MY161045A - Resin composition for forming adhesive layer of multilayer flexible printed wiring board, resin varnish, resin coated copper foil, method for manufacturing resin coated copper foil for manufacturing multilayer flexible printed wiring board, and multilayer flexible printed wiring board - Google Patents

Resin composition for forming adhesive layer of multilayer flexible printed wiring board, resin varnish, resin coated copper foil, method for manufacturing resin coated copper foil for manufacturing multilayer flexible printed wiring board, and multilayer flexible printed wiring board

Info

Publication number
MY161045A
MY161045A MYPI2012002220A MYPI2012002220A MY161045A MY 161045 A MY161045 A MY 161045A MY PI2012002220 A MYPI2012002220 A MY PI2012002220A MY PI2012002220 A MYPI2012002220 A MY PI2012002220A MY 161045 A MY161045 A MY 161045A
Authority
MY
Malaysia
Prior art keywords
resin
wiring board
printed wiring
flexible printed
multilayer flexible
Prior art date
Application number
MYPI2012002220A
Inventor
Takeshi Shirai
Toshifumi Matsushima
Tetsuro Sato
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Publication of MY161045A publication Critical patent/MY161045A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4246—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof polymers with carboxylic terminal groups
    • C08G59/4261—Macromolecular compounds obtained by reactions involving only unsaturated carbon-to-carbon bindings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/44—Amides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/14—Polyamide-imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/28—Metal sheet
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H05K3/4655—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern by using a laminate characterized by the insulating layer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C08L2666/22—Macromolecular compounds not provided for in C08L2666/16 - C08L2666/20
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2479/00—Presence of polyamine or polyimide
    • C09J2479/08—Presence of polyamine or polyimide polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/012—Flame-retardant; Preventing of inflammation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0358—Resin coated copper [RCC]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

AN OBJECT OF THE PRESENT INVENTION IS TO PROVIDE A RESIN COMPOSITION IN WHICH A SO-CALLED B-STAGE CRACK IS PREVENTED; FALL OR RESIN DUST IN THE MANUFACTURING PROCESS OR THE LIKE OF A FLEXIBLE PRINTED WIRING BOARD IS PREVENTED; AND PERFORMANCE SUCH AS FOLDING ENDURANCE, HEAT RESISTANCE, AND THE RESIN FLOW CAN BE ACHIEVED WITH GOOD BALANCE. IN ORDER TO SOLVE THE PROBLEMS, IN A RESIN COMPOSITION USED FOR FORMING AN ADHESIVE LAYER FOR MULTILAYERING AN INNER LAYER FLEXIBLE PRINTED WIRING BOARD, THE RESIN COMPOSITION INCLUDING COMPONENT A: A HIGHLY HEAT-RESISTANT EPOXY RESIN IN A SOLID FORM HAVING A SOFTENING POINT OF 50°C OR MORE, COMPONENT B: AN EPOXY RESIN CURING AGENT CONSISTING OF ONE OR MIXTURE OF A BIPHENYL TYPE PHENOLIC RESIN AND A PHENOL ARALKYL TYPE PHENOLIC RESIN, COMPONENT C: A RUBBER-MODIFIED POLYAMIDE-IMIDE RESIN SOLUBLE IN A SOLVENT WHICH HAS A BOILING POINT IN THE RANGE OF 50°C TO 200°C, COMPONENT D: AN ORGANIC PHOSPHORUS-CONTAINING FLAME RETARDANT, AND COMPONENT E: A BIPHENYL TYPE EPOXY RESIN IS EMPLOYED.
MYPI2012002220A 2009-12-02 2010-12-02 Resin composition for forming adhesive layer of multilayer flexible printed wiring board, resin varnish, resin coated copper foil, method for manufacturing resin coated copper foil for manufacturing multilayer flexible printed wiring board, and multilayer flexible printed wiring board MY161045A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009274922 2009-12-02

Publications (1)

Publication Number Publication Date
MY161045A true MY161045A (en) 2017-04-14

Family

ID=44115003

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2012002220A MY161045A (en) 2009-12-02 2010-12-02 Resin composition for forming adhesive layer of multilayer flexible printed wiring board, resin varnish, resin coated copper foil, method for manufacturing resin coated copper foil for manufacturing multilayer flexible printed wiring board, and multilayer flexible printed wiring board

Country Status (6)

Country Link
JP (1) JP5750049B2 (en)
KR (1) KR101757411B1 (en)
CN (1) CN102640576B (en)
MY (1) MY161045A (en)
TW (1) TWI490266B (en)
WO (1) WO2011068157A1 (en)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102295740B (en) * 2011-07-11 2013-11-27 复旦大学 Polyamide-imide cured epoxy resin composite material and preparation method thereof
CN102391810B (en) * 2011-09-19 2013-07-17 湖南神力铃胶粘剂制造有限公司 Heat-resisting color-changing anti-counterfeiting epoxy adhesive and preparation method thereof
EP3026145A4 (en) 2013-07-23 2017-04-12 JX Nippon Mining & Metals Corporation Treated surface copper foil, copper foil with carrier, substrate, resin substrate, printed circuit board, copper clad laminate, and printed circuit board manufacturing method
WO2015012376A1 (en) 2013-07-24 2015-01-29 Jx日鉱日石金属株式会社 Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed circuit board, copper-clad laminate, and method for manufacturing printed circuit board
CN103450836B (en) * 2013-09-04 2015-02-25 九江福莱克斯有限公司 Environmental-friendly, flexible, heat-conducting epoxy resin adhesive and high-heat-conduction flexible base material prepared by using same
CN103834342B (en) * 2014-03-19 2016-02-10 天津科技大学 A kind of high temperature resistant halogen-free flame-retardant adhesive for flexible printed circuit board
JP5782583B1 (en) * 2014-05-28 2015-09-24 東洋紡株式会社 Adhesive composition using polyamideimide resin
KR102284125B1 (en) * 2014-07-10 2021-07-30 삼성전기주식회사 Resin-coated metal foil for use in manufacturing of printed circuit board, printed circuit board and manufacturing method thereof
CN107109161B (en) * 2014-11-12 2019-07-02 迪睿合株式会社 Thermosetting Adhesive Composition
JP6547220B2 (en) * 2014-12-16 2019-07-24 リンテック株式会社 Adhesive for die bonding
JP6640567B2 (en) 2015-01-16 2020-02-05 Ｊｘ金属株式会社 Copper foil with carrier, laminate, printed wiring board, method for manufacturing electronic equipment, and method for manufacturing printed wiring board
KR101852671B1 (en) 2015-01-21 2018-06-04 제이엑스금속주식회사 Copper foil with carrier, laminate, printed circuit board and method of manufacturing printed circuit board
KR101942621B1 (en) 2015-02-06 2019-01-25 제이엑스금속주식회사 Copper foil with carrier, laminate, printed circuit board, electronic device and method of manufacturing printed circuit board
JP2017193778A (en) 2016-04-15 2017-10-26 Ｊｘ金属株式会社 Copper foil, copper foil for high frequency circuit, copper foil with carrier, copper foil with carrier for high frequency circuit, laminate, printed wiring board manufacturing method and electronic device manufacturing method
CN107325489B (en) * 2017-08-14 2019-07-16 通威太阳能（安徽）有限公司 A kind of anticorrosion epoxy-phenol glue and its application in battery dies etching technique
CN107828358B (en) * 2017-10-12 2021-05-04 烟台德邦科技股份有限公司 A kind of low dielectric constant environment-friendly underfill and preparation method thereof
US20190345323A1 (en) * 2018-05-11 2019-11-14 Samsung Electronics Co., Ltd. Resin composition for printed circuit board and integrated circuit package, and product using the same
KR102051375B1 (en) * 2018-05-11 2019-12-04 삼성전자주식회사 Resin composition for printed circuit board and IC package, and product using the same
JP6592640B1 (en) * 2018-06-21 2019-10-16 東洋紡株式会社 Adhesive composition comprising acrylonitrile butadiene rubber copolymerized polyamideimide resin
JP7348673B2 (en) * 2021-12-03 2023-09-21 ニッカン工業株式会社 Resin composition, and coverlay film, adhesive sheet, resin-coated metal foil, metal-clad laminate, or printed wiring board using the same
CN116939980B (en) * 2023-09-19 2024-01-23 江西鸿宇电路科技有限公司 A high heat dissipation flexible LED circuit board and its preparation method
KR20250060740A (en) * 2023-10-26 2025-05-07 한국전기연구원 Liquid insulation material with flowability, leveling properties, and flexibility

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01222945A (en) * 1988-03-02 1989-09-06 Mitsui Toatsu Chem Inc Flexible laminated material with metal foil
JP3432409B2 (en) * 1997-11-28 2003-08-04 日立化成工業株式会社 Heat resistant resin composition and adhesive film using the same
JP3708423B2 (en) * 2000-10-20 2005-10-19 株式会社日鉱マテリアルズ Phenolic curing agent for epoxy resin and epoxy resin composition using the same
JP2004217862A (en) * 2003-01-17 2004-08-05 Hitachi Chem Co Ltd Heat-resistant adhesive, laminate using this adhesive, heat sink with adhesive, and metal foil with adhesive
JP2004331677A (en) * 2003-04-30 2004-11-25 Hitachi Chem Co Ltd Epoxy resin composition for sealing and electronic part device
JP4481797B2 (en) * 2004-11-16 2010-06-16 株式会社フジクラ Flexible printed wiring board and manufacturing method thereof
TW200634095A (en) * 2005-03-16 2006-10-01 Chang Chun Plastics Co Ltd Polyoxyalkyleneamine modified polyamidepolyimide resin and composition thereof
JP5103928B2 (en) * 2007-02-13 2012-12-19 日立化成工業株式会社 Adhesive composition and adhesive film using the same
TWI347355B (en) * 2007-07-09 2011-08-21 Chin Yee Chemical Industres Co Ltd Flame retardant resins and flame retardant resin compositions
TWI491695B (en) * 2007-07-31 2015-07-11 住友電木股份有限公司 Semiconductor device and method of manufacturing the same

Also Published As

Publication number Publication date
TWI490266B (en) 2015-07-01
TW201130909A (en) 2011-09-16
JP5750049B2 (en) 2015-07-15
WO2011068157A1 (en) 2011-06-09
KR101757411B1 (en) 2017-07-12
JPWO2011068157A1 (en) 2013-04-18
CN102640576B (en) 2014-10-29
CN102640576A (en) 2012-08-15
KR20120116394A (en) 2012-10-22

Similar Documents

Publication Publication Date Title
EP2290009B1 (en) Halogen-free flame retardant resin composition, and, prepreg, laminate, and laminate for printed circuit made therefrom
MY155358A (en) Resin compound for forming adhesive layer of multilayered flexible printed wiring board
CN101096442B (en) Resin composition is used for the method for producing environment-friendly high dip soldering resistance flame-retardant paper-based copper-clad laminate
CN102822228A (en) Epoxy resin composition for prepreg, prepreg and multilayer printed circuit wiring board
TW200745195A (en) Insulating material, process for producing electronic part/device, and electronic part/device
MY150635A (en) Resin composition and resin coated copper foil obtained by using the resin composition
WO2009041137A1 (en) Epoxy resin composition, prepreg using the epoxy resin composition, metal-clad laminate, and printed wiring board
WO2009028493A1 (en) Insulating resin composition for multilayer printed wiring board, insulating resin sheet with base material, multilayer printed wiring board, and semiconductor device
TW201412864A (en) Thermosetting resin compositions, resin films in B-stage, metal foils, copper clad boards and multi-layer build-up boards
WO2012044029A3 (en) Laminate comprising an epoxy resin and having superior formability, and method for producing same
US8518527B2 (en) Method for improving flame retardant efficiency of phenoxyphosphazene compound, and prepreg. laminate for printed circuit made by the method
EP2662395A3 (en) Epoxy resin, epoxy resin compound comprising the same, and radiant heat circuit board using the compound
EP2933293A1 (en) Halogen-free flame-retardant resin composition and use thereof
WO2013032739A3 (en) Epoxybenzyl-terminated poly(arylene ether)s, method for preparation thereof, and curable compositions comprising same
WO2012161490A3 (en) Epoxy resin compound and radiant heat circuit board using the same
US20150147799A1 (en) Halogen-free high-frequency resin composition
WO2008133246A1 (en) Epoxy resin composition, resin film, prepreg, and multilayer printed circuit board
MY157470A (en) Prepreg, metal foil-clad laminate, and printecd wiring board
JP6328414B2 (en) Flame retardant resin composition, B-staged resin film, metal foil with resin, and coverlay film
WO2013019092A3 (en) Epoxy resin composition with excellent moldability and metal copper clad laminate for printed circuit board including same
CN100589972C (en) Epoxy glass cloth-based copper clad board adapted to lead-free process and preparation method thereof
MY146556A (en) Resin composition, prepreg, and laminate
WO2018004289A3 (en) Benzoxazine-based mixture and use thereof
TWM473928U (en) Copper foil substrate
JP2012054573A5 (en)