MY162427A - Curable resin composition and cured product thereof, encapsulant, and semiconductor device - Google Patents

Curable resin composition and cured product thereof, encapsulant, and semiconductor device

Info

Publication number
MY162427A
MY162427A MYPI2015002685A MYPI2015002685A MY162427A MY 162427 A MY162427 A MY 162427A MY PI2015002685 A MYPI2015002685 A MY PI2015002685A MY PI2015002685 A MYPI2015002685 A MY PI2015002685A MY 162427 A MY162427 A MY 162427A
Authority
MY
Malaysia
Prior art keywords
polyorganosiloxane
resin composition
curable resin
cured product
encapsulant
Prior art date
Application number
MYPI2015002685A
Other languages
English (en)
Inventor
Shigeaki Kamuro
Yasunobu Nakagawa
Original Assignee
Daicel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daicel Corp filed Critical Daicel Corp
Publication of MY162427A publication Critical patent/MY162427A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477—Six-membered rings
    • C08K5/3492—Triazines
    • C08K5/34924—Triazines containing cyanurate groups; Tautomers thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
MYPI2015002685A 2013-02-14 2014-02-04 Curable resin composition and cured product thereof, encapsulant, and semiconductor device MY162427A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013026947 2013-02-14

Publications (1)

Publication Number Publication Date
MY162427A true MY162427A (en) 2017-06-15

Family

ID=51353972

Family Applications (2)

Application Number Title Priority Date Filing Date
MYPI2015002685A MY162427A (en) 2013-02-14 2014-02-04 Curable resin composition and cured product thereof, encapsulant, and semiconductor device
MYPI2015702608A MY155921A (en) 2013-02-14 2014-02-04 Curable resin composition and cured product thereof, encapsulant, and semiconductor device

Family Applications After (1)

Application Number Title Priority Date Filing Date
MYPI2015702608A MY155921A (en) 2013-02-14 2014-02-04 Curable resin composition and cured product thereof, encapsulant, and semiconductor device

Country Status (8)

Country Link
US (2) US9481791B2 (de)
EP (2) EP2957599A1 (de)
JP (2) JP6027222B2 (de)
KR (2) KR101614263B1 (de)
CN (2) CN105008460B (de)
MY (2) MY162427A (de)
TW (2) TWI577740B (de)
WO (1) WO2014125964A1 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106715593A (zh) * 2014-09-17 2017-05-24 株式会社大赛璐 固化性有机硅树脂组合物及其固化物
CN105623271A (zh) * 2014-11-20 2016-06-01 爱克工业株式会社 加成反应固化型树脂组合物以及光半导体装置
WO2017119363A1 (ja) 2016-01-08 2017-07-13 株式会社ダイセル 硬化性シリコーン樹脂組成物及びその硬化物、並びに光半導体装置
WO2017122712A1 (ja) * 2016-01-15 2017-07-20 株式会社ダイセル 硬化性樹脂組成物、硬化物、封止材、及び半導体装置
CN108699341B (zh) * 2016-02-22 2021-09-24 日亚化学工业株式会社 固化性树脂组合物、其固化物、及半导体装置
KR102363592B1 (ko) * 2016-07-19 2022-02-16 니치아 카가쿠 고교 가부시키가이샤 경화성 수지 조성물, 그의 경화물 및 반도체 장치
WO2018047633A1 (ja) * 2016-09-07 2018-03-15 株式会社ダイセル 硬化性樹脂組成物、その硬化物、及び半導体装置
JP6872110B2 (ja) * 2016-11-18 2021-05-19 富士フイルムビジネスイノベーション株式会社 画像形成装置及びプログラム
KR102008186B1 (ko) * 2017-02-09 2019-08-07 삼성에스디아이 주식회사 태양전지 전극 형성용 조성물 및 이로부터 제조된 전극
KR20190013091A (ko) * 2017-07-31 2019-02-11 다우 실리콘즈 코포레이션 이중 경화성 수지 조성물, 그로부터 형성된 경화물, 및 그러한 경화물을 포함하는 전자 장치
EP3844231A1 (de) * 2018-08-31 2021-07-07 Wacker Chemie AG Härtbare organopolysiloxanzusammensetzung, verkapselungsstoff und halbleiterbauelement
KR102734213B1 (ko) * 2021-03-26 2024-11-25 삼성에스디아이 주식회사 유기발광소자 봉지용 조성물 및 이로부터 제조된 유기층을 포함하는 유기발광소자 표시장치

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09291214A (ja) 1996-04-25 1997-11-11 Nippon Paint Co Ltd 硬化性樹脂組成物及びその硬化物
JP4275889B2 (ja) 2001-02-09 2009-06-10 株式会社カネカ 発光ダイオード及びその製造方法
JP2004131519A (ja) * 2002-10-08 2004-04-30 Kanegafuchi Chem Ind Co Ltd 発光ダイオード用封止材およびそれを用いた発光ダイオード
US7071244B2 (en) * 2002-12-03 2006-07-04 Staar Surgical Company High refractive index and optically clear copoly (carbosilane and siloxane) elastomers
JP4267404B2 (ja) 2003-08-22 2009-05-27 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 光学材料用硬化性組成物
JP4494077B2 (ja) 2004-04-22 2010-06-30 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 光学材料封止用硬化性組成物
JP4802456B2 (ja) 2004-06-02 2011-10-26 株式会社カネカ 硬化性組成物及び該硬化性組成物により封止された半導体装置
JP2006206721A (ja) 2005-01-27 2006-08-10 Kansai Electric Power Co Inc:The 高耐熱合成高分子化合物及びこれで被覆した高耐電圧半導体装置
JP4826160B2 (ja) 2005-07-28 2011-11-30 ナガセケムテックス株式会社 光素子封止用樹脂組成物
JP2007224095A (ja) 2006-02-21 2007-09-06 Kaneka Corp 硬化剤、硬化性組成物および硬化物
JP2010109034A (ja) 2008-10-29 2010-05-13 Shin-Etsu Chemical Co Ltd 発光ダイオード素子用シリコーン樹脂組成物及び発光ダイオード素子
JP5353629B2 (ja) * 2008-11-14 2013-11-27 信越化学工業株式会社 熱硬化性樹脂組成物
JP2010285507A (ja) * 2009-06-10 2010-12-24 Kaneka Corp 接着性硬化性組成物
JP5801028B2 (ja) 2009-10-21 2015-10-28 株式会社Adeka ケイ素含有硬化性組成物及びその硬化物
TWI504681B (zh) * 2010-03-08 2015-10-21 琳得科股份有限公司 A hardening composition, a hardened product, and a hardening composition
CN102639643B (zh) * 2010-03-31 2013-06-12 积水化学工业株式会社 光半导体装置用密封剂及光半导体装置
KR101277722B1 (ko) * 2010-07-14 2013-06-24 제일모직주식회사 하이브리드 실록산 중합체, 상기 하이브리드 실록산 중합체로부터 형성된 봉지재 및 상기 봉지재를 포함하는 전자 소자
KR101432601B1 (ko) * 2010-07-29 2014-08-21 제일모직주식회사 변성 실록산 중합체 조성물, 상기 변성 실록산 중합체 조성물로부터 얻어진 봉지재 및 상기 봉지재를 포함하는 전자 소자
JP5557324B2 (ja) 2010-09-01 2014-07-23 信越化学工業株式会社 ダイボンド剤及び光半導体装置
KR101886173B1 (ko) * 2010-09-22 2018-08-08 가부시키가이샤 가네카 다면체 구조 폴리실록산 변성체, 다면체 구조 폴리실록산계 조성물, 경화물, 및 광반도체 디바이스
JP2012097225A (ja) * 2010-11-04 2012-05-24 Daicel Corp 硬化性樹脂組成物及び硬化物
JP2012111875A (ja) * 2010-11-25 2012-06-14 Daicel Corp 硬化性樹脂組成物及び硬化物
TWI435914B (zh) 2010-12-31 2014-05-01 Eternal Chemical Co Ltd 可固化之有機聚矽氧烷組合物及其製法
JP5533906B2 (ja) * 2011-02-28 2014-06-25 信越化学工業株式会社 付加反応硬化型オルガノポリシルメチレンシロキサンコポリマー組成物
FR2975969B1 (fr) * 2011-05-30 2013-06-07 Turbomeca Systeme de conditionnement d'air d'un compartiment pour passagers d'un aeronef
US9181397B2 (en) 2011-12-22 2015-11-10 Daicel Corporation Curable resin composition and cured product thereof
TWI485185B (zh) * 2012-05-25 2015-05-21 大賽璐股份有限公司 硬化性樹脂組成物及其硬化物、封裝劑、以及光半導體裝置
AU2013326799A1 (en) * 2012-10-05 2015-04-30 University Of Southern California Energy sensitization of acceptors and donors in organic photovoltaics
EP2944675B1 (de) * 2013-01-09 2017-04-12 Daicel Corporation Härtbare harzzusammensetzung und gehärtetes produkt daraus
JP5736524B1 (ja) * 2013-08-01 2015-06-17 株式会社ダイセル 硬化性樹脂組成物及びそれを用いた半導体装置
KR101563472B1 (ko) * 2013-08-02 2015-10-26 주식회사 다이셀 경화성 수지 조성물 및 이를 사용한 반도체 장치
WO2015019767A1 (ja) 2013-08-06 2015-02-12 株式会社ダイセル 硬化性樹脂組成物及びそれを用いた半導体装置

Also Published As

Publication number Publication date
US20150368514A1 (en) 2015-12-24
CN106751887A (zh) 2017-05-31
EP2957599A4 (de) 2015-12-23
US9644098B2 (en) 2017-05-09
US9481791B2 (en) 2016-11-01
JP6027222B2 (ja) 2016-11-16
JPWO2014125964A1 (ja) 2017-02-02
JP2016047928A (ja) 2016-04-07
TWI577738B (zh) 2017-04-11
MY155921A (en) 2015-12-16
TWI577740B (zh) 2017-04-11
EP2985317A1 (de) 2016-02-17
KR20150103755A (ko) 2015-09-11
WO2014125964A1 (ja) 2014-08-21
EP2957599A1 (de) 2015-12-23
US20160017147A1 (en) 2016-01-21
KR20150107873A (ko) 2015-09-23
CN106751887B (zh) 2018-11-13
CN105008460B (zh) 2016-12-14
KR101711320B1 (ko) 2017-02-28
TW201713727A (zh) 2017-04-16
KR101614263B1 (ko) 2016-04-20
JP6027209B2 (ja) 2016-11-16
TW201439217A (zh) 2014-10-16
CN105008460A (zh) 2015-10-28

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