MY156182A - Resin composition - Google Patents

Resin composition

Info

Publication number
MY156182A
MY156182A MYPI2013000691A MYPI2013000691A MY156182A MY 156182 A MY156182 A MY 156182A MY PI2013000691 A MYPI2013000691 A MY PI2013000691A MY PI2013000691 A MYPI2013000691 A MY PI2013000691A MY 156182 A MY156182 A MY 156182A
Authority
MY
Malaysia
Prior art keywords
resin composition
radical polymerization
preferably contains
invention preferably
acrylic resin
Prior art date
Application number
MYPI2013000691A
Inventor
Iwaya Kazuki
Original Assignee
Namics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Namics Corp filed Critical Namics Corp
Publication of MY156182A publication Critical patent/MY156182A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
    • C08G75/02—Polythioethers
    • C08G75/04—Polythioethers from mercapto compounds or metallic derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
    • C08G75/02—Polythioethers
    • C08G75/04—Polythioethers from mercapto compounds or metallic derivatives thereof
    • C08G75/045—Polythioethers from mercapto compounds or metallic derivatives thereof from mercapto compounds and unsaturated compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
    • C08G75/14—Polysulfides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/37—Thiols
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J147/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds; Adhesives based on derivatives of such polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2200/00—Chemical nature of materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K2200/06—Macromolecular organic compounds, e.g. prepolymers
    • C09K2200/0615—Macromolecular organic compounds, e.g. prepolymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C09K2200/0625—Polyacrylic esters or derivatives thereof

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Sealing Material Composition (AREA)

Abstract

THE PRESENT INVENTION PROVIDES A PHOTO-AND HEAT-CURABLE RESIN COMPOSITION HAVING A SUFFICIENTLY LONG POT LIFE. THE RESIN COMPOSITION OF THE INVENTION CONTAINS (A) AN ACRYLIC RESIN, (B) A THIOL COMPOUND, (C) A LATENT CURING AGENT, (D) A RADICAL POLYMERIZATION INHIBITOR, AND (E) AN ANION POLYMERIZATION RETARDER. FURTHER, THE RESIN COMPOSITION OF THE INVENTION PREFERABLY CONTAINS (F) A RADICAL POLYMERIZATION INITIATOR. IN ADDITION, THE RESIN COMPOSITION OF THE INVENTION PREFERABLY CONTAINS (G) A COMPOUND HAVING TWO OR MORE DOUBLE BONDS OTHER THAN AN ACRYLIC RESIN. NO SUITABLE
MYPI2013000691A 2011-07-07 2012-04-27 Resin composition MY156182A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011150872A JP4976575B1 (en) 2011-07-07 2011-07-07 Resin composition

Publications (1)

Publication Number Publication Date
MY156182A true MY156182A (en) 2016-01-15

Family

ID=46678849

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2013000691A MY156182A (en) 2011-07-07 2012-04-27 Resin composition

Country Status (7)

Country Link
JP (1) JP4976575B1 (en)
KR (1) KR20140032931A (en)
CN (1) CN103097436A (en)
MY (1) MY156182A (en)
PH (1) PH12013500393B1 (en)
TW (1) TWI579310B (en)
WO (1) WO2013005471A1 (en)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6495182B2 (en) * 2013-12-24 2019-04-03 株式会社ブリヂストン Adhesive sheet, method for producing the same, and laminate
US9328274B2 (en) * 2014-03-07 2016-05-03 Prc-Desoto International, Inc. Michael acceptor-terminated urethane-containing fuel resistant prepolymers and compositions thereof
JP6547221B2 (en) * 2014-12-16 2019-07-24 リンテック株式会社 Adhesive for die bonding
CN107406741B (en) * 2015-03-12 2020-06-12 纳美仕有限公司 Semiconductor device and image sensor module
US10221282B2 (en) 2015-03-12 2019-03-05 Namics Corporation Resin composition, adhesive agent, and sealing agent
CN106554245A (en) * 2015-09-30 2017-04-05 中国石油化工股份有限公司 A kind of polymerization inhibitors for styrene rectification and its configuration, application process
WO2017077928A1 (en) * 2015-11-04 2017-05-11 三菱レイヨン株式会社 Curable composition, adhesive, article having coating layer, fiber-reinforced composite material, potting agent and curable composition kit
JP6699145B2 (en) * 2015-11-30 2020-05-27 味の素株式会社 Light and thermosetting resin composition
JP6864436B2 (en) * 2016-03-24 2021-04-28 ナミックス株式会社 Resin composition, adhesive, cured product, semiconductor device
JP6948114B2 (en) * 2016-06-15 2021-10-13 デクセリアルズ株式会社 Thermosetting epoxy resin composition and its manufacturing method
WO2018008462A1 (en) * 2016-07-04 2018-01-11 ナミックス株式会社 Adhesive composition, cured product, and precision part
US11136469B2 (en) 2016-07-26 2021-10-05 Ppg Industries Ohio, Inc. Acid-catalyzed curable coating compositions containing 1,1-di-activated vinyl compounds and related coatings and processes
ES2957658T3 (en) 2016-07-26 2024-01-23 Ppg Ind Ohio Inc Polyurethane coating compositions containing 1,1-diactivated vinyl compounds and related coatings and processes
CN109476081B (en) 2016-07-26 2021-11-23 Ppg工业俄亥俄公司 Three-dimensional printing method using 1,1-di activated vinyl compound
CN109475903B (en) 2016-07-26 2021-11-26 Ppg工业俄亥俄公司 Multilayer curable compositions containing 1, 1-di activated vinyl compound products and related processes
CN109642098B (en) 2016-07-26 2022-02-11 Ppg工业俄亥俄公司 Electrodepositable coating compositions comprising 1,1-diactivated vinyl compounds
JP7498561B2 (en) 2016-07-26 2024-06-12 ピーピージー・インダストリーズ・オハイオ・インコーポレイテッド CURABLE COMPOSITIONS CONTAINING 1,1-DIACTIVATED VINYL COMPOUNDS AND RELATED COATINGS AND METHODS - Patent application
WO2018022794A1 (en) 2016-07-26 2018-02-01 Ppg Industries Ohio, Inc. Particles having surfaces functionalized with 1,1-di-activated vinyl compounds
WO2018047849A1 (en) * 2016-09-12 2018-03-15 ナミックス株式会社 Resin composition, adhesive, sealing material, dam agent, and semiconductor device
US10934411B2 (en) 2016-09-30 2021-03-02 Ppg Industries Ohio, Inc. Curable compositions containing 1,1-di-activated vinyl compounds that cure by pericyclic reaction mechanisms
WO2018181421A1 (en) * 2017-03-29 2018-10-04 味の素株式会社 Curable composition and structure
JP6935233B2 (en) * 2017-05-19 2021-09-15 日本ペイント・オートモーティブコーティングス株式会社 Clear paint composition and clear coating film forming method
KR102465098B1 (en) * 2017-12-28 2022-11-10 헨켈 아게 운트 코. 카게아아 Epoxy based composition
JP7266881B2 (en) 2018-01-30 2023-05-01 ナミックス株式会社 Photocurable and thermosetting resin compositions and their cured products, adhesives, semiconductor devices, and electronic components
KR102816836B1 (en) * 2018-10-05 2025-06-09 나믹스 가부시끼가이샤 Resin composition
WO2020080391A1 (en) 2018-10-17 2020-04-23 ナミックス株式会社 Resin composition
CN112250866B (en) * 2019-07-22 2023-04-07 江汉大学 Preparation method of free radical type photocuring resin with thioether as main chain
JP7552221B2 (en) * 2019-10-31 2024-09-18 味の素株式会社 Curable Composition
CN112745770B (en) * 2019-10-31 2024-08-02 味之素株式会社 Curable composition
EP3960828A1 (en) * 2020-08-31 2022-03-02 Henkel AG & Co. KGaA Resin composition and cured product thereof
EP4341354A4 (en) * 2021-05-21 2025-02-19 Henkel AG & Co. KGaA CURABLE COMPOSITION AND USE THEREOF
JPWO2023276773A1 (en) * 2021-06-28 2023-01-05
JP7828657B2 (en) 2021-07-14 2026-03-12 ナミックス株式会社 Curable resin composition
WO2023286701A1 (en) 2021-07-14 2023-01-19 ナミックス株式会社 Curable resin composition
KR20240032948A (en) 2021-07-14 2024-03-12 나믹스 가부시끼가이샤 Curable Resin Composition
JPWO2023017752A1 (en) 2021-08-10 2023-02-16
JPWO2023042600A1 (en) * 2021-09-15 2023-03-23

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1212199A (en) * 1981-06-01 1986-09-30 Ju-Chao Liu Hot strength cyanoacrylate adhesive composition
EP0287019A3 (en) * 1987-04-16 1990-07-11 W.R. Grace & Co.-Conn. Aqueous developable, radiation curable composition
JP3367531B2 (en) * 1992-10-22 2003-01-14 味の素株式会社 Epoxy resin composition
JP3367532B2 (en) * 1992-10-22 2003-01-14 味の素株式会社 Epoxy resin composition
JPH1121352A (en) * 1997-07-03 1999-01-26 Toray Ind Inc Curable composition
JPH11256013A (en) * 1998-03-12 1999-09-21 Ajinomoto Co Inc Epoxy resin composition
JP3882374B2 (en) * 1999-02-12 2007-02-14 味の素株式会社 Conductive resin composition
JP2005139401A (en) * 2003-11-10 2005-06-02 Sekisui Chem Co Ltd Photo-curing adhesive for polarizing plate and liquid crystal display panel
KR100736240B1 (en) * 2003-11-26 2007-07-06 미쓰이 가가쿠 가부시키가이샤 One-pack-type resin composition curable with combination of light and heat and use of the same
CN1934158B (en) * 2004-01-22 2010-06-09 味之素株式会社 One-component epoxy resin composition
JP4280205B2 (en) * 2004-06-16 2009-06-17 三井化学株式会社 Manufacturing method of plastic lens
JP2008001867A (en) * 2006-06-26 2008-01-10 Three Bond Co Ltd Curable resin composition
JP5311744B2 (en) * 2007-01-29 2013-10-09 地方独立行政法人 大阪市立工業研究所 Ultraviolet curable resin composition, the cured product, and various articles derived therefrom
JP2009051954A (en) * 2007-08-28 2009-03-12 Three Bond Co Ltd Photo and heat curable composition, and cured product using the same
JP2009126974A (en) * 2007-11-26 2009-06-11 Three Bond Co Ltd Resin composition
JP5375011B2 (en) * 2008-10-02 2013-12-25 横浜ゴム株式会社 One-component thermosetting epoxy resin composition
JP2010117545A (en) * 2008-11-13 2010-05-27 Asahi Kasei E-Materials Corp Photosensitive resin composition and application thereof
JP5801556B2 (en) * 2008-12-18 2015-10-28 ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング Photocurable resin composition for ultraviolet LED irradiation
JP5558118B2 (en) * 2009-07-01 2014-07-23 旭化成イーマテリアルズ株式会社 Microcapsule type epoxy resin curing agent and masterbatch type epoxy resin curing agent composition containing the same
JP5531482B2 (en) * 2009-07-28 2014-06-25 Ｄｉｃ株式会社 Active energy ray-curable resin composition and cured product thereof
JP2011213821A (en) * 2010-03-31 2011-10-27 Sekisui Chem Co Ltd Curable composition and transparent composite sheet
JP5647533B2 (en) * 2010-06-07 2014-12-24 昭和電工株式会社 Stabilized polyene-polythiol curable resin composition

Also Published As

Publication number Publication date
CN103097436A (en) 2013-05-08
WO2013005471A1 (en) 2013-01-10
JP4976575B1 (en) 2012-07-18
JP2014077024A (en) 2014-05-01
KR20140032931A (en) 2014-03-17
TW201305224A (en) 2013-02-01
PH12013500393B1 (en) 2017-11-22
TWI579310B (en) 2017-04-21
PH12013500393A1 (en) 2017-08-28

Similar Documents

Publication Publication Date Title
MY156182A (en) Resin composition
PH12017501623B1 (en) Resin composition, adhesive agent, and sealing agent
WO2013023732A8 (en) Ternesite used as an activator for latent-hydraulic and pozzolanic materials
BR112015005491A2 (en) modified macromolecular compound, method for making modified macromolecular compound, polymer composition, vulcanized polymer composition, method for making a vulcanized polymer composition, article, amino silane polymerization initiator compound and method for making amino silane polymerization initiator
MY177183A (en) Water-dispersed pressure-sensitive adhesive composition and pressure-sensitive adhesive
BR112017013230A2 (en) epoxy resin composition
WO2013103533A3 (en) Free radical polymerizable compositions comprising ionic silicones
EP4006089A4 (en) Resin composition
GEP20156341B (en) Anticoagulant antidotes
EP4233771A3 (en) Vulcanization composition having reduced allergenic potential
MX2013014571A (en) Adhesive additive.
WO2009058843A3 (en) Dental compositions and initiator systems with color-stable amine electron donors
MX2015017334A (en) Use of a 2-octyl acrylate polymer as a binding agent in a coating composition.
SG10201909098PA (en) Compositions and devices for sclerotherapy using light hardening glues
MX336450B (en) Polyester resin comprising a biopolyol.
EP4541541A3 (en) Construction panel having improved fixing strength
MX2015011166A (en) Photochromic curable composition.
MX2018008732A (en) Inhibition of allergic reaction using an il-33 inhibitor.
EP3187514A4 (en) Polymerizable monomer, curable composition and resin member
EP2653492A4 (en) Masterbatch-type latent curing agent for epoxy resin, and epoxy resin composition using the same
EP3894507A4 (en) HIGH STRENGTH SILANE MODIFIED POLYMER ADHESIVE COMPOSITION
MX2016011950A (en) Photopolymerisable and dual curing dental materials based on thiourea derivatives.
ATE533814T1 (en) MODIFIED OLEFIN POLYMERS
MX2018006772A (en) Copolymer, method for producing same and resin composition.
EP4006106A4 (en) Resin composition for imprinting