12-20 2014-06-26 Thomas Hofmann CONDUCTOR PLATE WITH NATURAL AGGREGATE MATERIAL
JP6327429B2 (en) * 2013-08-01 2018-05-23 パナソニックＩｐマネジメント株式会社 Resin composition, resin varnish, prepreg, metal-clad laminate, and printed wiring board
JP6221620B2 (en) * 2013-10-22 2017-11-01 住友ベークライト株式会社 Metal-clad laminate, printed wiring board, and semiconductor device
CN105764684B (en) * 2013-11-29 2017-03-01 日东纺绩株式会社 Glass fiber cloth resin combination laminated body
CN103796435B (en) * 2014-01-16 2017-08-11 广州兴森快捷电路科技有限公司 The method that measurement circuitry flaggy presses off normal
JP2016069401A (en) * 2014-09-26 2016-05-09 住友ベークライト株式会社 Prepreg, resin substrate, metal-clad laminate, printed wiring board, and semiconductor device
JP6435947B2 (en) * 2015-03-24 2018-12-12 住友ベークライト株式会社 Filler impregnation rate evaluation method, filler impregnation rate evaluation apparatus, and computer program
JP6497652B2 (en) * 2015-04-15 2019-04-10 京セラ株式会社 Epoxy resin molding material for sealing and electronic parts
KR102810893B1 (en) 2016-05-25 2025-05-20 가부시끼가이샤 레조낙 Metal-clad laminate, printed wiring board and semiconductor package
JP6972522B2 (en) * 2016-09-01 2021-11-24 住友ベークライト株式会社 Prepregs, metal-clad laminates, printed wiring boards and semiconductor packages
TWI737851B (en) * 2016-11-09 2021-09-01 日商昭和電工材料股份有限公司 Printed circuit board and semiconductor package
WO2019073763A1 (en) * 2017-10-10 2019-04-18 味の素株式会社 Cured article, production method therefor, resin sheet, and resin composition
WO2019111416A1 (en) * 2017-12-08 2019-06-13 日立化成株式会社 Prepreg, layered plate, method for manufacturing prepreg and layered plate, printed wiring board, and semiconductor package
JP7123744B2 (en) * 2018-10-26 2022-08-23 旭化成株式会社 Long glass cloth rolls, prepregs, and printed wiring boards
CN112423463A (en) * 2019-08-23 2021-02-26 鹏鼎控股(深圳)股份有限公司 Multilayer circuit board and manufacturing method thereof
JP6874924B1 (en) * 2019-08-27 2021-05-19 日東紡績株式会社 Glass cloth, prepreg, and glass fiber reinforced resin molded products
CN113529237B (en) * 2020-03-30 2023-04-07 旭化成株式会社 Roll-shaped long glass cloth, prepreg, and printed wiring board
WO2021261284A1 (en) * 2020-06-26 2021-12-30 日本特殊陶業株式会社 Joined body and electrostatic chuck
CN112566356B (en) * 2020-11-20 2022-03-18 深圳市金晟达电子技术有限公司 Millimeter wave radar printed circuit board
DE102021117278B4 (en) * 2021-07-05 2023-05-04 Lisa Dräxlmaier GmbH CIRCUIT BOARD FOR A VEHICLE CONTROL UNIT AND METHOD FOR MANUFACTURING SUCH CIRCUIT BOARD
EP4631690A1 (en) * 2022-12-07 2025-10-15 Resonac Corporation Prepreg, laminated plate, metal-clad laminated plate, printed wiring board, semiconductor package, method for manufacturing prepreg, and method for manufacturing metal-clad laminated plate
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Also Published As

Publication number Publication date
JP2012167256A (en) 2012-09-06
CN103347938B (en) 2014-07-30
KR101355777B1 (en) 2014-02-04
KR20130102654A (en) 2013-09-17
TWI539869B (en) 2016-06-21
WO2012101991A1 (en) 2012-08-02
JP5234195B2 (en) 2013-07-10
CN103347938A (en) 2013-10-09
TW201251534A (en) 2012-12-16

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