MY160200A - Resin composition for sealing an optical semiconductor and optical semiconductor device using said resin composition - Google Patents

Resin composition for sealing an optical semiconductor and optical semiconductor device using said resin composition

Info

Publication number
MY160200A
MY160200A MYPI2012003298A MYPI2012003298A MY160200A MY 160200 A MY160200 A MY 160200A MY PI2012003298 A MYPI2012003298 A MY PI2012003298A MY PI2012003298 A MYPI2012003298 A MY PI2012003298A MY 160200 A MY160200 A MY 160200A
Authority
MY
Malaysia
Prior art keywords
resin composition
optical semiconductor
curing agent
compounds
sealing
Prior art date
Application number
MYPI2012003298A
Inventor
Noriko Kimura
Original Assignee
Daicel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daicel Corp filed Critical Daicel Corp
Publication of MY160200A publication Critical patent/MY160200A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/688—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4215—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof cycloaliphatic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

DISCLOSED IS A RESIN COMPOSITION FOR SEALING AN OPTICAL SEMICONDUCTOR, WHICH CONTAINS AN EPOXY RESIN, A CURING AGENT, AND A CURING ACCELERATOR AND CONTAINS, AS AN ALICYCLIC EPOXY RESIN (A), AT LEAST ONE SELECTED FROM THE GROUP CONSISTING OF COMPOUNDS REPRESENTED BY FOLLOWING FORMULA (I), COMPOUNDS HAVING AN EPOXY GROUP BONDED DIRECTLY TO AN ALICYCLE THROUGH A SINGLE BOND, AND COMPOUNDS HAVING THREE OR MORE EPOXY GROUPS EACH FORMED BY AN OXYGEN ATOM AND ADJACENT TWO CARBON ATOMS CONSTITUTING AN ALICYCLE, IN A CONTENT OF FROM 55 TO 100 PERCENT BY WEIGHT BASED ON THE TOTAL AMOUNT OF EPOXY RESIN(S). THE CURING AGENT IS AN ACID ANHYDRIDE CURING AGENT, AND THE CURING ACCELERATOR INCLUDES AN IONIC CONJUGATE BETWEEN A PHOSPHONIUM ION REPRESENTED BY FOLLOWING FORMULA (1) AND A HALOGEN ANION CAPABLE OF FORMING AN ION PAIR WITH THE PHOSPHONIUM ION.
MYPI2012003298A 2010-02-25 2011-02-04 Resin composition for sealing an optical semiconductor and optical semiconductor device using said resin composition MY160200A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010040950A JP5606752B2 (en) 2010-02-25 2010-02-25 Resin composition for optical semiconductor sealing and optical semiconductor device using the same

Publications (1)

Publication Number Publication Date
MY160200A true MY160200A (en) 2017-02-28

Family

ID=44506610

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2012003298A MY160200A (en) 2010-02-25 2011-02-04 Resin composition for sealing an optical semiconductor and optical semiconductor device using said resin composition

Country Status (5)

Country Link
JP (1) JP5606752B2 (en)
CN (1) CN102782000B (en)
MY (1) MY160200A (en)
TW (1) TWI500651B (en)
WO (1) WO2011105192A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012036320A (en) * 2010-08-10 2012-02-23 Daicel Corp Curable resin composition and cured article thereof
JP2012077257A (en) * 2010-10-06 2012-04-19 Daicel Corp Method for producing cured product, and cured product
JP6047294B2 (en) * 2012-03-30 2016-12-21 株式会社ダイセル Curable epoxy resin composition
TWI494339B (en) 2012-10-23 2015-08-01 Ind Tech Res Inst Partially esterified epoxy resin and epoxy resin composition applied with the same, and method for preparing the composition
JP6332907B2 (en) 2013-02-14 2018-05-30 東京応化工業株式会社 Resin composition for sealing, display device, and optical semiconductor device
JP6523780B2 (en) 2014-09-29 2019-06-05 東京応化工業株式会社 Film-forming composition and method for producing cured film using the same
JP6512699B2 (en) * 2015-03-30 2019-05-15 ペルノックス株式会社 One-component epoxy resin composition for semiconductor encapsulation, cured product, method for producing semiconductor component and semiconductor component
CN108117718B (en) * 2016-11-28 2020-05-15 联茂电子股份有限公司 Halogen-free resin composition
KR102140259B1 (en) 2018-01-11 2020-07-31 주식회사 엘지화학 Epoxy resin composition for molding semiconductor, molding film and semiconductor package using the same

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0258530A (en) * 1988-08-23 1990-02-27 Toshiba Corp Epoxy resin composition
WO2005028536A1 (en) * 2003-09-22 2005-03-31 Mitsubishi Chemical Corporation Alicyclic epoxy resin, process for producing the same, composition thereof, cured epoxy resin, and use of alicyclic epoxy resin composition
CN100513453C (en) * 2003-09-22 2009-07-15 三菱化学株式会社 Alicyclic epoxy resin, method for producing same, composition thereof, epoxy resin cured product, and use of alicyclic epoxy resin composition
JP2005225964A (en) * 2004-02-12 2005-08-25 Jsr Corp Composition for optical semiconductor encapsulation
JP2005263869A (en) * 2004-03-16 2005-09-29 Nagase Chemtex Corp Resin composition for sealing optical semiconductor
EP1736500A4 (en) * 2004-04-16 2010-03-24 Jsr Corp COMPOSITION FOR SEALING AN OPTICAL SEMICONDUCTOR, OPTICAL SEMICONDUCTOR SEALING MATERIAL, AND PROCESS FOR PRODUCING A COMPOSITION FOR SEALING AN OPTICAL SEMICONDUCTOR
JP4578188B2 (en) * 2004-09-15 2010-11-10 ダイセル化学工業株式会社 Epoxy resin composition, optical semiconductor encapsulant, and optical semiconductor device
JP2006225515A (en) * 2005-02-17 2006-08-31 Jsr Corp Optical semiconductor, sealing material and sealing composition
US20090163652A1 (en) * 2007-12-19 2009-06-25 Chisso Corporation Thermosetting resin composition and use thereof
JP5013127B2 (en) * 2007-12-19 2012-08-29 Ｊｎｃ株式会社 Thermosetting resin composition and use thereof
JP2009191217A (en) * 2008-02-18 2009-08-27 Shin Etsu Chem Co Ltd Epoxy / silicone hybrid resin composition and light emitting semiconductor device
JP5077894B2 (en) * 2008-03-28 2012-11-21 信越化学工業株式会社 Epoxy / silicone hybrid resin composition for optical semiconductor element sealing and transfer molding tablet comprising the same
JP5669289B2 (en) * 2008-05-23 2015-02-12 新日鉄住金化学株式会社 Novel epoxy resin and method for producing the same, epoxy resin composition containing epoxy resin as essential component, and cured product containing epoxy resin as essential component
JP2010031149A (en) * 2008-07-29 2010-02-12 Shin-Etsu Chemical Co Ltd Resin composition for sealing optical semiconductor device

Also Published As

Publication number Publication date
TWI500651B (en) 2015-09-21
CN102782000B (en) 2014-12-31
CN102782000A (en) 2012-11-14
TW201139493A (en) 2011-11-16
JP5606752B2 (en) 2014-10-15
WO2011105192A1 (en) 2011-09-01
JP2011174023A (en) 2011-09-08

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