MY158931A - Silver Powder and Process for Manufacturing Same - Google Patents

Silver Powder and Process for Manufacturing Same

Info

Publication number
MY158931A
MY158931A MYPI2013701717A MYPI2013701717A MY158931A MY 158931 A MY158931 A MY 158931A MY PI2013701717 A MYPI2013701717 A MY PI2013701717A MY PI2013701717 A MYPI2013701717 A MY PI2013701717A MY 158931 A MY158931 A MY 158931A
Authority
MY
Malaysia
Prior art keywords
silver powder
powder
manufacturing same
time
flakes
Prior art date
Application number
MYPI2013701717A
Inventor
Tsuyoshi Kawashima
Mika Okada
Eiji Ishida
Tomomichi Nihei
Toshiaki Terao
Original Assignee
Sumitomo Metal Mining Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Mining Co filed Critical Sumitomo Metal Mining Co
Publication of MY158931A publication Critical patent/MY158931A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K9/00—Arc welding or cutting
    • B23K9/24—Features related to electrodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/12—Metallic powder containing non-metallic particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K9/00—Arc welding or cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Powder Metallurgy (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

TO PRODUCE A SILVER POWDER THAT EXERTS GOOD DISPERSIBILITY IN A SOLVENT AT THE TIME OF FORMING A PASTE, AND CAN SUPPRESS GENERATION OF BULKY POWDER, SUCH AS FLAKES OR THE LIKE, AT THE TIME OF A KNEADING PROCESS. THE PRESENT INVENTION IS CHARACTERIZED BY USING A SILVER POWDER HAVING A COHESIVE FORCE IN A RANGE FROM—0.2 N/CM2 OR MORE TO 0.7 N/CM2 OR LESS, A COMPRESSION RATE OF 20 TO 50% UPON MEASUREMENTS OF A POWDER LAYER SHARING STRESS AND AN ABSORBED AMOUNT OF DIBUTYL PHTHALATE OF 3.0 TO 9.0 ML/100 G MEASURED BY A METHOD BASED ON JIS-K6217-4.
MYPI2013701717A 2011-06-08 2012-06-08 Silver Powder and Process for Manufacturing Same MY158931A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011128015 2011-06-08

Publications (1)

Publication Number Publication Date
MY158931A true MY158931A (en) 2016-11-30

Family

ID=47296181

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2013701717A MY158931A (en) 2011-06-08 2012-06-08 Silver Powder and Process for Manufacturing Same

Country Status (6)

Country Link
JP (1) JP5288063B2 (en)
KR (1) KR101885391B1 (en)
CN (1) CN103079728B (en)
MY (1) MY158931A (en)
TW (1) TWI574761B (en)
WO (1) WO2012169628A1 (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5500237B1 (en) * 2012-12-05 2014-05-21 住友金属鉱山株式会社 Silver powder
JP5505535B1 (en) * 2012-12-07 2014-05-28 住友金属鉱山株式会社 Silver powder
JP6115405B2 (en) * 2013-08-28 2017-04-19 住友金属鉱山株式会社 Silver powder manufacturing method
JP6115406B2 (en) * 2013-08-28 2017-04-19 住友金属鉱山株式会社 Silver powder manufacturing method
JP6404554B2 (en) * 2013-10-03 2018-10-10 住友金属鉱山株式会社 Silver powder manufacturing method
JP6404553B2 (en) * 2013-10-03 2018-10-10 住友金属鉱山株式会社 Silver solution management method and silver powder production method
JP6206248B2 (en) * 2014-02-26 2017-10-04 住友金属鉱山株式会社 Method for evaluating coarse particles of conductive powder contained in conductive paste
JP6252275B2 (en) * 2014-03-20 2017-12-27 住友金属鉱山株式会社 Silver powder and method for producing the same
JP6282616B2 (en) * 2014-07-30 2018-02-21 Ｄｏｗａエレクトロニクス株式会社 Silver powder and method for producing the same
US10307825B2 (en) * 2015-01-30 2019-06-04 Sumitomo Electric Industries, Ltd. Metal powder, ink, sintered body, substrate for printed circuit board, and method for manufacturing metal powder
JP6727922B2 (en) * 2016-05-20 2020-07-22 Ｄｏｗａエレクトロニクス株式会社 Silver powder, method for producing the same, and conductive paste
CN112430443B (en) * 2019-08-26 2022-12-23 京瓷株式会社 Thermally conductive adhesive sheet, method of manufacturing thermally conductive adhesive sheet, and semiconductor device
WO2021039794A1 (en) * 2019-08-26 2021-03-04 京セラ株式会社 Method for producing silver particles, thermosetting resin composition, semiconductor device, and electric/electronic part
CA3174953A1 (en) * 2020-04-14 2021-10-21 Yasuhiro Kamahori Method for producing inorganic fine powder
CN113192690B (en) * 2021-04-07 2023-05-09 湖南中伟新银材料科技有限公司 Preparation method of UV-cured conductive silver paste
CN113192689B (en) * 2021-04-07 2023-05-09 湖南中伟新银材料科技有限公司 Preparation method and application of silver powder dispersion

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09256008A (en) * 1996-03-15 1997-09-30 Noritake Co Ltd Production of monodispersive silver-palladium multiple powder and the same powder
JP3751154B2 (en) 1998-10-22 2006-03-01 同和鉱業株式会社 Silver powder manufacturing method
JP2004043892A (en) * 2002-07-11 2004-02-12 Sumitomo Electric Ind Ltd Noble metal fine particles and method for producing the same
JP3991218B2 (en) 2002-12-20 2007-10-17 信越化学工業株式会社 Conductive adhesive and method for producing the same
KR101375488B1 (en) * 2006-07-28 2014-03-18 후루카와 덴키 고교 가부시키가이샤 Fine particle dispersion and method for producing fine particle dispersion
JP4248002B2 (en) * 2007-03-22 2009-04-02 古河電気工業株式会社 Fine particle dispersion and method for producing fine particle dispersion
EP2030706B1 (en) * 2007-08-31 2010-11-10 Metalor Technologies International S.A. Method of preparing nanoparticles of silver
JP2010236007A (en) * 2009-03-31 2010-10-21 Mitsubishi Materials Corp Spherical silver particles, method for producing silver particles, and production apparatus
JP5568255B2 (en) * 2009-06-17 2014-08-06 住友金属鉱山株式会社 Silver powder and method for producing the same
CN101599310A (en) * 2009-07-02 2009-12-09 张祥成 Hydrophilic nano micron-sized microphase half-detached conductive Ag/AgCl reference electrode pastes and preparation method thereof
JP5297344B2 (en) * 2009-11-04 2013-09-25 京都エレックス株式会社 Heat curable conductive paste composition

Also Published As

Publication number Publication date
JP5288063B2 (en) 2013-09-11
TWI574761B (en) 2017-03-21
CN103079728B (en) 2015-06-24
JPWO2012169628A1 (en) 2015-02-23
CN103079728A (en) 2013-05-01
KR20140030091A (en) 2014-03-11
WO2012169628A1 (en) 2012-12-13
KR101885391B1 (en) 2018-08-03
TW201311377A (en) 2013-03-16

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