MY159804A - Dicing tape for processing semiconductor - Google Patents

Dicing tape for processing semiconductor

Info

Publication number
MY159804A
MY159804A MYPI2013004007A MYPI2013004007A MY159804A MY 159804 A MY159804 A MY 159804A MY PI2013004007 A MYPI2013004007 A MY PI2013004007A MY PI2013004007 A MYPI2013004007 A MY PI2013004007A MY 159804 A MY159804 A MY 159804A
Authority
MY
Malaysia
Prior art keywords
adhesive agent
agent layer
dicing tape
radiation
exposure
Prior art date
Application number
MYPI2013004007A
Inventor
Akira Akutsu
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of MY159804A publication Critical patent/MY159804A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/103—Esters of polyhydric alcohols or polyhydric phenols of trialcohols, e.g. trimethylolpropane tri(meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H10P72/7418—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding of passive members, e.g. a chip mounting substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H10P72/742—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/744—Details of chemical or physical process used for separating the auxiliary support from a device or a wafer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)

Abstract

THE PRESENT INVENTION PROVIDES A DICING TAPE FOR PROCESSING A SEMICONDUCTOR FOR USE IN A PROCESS OF DICING A SEMICONDUCTOR PACKAGE, WHEREIN: A RADIATION CURABLE ADHESIVE AGENT LAYER (5) IS FORMED ON AT LEAST ONE SURFACE OF A BASE FILM (3); THE ADHESIVE AGENT LAYER (5) INCLUDES A RESIN COMPOSITION CONTAINING AN ACRYLIC POLYMER AS A BASE POLYMER; THE ADHESIVE AGENT LAYER (5) HAS A THICKNESS OF 10 TO 30 µm; THE ADHESIVE AGENT LAYER (5) AFTER EXPOSURE TO RADIATION HAS AN ADHESION OF 1.0 TO 2.0 N/25 MM TAPE WIDTH TO SUS304 AS MEASURED BY A 90° PEEL TEST ACCORDING TO JIS Z0237; AND THE ADHESIVE AGENT LAYER (5) AFTER EXPOSURE TO RADIATION UNDER AN ATMOSPHERIC CONDITION HAS A PEAK PROBE TACK STRENGTH OF 50 TO 150 MN/MM2. THE MOST ILLUSTRATIVE DRAWING IS
MYPI2013004007A 2011-10-28 2012-10-22 Dicing tape for processing semiconductor MY159804A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011237223A JP5053455B1 (en) 2011-10-28 2011-10-28 Dicing tape for semiconductor processing

Publications (1)

Publication Number Publication Date
MY159804A true MY159804A (en) 2017-02-15

Family

ID=47189506

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2013004007A MY159804A (en) 2011-10-28 2012-10-22 Dicing tape for processing semiconductor

Country Status (5)

Country Link
JP (1) JP5053455B1 (en)
CN (1) CN103620743B (en)
MY (1) MY159804A (en)
TW (1) TWI421322B (en)
WO (1) WO2013061931A1 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101636378B1 (en) * 2013-08-28 2016-07-05 주식회사 엘지화학 Module Housing for Unit Module Having Heat Radiation Structure and Battery Module Comprising the Same
JP6472972B2 (en) * 2013-10-23 2019-02-20 三井・デュポンポリケミカル株式会社 Resin composition for dicing tape substrate and dicing tape substrate
JP6482818B2 (en) * 2013-10-23 2019-03-13 リンテック株式会社 Dicing sheet
JP5718515B1 (en) * 2014-01-23 2015-05-13 古河電気工業株式会社 Adhesive tape for protecting semiconductor wafer surface and method for processing semiconductor wafer
JP6753631B2 (en) * 2014-09-09 2020-09-09 リケンテクノス株式会社 Film processing method
JP6536188B2 (en) * 2015-06-05 2019-07-03 コニカミノルタ株式会社 Dielectric multilayer film
MY191606A (en) * 2015-10-05 2022-07-01 Lintec Corp Sheet for semiconductor processing
KR102117112B1 (en) * 2016-04-06 2020-05-29 주식회사 엘지화학 Adhesive composition for semiconductor, method for the same and protection film for semiconductor
TWI797154B (en) * 2018-01-31 2023-04-01 日商三星鑽石工業股份有限公司 Film peeling mechanism and substrate breaking system
TWI799618B (en) * 2018-09-03 2023-04-21 日商麥克賽爾股份有限公司 Adhesive tape for dicing and method of manufacturing semiconductor wafer
JP7269095B2 (en) * 2019-05-29 2023-05-08 古河電気工業株式会社 glass processing tape
JP7555758B2 (en) * 2020-08-12 2024-09-25 リンテック株式会社 Sheet for forming protective film and processing method for sheet for forming protective film
WO2022097471A1 (en) * 2020-11-09 2022-05-12 デンカ株式会社 Pressure-sensitive adhesive tape and processing method

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4794971B2 (en) * 2005-03-23 2011-10-19 古河電気工業株式会社 Dicing die bond sheet
JP4493643B2 (en) * 2006-12-06 2010-06-30 日東電工株式会社 Re-peelable pressure-sensitive adhesive composition, and pressure-sensitive adhesive tape or sheet
CN102015953B (en) * 2008-04-25 2015-01-14 Lg化学株式会社 Epoxy-based composition, adhesive film, dicing die-bonding film and semiconductor device
TWI400311B (en) * 2008-05-14 2013-07-01 Ｌｇ化學股份有限公司 Pressure sensitive adhesive composition, pressure sensitive adhesive sheet and semiconductor wafer back grinding method using same
JP4318743B1 (en) * 2008-10-07 2009-08-26 昭和高分子株式会社 Ultraviolet curable removable pressure-sensitive adhesive composition and pressure-sensitive adhesive sheet using the same
JP5569148B2 (en) * 2009-05-28 2014-08-13 日立化成株式会社 Dicing tape, dicing tape integrated adhesive sheet, semiconductor device, and method for manufacturing semiconductor device
JP5089710B2 (en) * 2010-01-05 2012-12-05 日東電工株式会社 Adhesive tape or sheet
JP5488001B2 (en) * 2010-01-28 2014-05-14 日立化成株式会社 Method for manufacturing semiconductor chip with adhesive and method for manufacturing semiconductor device

Also Published As

Publication number Publication date
CN103620743B (en) 2015-04-01
JP5053455B1 (en) 2012-10-17
CN103620743A (en) 2014-03-05
TWI421322B (en) 2014-01-01
JP2013098224A (en) 2013-05-20
WO2013061931A1 (en) 2013-05-02
TW201326347A (en) 2013-07-01

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