MY156182A - Resin composition - Google Patents

Resin composition

Info

Publication number
MY156182A
MY156182A MYPI2013000691A MYPI2013000691A MY156182A MY 156182 A MY156182 A MY 156182A MY PI2013000691 A MYPI2013000691 A MY PI2013000691A MY PI2013000691 A MYPI2013000691 A MY PI2013000691A MY 156182 A MY156182 A MY 156182A
Authority
MY
Malaysia
Prior art keywords
resin composition
radical polymerization
preferably contains
invention preferably
acrylic resin
Prior art date
Application number
MYPI2013000691A
Inventor
Iwaya Kazuki
Original Assignee
Namics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Namics Corp filed Critical Namics Corp
Publication of MY156182A publication Critical patent/MY156182A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
    • C08G75/02—Polythioethers
    • C08G75/04—Polythioethers from mercapto compounds or metallic derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
    • C08G75/02—Polythioethers
    • C08G75/04—Polythioethers from mercapto compounds or metallic derivatives thereof
    • C08G75/045—Polythioethers from mercapto compounds or metallic derivatives thereof from mercapto compounds and unsaturated compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
    • C08G75/14—Polysulfides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/37—Thiols
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J147/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds; Adhesives based on derivatives of such polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2200/00—Chemical nature of materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K2200/06—Macromolecular organic compounds, e.g. prepolymers
    • C09K2200/0615—Macromolecular organic compounds, e.g. prepolymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C09K2200/0625—Polyacrylic esters or derivatives thereof

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Epoxy Resins (AREA)
  • Sealing Material Composition (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

THE PRESENT INVENTION PROVIDES A PHOTO-AND HEAT-CURABLE RESIN COMPOSITION HAVING A SUFFICIENTLY LONG POT LIFE. THE RESIN COMPOSITION OF THE INVENTION CONTAINS (A) AN ACRYLIC RESIN, (B) A THIOL COMPOUND, (C) A LATENT CURING AGENT, (D) A RADICAL POLYMERIZATION INHIBITOR, AND (E) AN ANION POLYMERIZATION RETARDER. FURTHER, THE RESIN COMPOSITION OF THE INVENTION PREFERABLY CONTAINS (F) A RADICAL POLYMERIZATION INITIATOR. IN ADDITION, THE RESIN COMPOSITION OF THE INVENTION PREFERABLY CONTAINS (G) A COMPOUND HAVING TWO OR MORE DOUBLE BONDS OTHER THAN AN ACRYLIC RESIN. NO SUITABLE
MYPI2013000691A 2011-07-07 2012-04-27 Resin composition MY156182A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011150872A JP4976575B1 (en) 2011-07-07 2011-07-07 Resin composition

Publications (1)

Publication Number Publication Date
MY156182A true MY156182A (en) 2016-01-15

Family

ID=46678849

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2013000691A MY156182A (en) 2011-07-07 2012-04-27 Resin composition

Country Status (7)

Country Link
JP (1) JP4976575B1 (en)
KR (1) KR20140032931A (en)
CN (1) CN103097436A (en)
MY (1) MY156182A (en)
PH (1) PH12013500393B1 (en)
TW (1) TWI579310B (en)
WO (1) WO2013005471A1 (en)

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CN106554245A (en) * 2015-09-30 2017-04-05 中国石油化工股份有限公司 A kind of polymerization inhibitors for styrene rectification and its configuration, application process
CN108350147B (en) * 2015-11-04 2021-07-06 三菱化学株式会社 Curable Compositions, Adhesives, Coated Articles, Fiber Reinforced Composites, Casting Compounds, and Curable Composition Kits
JP6699145B2 (en) * 2015-11-30 2020-05-27 味の素株式会社 Light and thermosetting resin composition
JP6864436B2 (en) * 2016-03-24 2021-04-28 ナミックス株式会社 Resin composition, adhesive, cured product, semiconductor device
JP6948114B2 (en) 2016-06-15 2021-10-13 デクセリアルズ株式会社 Thermosetting epoxy resin composition and its manufacturing method
JP6971476B2 (en) * 2016-07-04 2021-11-24 ナミックス株式会社 Adhesive compositions, cured products, precision parts
ES2932518T3 (en) 2016-07-26 2023-01-20 Ppg Ind Ohio Inc Curable compositions containing 1,1-diactivated vinyl compounds and related coatings and processes
ES2930531T3 (en) 2016-07-26 2022-12-16 Ppg Ind Ohio Inc Particles having surfaces functionalized with 1,1-diactivated vinyl compounds
EP3490726B1 (en) 2016-07-26 2022-11-30 PPG Industries Ohio, Inc. Multi-layer curable compositions containing 1,1-di-activated vinyl compound products and related processes
US11136469B2 (en) 2016-07-26 2021-10-05 Ppg Industries Ohio, Inc. Acid-catalyzed curable coating compositions containing 1,1-di-activated vinyl compounds and related coatings and processes
EP3490724B1 (en) 2016-07-26 2023-09-20 PPG Industries Ohio, Inc. Polyurethane coating compositions containing 1,1-di-activated vinyl compounds and related coatings and processes
CN109642098B (en) 2016-07-26 2022-02-11 Ppg工业俄亥俄公司 Electrodepositable coating compositions comprising 1,1-diactivated vinyl compounds
ES2928648T3 (en) 2016-07-26 2022-11-21 Ppg Ind Ohio Inc Three-dimensional printing processes through the use of 1,1-di-activated vinyl compounds
JP6873489B2 (en) * 2016-09-12 2021-05-19 ナミックス株式会社 Resin compositions, adhesives, encapsulants, dams, and semiconductor devices
US10934411B2 (en) 2016-09-30 2021-03-02 Ppg Industries Ohio, Inc. Curable compositions containing 1,1-di-activated vinyl compounds that cure by pericyclic reaction mechanisms
KR102511665B1 (en) * 2017-03-29 2023-03-20 아지노모토 가부시키가이샤 Curable Compositions and Structures
JP6935233B2 (en) * 2017-05-19 2021-09-15 日本ペイント・オートモーティブコーティングス株式会社 Clear paint composition and clear coating film forming method
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PH12020500618B1 (en) 2018-01-30 2024-02-21 Namics Corp Resin composition and cured material of same, adhesive, semiconductor device, and electronic component
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Also Published As

Publication number Publication date
JP2014077024A (en) 2014-05-01
PH12013500393A1 (en) 2017-08-28
WO2013005471A1 (en) 2013-01-10
PH12013500393B1 (en) 2017-11-22
KR20140032931A (en) 2014-03-17
TW201305224A (en) 2013-02-01
CN103097436A (en) 2013-05-08
JP4976575B1 (en) 2012-07-18
TWI579310B (en) 2017-04-21

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