MY157363A - Phosphorus containing epoxy resin and phosphorus containing eppxy resin composition, process for producing the same, and curable resin composition and cured object each containing or obtained from the resin and resin composition - Google Patents

Phosphorus containing epoxy resin and phosphorus containing eppxy resin composition, process for producing the same, and curable resin composition and cured object each containing or obtained from the resin and resin composition

Info

Publication number
MY157363A
MY157363A MYPI2010002027A MYPI20102027A MY157363A MY 157363 A MY157363 A MY 157363A MY PI2010002027 A MYPI2010002027 A MY PI2010002027A MY PI20102027 A MYPI20102027 A MY PI20102027A MY 157363 A MY157363 A MY 157363A
Authority
MY
Malaysia
Prior art keywords
resin composition
resin
phosphorus
general formula
epoxy resin
Prior art date
Application number
MYPI2010002027A
Inventor
Nakanishi Tetsuya
Ishihara Kazuo
Original Assignee
Nippon Steel & Sumikin Chem Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel & Sumikin Chem Co filed Critical Nippon Steel & Sumikin Chem Co
Publication of MY157363A publication Critical patent/MY157363A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1488—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/304—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3254—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/695—Organic materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Epoxy Resins (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

A PHOSPHORUS-CONTAINING PHENOL COMPOUND REPRESENTED BY THE GENERAL FORMULA (2) IN WHICH THE CONTENT OF A COMPOUND REPRESENTED BY THE GENERAL FORMULA (1) IS 2.5 WT.% OR LOWER IS USED TO OBTAIN A PHOSPHORUS-CONTAINING EPOXY RESIN HAVING HIGH CURABILITY. THIS HIGHLY REACTIVE PHOSPHORUS-CONTAINING EPOXY RESIN AND A PHOSPHORUS-CONTAINING EPOXY RESIN COMPOSITION CONTAINING THE RESIN ARE SUITABLE FOR USE IN APPLICATIONS SUCH AS A SEALING MATERIAL, MOLDING MATERIAL, POTTING MATERIAL, ADHESIVE, MATERIAL FOR ELECTRICAL INSULATING COATINGS, ELECTRICAL INSULATING SHEET, RESIN-COATED COPPER FOIL, PREPREG, ELECTRICAL LAMINATE, FOR USE IN PRODUCING COPPER-CLAD LAMINATES FOR ELECTRONIC CIRCUIT BOARDS AND IN PRODUCING ELECTRONIC PARTS. ALSO PROVIDED ARE: A CURABLE RESIN COMPOSITION CONTAINING OF THE RESIN AND THE RESIN COMPOSITION; AND A CURED OBJECT OBTAINED FROM EITHER OF THE RESIN AND THE RESIN COMPOSITION. GENERAL FORMULA (1) (1) SYMBOL IS 0 OR 1. R1 AND R2 EACH REPRESENTS HYDROGEN OR A HYDROCARBON GROUP, MAY BE THE SAME OR DIFFERENT, AND MAY BE LINEAR, BRANCHED, OR CYCLIC.R1 AND R2 MAY BE BONDED TO EACH OTHER TO FORM A CYCLIC STRUCTURE. B REPRESENTS ANY OF BENZENE, BIPHENYL, NAPHTHALENE, ANTHRANCENE, PHENANTHRENE, AND SUBSTITUTED FORMS OF THESE HYDROCARBONS. GENERAL FORMULA (2) (2) SYMBOL N IS 0 OR 1. R1 AND R2 EACH REPRESENTS HYDROGEN OR A HYDROCARBON GROUP, MAY BE THE SAME DIFFERENT, AND MAY BE LINEAR, BRANCHED, OR CYCLIC. R1 AND R2 MAY BE BONDED TO EACH OTHER TO FORM A CYCLIC STRUCTURE. B REPRESENTS ANY OF BENZENE, BIPHENYL, NAPHTHALENE, ANTHRANCENE, PHENANTHRENE, AND SUBSTITUTED FORMS OF THESE HYDROCARBONS.
MYPI2010002027A 2007-11-09 2008-11-06 Phosphorus containing epoxy resin and phosphorus containing eppxy resin composition, process for producing the same, and curable resin composition and cured object each containing or obtained from the resin and resin composition MY157363A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007292094 2007-11-09
JP2008023014 2008-02-01

Publications (1)

Publication Number Publication Date
MY157363A true MY157363A (en) 2016-05-31

Family

ID=40625868

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2010002027A MY157363A (en) 2007-11-09 2008-11-06 Phosphorus containing epoxy resin and phosphorus containing eppxy resin composition, process for producing the same, and curable resin composition and cured object each containing or obtained from the resin and resin composition

Country Status (5)

Country Link
JP (1) JP5632163B2 (en)
CN (1) CN101883806B (en)
MY (1) MY157363A (en)
TW (1) TWI481637B (en)
WO (1) WO2009060987A1 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5388518B2 (en) * 2008-09-16 2014-01-15 新日鉄住金化学株式会社 Phosphorus-containing phenol compound and method for producing the same, curable resin composition and cured product using the compound
JP5686512B2 (en) * 2009-11-05 2015-03-18 新日鉄住金化学株式会社 Phosphorus-containing epoxy resin, resin composition, and flame-retardant cured product thereof
TW201122014A (en) * 2009-12-25 2011-07-01 Nippon Steel Chemical Co Epoxy resin, epoxy resin composition and cured article thereof
JP5544184B2 (en) * 2010-02-08 2014-07-09 新日鉄住金化学株式会社 Method for producing phosphorus-containing epoxy resin, epoxy resin composition and cured product thereof
TW201219438A (en) * 2010-08-26 2012-05-16 Nippon Steel Chemical Co providing an epoxy resin cured article capable of giving excellent high thermal decomposition stability, high heat tolerance, low thermal expansibility, flame retardancy, and low hygroscopicity
CN102757547B (en) * 2011-04-27 2016-07-06 新日铁住金化学株式会社 The phosphorous epoxy resin with nitrogen
JP5947504B2 (en) * 2011-08-23 2016-07-06 三光株式会社 Method for producing high-melting-point flame retardant crystal, method for producing flame retardant-containing epoxy resin composition, prepreg using the composition, and method for producing flame retardant laminate
CN109293881B (en) * 2012-06-15 2021-04-13 日铁化学材料株式会社 Phosphorus-containing epoxy resin, composition containing the epoxy resin as essential component, and cured product
CN104356360B (en) * 2014-11-06 2017-06-30 济南圣泉集团股份有限公司 The preparation method of Tg Halogenless fire retarded epoxy resins high
WO2018180267A1 (en) 2017-03-29 2018-10-04 新日鉄住金化学株式会社 Phosphorus-containing phenolic compound, phosphorus-containing epoxy resin, curable resin composition thereof, or epoxy resin composition and cured product thereof
CN107383337A (en) * 2017-07-31 2017-11-24 镇江利德尔复合材料有限公司 A kind of halogen-free flame-retardant vinyl ester resin and preparation method thereof

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60126293A (en) * 1983-12-09 1985-07-05 Sanko Kaihatsu Kagaku Kenkyusho:Kk Cyclic organic phosphorus compound and production thereof
JPS61236787A (en) * 1985-04-15 1986-10-22 Sanko Kagaku Kk Cyclic organic phosphorus compound and production thereof
JPH0631276B2 (en) * 1992-09-11 1994-04-27 三光化学株式会社 Organic cyclic phosphorus compound and method for producing the same
EP1167417A4 (en) * 1999-01-28 2002-11-06 Takeda Chemical Industries Ltd FLAME RETARDANT VINYLESTERS, RESINS AND RESIN COMPOSITIONS CONTAINING SAID VINYLESTERS, AND HARDENED PRODUCTS OBTAINED THEREFROM
JP3642403B2 (en) * 1999-02-23 2005-04-27 大日本インキ化学工業株式会社 Flame retardant epoxy resin composition and method for producing flame retardant epoxy resin
JP4837175B2 (en) * 2001-02-23 2011-12-14 新日鐵化学株式会社 Phosphorus-containing epoxy resin composition

Also Published As

Publication number Publication date
TWI481637B (en) 2015-04-21
JP5632163B2 (en) 2014-11-26
JPWO2009060987A1 (en) 2011-03-24
TW201024331A (en) 2010-07-01
CN101883806B (en) 2013-08-14
CN101883806A (en) 2010-11-10
WO2009060987A1 (en) 2009-05-14

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