MY159481A - Polishing composition - Google Patents

Polishing composition

Info

Publication number
MY159481A
MY159481A MYPI2012003494A MYPI2012003494A MY159481A MY 159481 A MY159481 A MY 159481A MY PI2012003494 A MYPI2012003494 A MY PI2012003494A MY PI2012003494 A MYPI2012003494 A MY PI2012003494A MY 159481 A MY159481 A MY 159481A
Authority
MY
Malaysia
Prior art keywords
electrolyte
polishing composition
salt
acid
polishing
Prior art date
Application number
MYPI2012003494A
Inventor
Rika Tanaka
Original Assignee
Nitta Haas Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitta Haas Inc filed Critical Nitta Haas Inc
Publication of MY159481A publication Critical patent/MY159481A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C19/00—Surface treatment of glass, not in the form of fibres or filaments, by mechanical means
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/06—Planarisation of inorganic insulating materials
    • H10P95/062—Planarisation of inorganic insulating materials involving a dielectric removal step

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

A POLISHING COMPOSITION THAT IS CAPABLE OF ATTAINING A HIGH SiOx (0 < x ≤ 2) POLISHING RATE IS PROVIDED. THE POLISHING COMPOSITION CONTAINS COLLOIDAL SILICA AND AN ADDITIVE COMPOSED OF AN ELECTROLYTE OR A SALT OF THE ELECTROLYTE THAT RELEASES HYDROGEN IONS IN AN AQUEOUS SOLUTION. THE ELECTROLYTE IS COMPOSED OF SULFURIC ACID, PYROPHOSPHORIC ACID, PHOSPHORIC ACID, OR THE LIKE, AND THE SALT OF THE ELECTROLYTE IS COMPOSED OF AMMONIUM SULFATE OR THE LIKE. NO SUITABLE
MYPI2012003494A 2010-02-03 2011-01-28 Polishing composition MY159481A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010022411 2010-02-03

Publications (1)

Publication Number Publication Date
MY159481A true MY159481A (en) 2017-01-13

Family

ID=44355330

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2012003494A MY159481A (en) 2010-02-03 2011-01-28 Polishing composition

Country Status (6)

Country Link
JP (1) JP5132820B2 (en)
CN (1) CN102741370B (en)
MY (1) MY159481A (en)
PH (1) PH12012501585A1 (en)
TW (1) TWI537368B (en)
WO (1) WO2011096331A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103484024B (en) * 2013-09-13 2014-10-15 上海新安纳电子科技有限公司 Chemico-mechanical polishing liquid for silicon dioxide dielectric materials and preparing method thereof
JP6373029B2 (en) * 2014-03-27 2018-08-15 株式会社フジミインコーポレーテッド Polishing composition
JP7330668B2 (en) * 2018-03-08 2023-08-22 株式会社フジミインコーポレーテッド Surface treatment composition, method for producing surface treatment composition, method for surface treatment, and method for production of semiconductor substrate
JP7409918B2 (en) * 2020-03-13 2024-01-09 株式会社フジミインコーポレーテッド Polishing composition, method for producing polishing composition, polishing method, and method for producing semiconductor substrate

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5319887B2 (en) * 2005-01-05 2013-10-16 ニッタ・ハース株式会社 Slurry for polishing
JP2007012679A (en) * 2005-06-28 2007-01-18 Asahi Glass Co Ltd Abrasive and method for manufacturing semiconductor integrated circuit device
JP2008124377A (en) * 2006-11-15 2008-05-29 Jsr Corp Chemical mechanical polishing aqueous dispersion, chemical mechanical polishing method, and kit for preparing chemical mechanical polishing aqueous dispersion
JP2009164188A (en) * 2007-12-28 2009-07-23 Fujimi Inc Polishing composition

Also Published As

Publication number Publication date
TWI537368B (en) 2016-06-11
JPWO2011096331A1 (en) 2013-06-10
PH12012501585A1 (en) 2012-10-22
CN102741370A (en) 2012-10-17
CN102741370B (en) 2015-10-14
TW201137099A (en) 2011-11-01
WO2011096331A1 (en) 2011-08-11
JP5132820B2 (en) 2013-01-30

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