MY160570A - A lead free solder alloy containing platinum particles as reinforcement - Google Patents
A lead free solder alloy containing platinum particles as reinforcementInfo
- Publication number
- MY160570A MY160570A MYPI2012700980A MYPI2012700980A MY160570A MY 160570 A MY160570 A MY 160570A MY PI2012700980 A MYPI2012700980 A MY PI2012700980A MY PI2012700980 A MYPI2012700980 A MY PI2012700980A MY 160570 A MY160570 A MY 160570A
- Authority
- MY
- Malaysia
- Prior art keywords
- platinum particles
- solder alloy
- reinforcement
- sac
- alloy containing
- Prior art date
Links
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 title abstract 9
- 229910045601 alloy Inorganic materials 0.000 title abstract 4
- 239000000956 alloy Substances 0.000 title abstract 4
- 239000002245 particle Substances 0.000 title abstract 4
- 229910052697 platinum Inorganic materials 0.000 title abstract 4
- 229910000679 solder Inorganic materials 0.000 title abstract 2
- 230000002787 reinforcement Effects 0.000 title 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 abstract 2
- 238000000034 method Methods 0.000 abstract 2
- 239000000203 mixture Substances 0.000 abstract 2
- 239000000725 suspension Substances 0.000 abstract 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 abstract 1
- 229910017944 Ag—Cu Inorganic materials 0.000 abstract 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 abstract 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract 1
- 239000012300 argon atmosphere Substances 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 230000004907 flux Effects 0.000 abstract 1
- 238000002844 melting Methods 0.000 abstract 1
- 230000008018 melting Effects 0.000 abstract 1
- 238000003756 stirring Methods 0.000 abstract 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 abstract 1
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Powder Metallurgy (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
A method of obtaining a solder alloy is provided. The method includes cutting Sn-Ag-Cu (SAC) alloy into pieces and cleaned with ethanol and dried, in step (102); melting cut pieces, obtained in step (102), in an alumina crucible under argon atmosphere at 350ºC, in step (104); coating Platinum (Pt) particles with Rosin Mildly Activated (RMA) flux in step (106) and adding RMA coated platinum particles into molten SAC pieces obtained from step (104), to obtain a mixture; stirring the mixture to obtain a homogeneous suspension of platinum particles in SAC alloy in step (108) and allowing the homogeneous suspension to stand at 350ºC for 30 minutes, in step (110).
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| MYPI2012700980A MY160570A (en) | 2012-11-21 | 2012-11-21 | A lead free solder alloy containing platinum particles as reinforcement |
| CN201310583871.6A CN103921010B (en) | 2012-11-21 | 2013-11-20 | Welding alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| MYPI2012700980A MY160570A (en) | 2012-11-21 | 2012-11-21 | A lead free solder alloy containing platinum particles as reinforcement |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY160570A true MY160570A (en) | 2017-03-15 |
Family
ID=51139530
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI2012700980A MY160570A (en) | 2012-11-21 | 2012-11-21 | A lead free solder alloy containing platinum particles as reinforcement |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103921010B (en) |
| MY (1) | MY160570A (en) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3428442A (en) * | 1966-09-22 | 1969-02-18 | Eutectic Welding Alloys | Coated spray-weld alloy powders |
| CN101076446A (en) * | 2003-08-06 | 2007-11-21 | 密执安州立大学 | Compound metallic substrate casting and solder composition and method |
| EP1889684B1 (en) * | 2005-06-03 | 2016-03-30 | Senju Metal Industry Co., Ltd. | Lead-free solder alloy |
| CN101351297A (en) * | 2005-09-26 | 2009-01-21 | 美国铟泰公司 | Low Melting Temperature Flexible Solder |
| JP2008004651A (en) * | 2006-06-21 | 2008-01-10 | Hitachi Ltd | Bonding material using anisotropic fine particles |
| CN101474728B (en) * | 2009-01-07 | 2011-06-01 | 高新锡业（惠州）有限公司 | Leadless soft brazing material |
-
2012
- 2012-11-21 MY MYPI2012700980A patent/MY160570A/en unknown
-
2013
- 2013-11-20 CN CN201310583871.6A patent/CN103921010B/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN103921010A (en) | 2014-07-16 |
| CN103921010B (en) | 2019-01-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP2540420A3 (en) | Production of atomized powder for glassy aluminum-based alloys | |
| EP2948570B1 (en) | Lead-free solder alloy | |
| MX2012008231A (en) | Braze foil for high-temperature brazing and methods for repairing or producing components using said braze foil. | |
| WO2014120854A3 (en) | Material processing through optically transmissive slag | |
| WO2015069763A3 (en) | Sublingual cannabis dosage form and methods of making and using the same | |
| MY177543A (en) | Aluminum alloy foil for current collector of electrode and manufacturing method thereof | |
| EP2570591A3 (en) | Method for repairing a ceramic fiber reinforced ceramic composite article and corresponding intermediate | |
| EP2684981A3 (en) | A coating/repairing process using electrospark with PSP rod | |
| WO2012047868A3 (en) | Aluminum powder metal alloying method | |
| GB201316694D0 (en) | Surface-enhanced raman scattering apparatus and methods | |
| WO2013025990A3 (en) | Lead-free solder compositions | |
| CN104988355A (en) | Method for reducing hot-cracking tendency of nickle-based superalloy powder material for 3D printing | |
| WO2012161463A3 (en) | Alloy manufacturing method and alloy manufactured by means of same | |
| JP2011147982A5 (en) | ||
| WO2013072898A3 (en) | Grain refinement, aluminium foundry alloys | |
| CN105401026B (en) | A kind of ultra-high-strength aluminum alloy powder | |
| MX2017011314A (en) | A method and a container for preparing a fused sample for analysis. | |
| AU2012363597B2 (en) | Audio solder alloy | |
| WO2012070803A3 (en) | Aluminum-magnesium-silicon-copper alloy for automobile chassis and bodies and a casting method therefor | |
| CN104526186A (en) | Novel scaling powder for SnZn series lead-free brazing filler metal | |
| GB201315481D0 (en) | Reflow method for lead-free solder | |
| CN203409398U (en) | Smoke exhausting mechanism of pin tin-soldering groove of LED (Light-Emitting Diode) circuit board | |
| RU2439181C1 (en) | Jewellery alloy based on platinum of rate 950 | |
| CN103014411A (en) | Sn-Nd-Ni intermediate alloy and preparation method thereof | |
| CN202846040U (en) | Special stainless steel welding wire for active agent argon tungsten-arc welding |