MY161736A - Bonding capillary - Google Patents

Bonding capillary

Info

Publication number
MY161736A
MY161736A MYPI2013700491A MYPI2013700491A MY161736A MY 161736 A MY161736 A MY 161736A MY PI2013700491 A MYPI2013700491 A MY PI2013700491A MY PI2013700491 A MYPI2013700491 A MY PI2013700491A MY 161736 A MY161736 A MY 161736A
Authority
MY
Malaysia
Prior art keywords
bonding capillary
bonding
aluminum oxide
capillary
wire
Prior art date
Application number
MYPI2013700491A
Inventor
Motomura Kenichi
Uchimura Takeshi
Onishi Jumpei
Goto Tatsuya
Tabata Kenji
Original Assignee
Toto Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toto Ltd filed Critical Toto Ltd
Publication of MY161736A publication Critical patent/MY161736A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]

Landscapes

  • Wire Bonding (AREA)
  • Nonmetallic Welding Materials (AREA)
  • Ceramic Products (AREA)
  • Compositions Of Oxide Ceramics (AREA)

Abstract

[PROBLEM] AN EMBODIMENT OF THE INVENTION RELATES TO A BONDING CAPILLARY (110), AND MORE PARTICULARLY TO A BONDING CAPILLARY SUITABLE FOR USE WITH A HARD METAL NARROW WIRE (BONDING WIRE) MADE OF E.G. COPPER. [MEANS FOR SOLUTION] A BONDING CAPILLARY (110) COMPRISING: A FIRST POLYCRYSTALLINE CERAMIC WITH A PRIMARY PHASE BEING A CRYSTAL OF ALUMINUM OXIDE, AND THE AVERAGE GRAIN DIAMETER OF CRYSTAL GRAINS OF THE ALUMINUM OXIDE BEING 0.38 µM OR LESS (FIG. 10)
MYPI2013700491A 2013-01-25 2013-03-28 Bonding capillary MY161736A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013012465A JP5376413B1 (en) 2013-01-25 2013-01-25 Bonding capillary

Publications (1)

Publication Number Publication Date
MY161736A true MY161736A (en) 2017-05-15

Family

ID=49955002

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2013700491A MY161736A (en) 2013-01-25 2013-03-28 Bonding capillary

Country Status (6)

Country Link
JP (1) JP5376413B1 (en)
KR (3) KR20140095939A (en)
CN (3) CN108422075A (en)
MY (1) MY161736A (en)
PH (1) PH12013000093A1 (en)
TW (1) TWI466751B (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5614603B1 (en) * 2013-12-03 2014-10-29 Toto株式会社 Bonding capillary
USD771168S1 (en) 2014-10-31 2016-11-08 Coorstek, Inc. Wire bonding ceramic capillary
USD797826S1 (en) 2015-02-03 2017-09-19 Coorstek, Inc. Ceramic bonding tool with textured tip
USD797171S1 (en) 2015-02-03 2017-09-12 Coorstek, Inc. Ceramic bonding tool with textured tip
USD797172S1 (en) 2015-02-03 2017-09-12 Coorstek, Inc. Ceramic bonding tool with textured tip
USD753739S1 (en) 2015-04-17 2016-04-12 Coorstek, Inc. Wire bonding wedge tool
USD868123S1 (en) 2016-12-20 2019-11-26 Coorstek, Inc. Wire bonding wedge tool
CN106995308B (en) * 2017-04-21 2020-05-05 潮州三环（集团）股份有限公司 A kind of ceramic capillary material and preparation method thereof
WO2019031498A1 (en) 2017-08-09 2019-02-14 日鉄ケミカル＆マテリアル株式会社 Cu ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE
CN110497166A (en) * 2019-08-13 2019-11-26 成都精蓉创科技有限公司 A kind of deep chamber weldering chopper and its production technology for full-automatic wirebond machine
CN110842339B (en) * 2019-11-12 2023-11-07 苏州三环科技有限公司 A ceramic cleaver
CN113862670B (en) * 2021-09-24 2022-11-01 深圳市盛元半导体有限公司 Anti-sticking aluminum coating electroplating treatment system for cleaver
CN114361054B (en) * 2021-12-29 2025-04-18 深圳市盛元半导体有限公司 A production process of a wedge for cleaning-free aluminum wire bonding and the wedge produced
CN114883208A (en) * 2022-04-24 2022-08-09 有研工程技术研究院有限公司 Deep cavity welding wedge-shaped cleaver
CN119501302A (en) * 2024-12-18 2025-02-25 苏州芯合半导体材料有限公司 A ceramic splitting knife and laser surface treatment method thereof

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0267741A (en) * 1988-09-01 1990-03-07 Showa Denko Kk Capillary for wire bonding
JPH0645389A (en) * 1992-07-21 1994-02-18 Shinagawa Refract Co Ltd Bonding tool
JP3722606B2 (en) * 1997-12-25 2005-11-30 京セラ株式会社 Abrasion-resistant alumina sintered body
US7389905B2 (en) * 1999-02-25 2008-06-24 Reiber Steven F Flip chip bonding tool tip
US7032802B2 (en) * 1999-02-25 2006-04-25 Reiber Steven F Bonding tool with resistance
US6321969B1 (en) * 2000-04-28 2001-11-27 Kulicke & Soffa Investments Efficient energy transfer capillary
US6497356B2 (en) * 2000-04-28 2002-12-24 Kulicke & Soffa Investments, Inc. Controlled attenuation capillary with planar surface
US6729527B2 (en) * 2001-01-30 2004-05-04 Kulicke & Soffa Investments, Inc. Bonding tool with polymer coating
JP3566678B2 (en) 2001-08-28 2004-09-15 京セラ株式会社 Capillary for wire bonding
JP4269910B2 (en) * 2003-11-27 2009-05-27 Ｔｏｔｏ株式会社 Bonding capillary
KR100612611B1 (en) * 2004-04-09 2006-08-14 비아이 이엠티 주식회사 Manufacturing method of capillary for semiconductor assembly
CN1983545B (en) * 2005-12-06 2011-05-04 先进科技新加坡有限公司 Capillary for a bonding tool
KR100932636B1 (en) * 2007-12-26 2009-12-21 비아이 이엠티 주식회사 Method for producing alumina composite capillary
JP2011097042A (en) * 2009-09-30 2011-05-12 Toto Ltd Bonding capillary

Also Published As

Publication number Publication date
CN108422075A (en) 2018-08-21
TWI466751B (en) 2015-01-01
CN108436251A (en) 2018-08-24
CN103962713A (en) 2014-08-06
KR20150035924A (en) 2015-04-07
KR20140095939A (en) 2014-08-04
PH12013000093B1 (en) 2014-11-24
KR102006176B1 (en) 2019-08-01
KR101930305B1 (en) 2018-12-18
JP2014146622A (en) 2014-08-14
KR20180134806A (en) 2018-12-19
PH12013000093A1 (en) 2014-11-24
JP5376413B1 (en) 2013-12-25
TW201429600A (en) 2014-08-01

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