MY164438A - Polishing composition - Google Patents

Polishing composition

Info

Publication number
MY164438A
MY164438A MYPI20041159A MYPI20041159A MY164438A MY 164438 A MY164438 A MY 164438A MY PI20041159 A MYPI20041159 A MY PI20041159A MY PI20041159 A MYPI20041159 A MY PI20041159A MY 164438 A MY164438 A MY 164438A
Authority
MY
Malaysia
Prior art keywords
polishing composition
polishing
phosphorus
ammonia
hydrogen peroxide
Prior art date
Application number
MYPI20041159A
Inventor
Hirano Junichi
Matsunami Yasushi
Yokomichi Noritaka
Owaki Toshiki
Original Assignee
Fujimi Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujimi Inc filed Critical Fujimi Inc
Publication of MY164438A publication Critical patent/MY164438A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
    • G11B5/8404—Processes or apparatus specially adapted for manufacturing record carriers manufacturing base layers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)

Abstract

THE PRESENT INVENTION RELATES TO A POLISHING COMPOSITION MORE SUITABLE FOR USE IN POLISHING A SUBSTRATE FOR A MAGNETIC DISK. THE POLISHING COMPOSITION INCLUDES SILICON DIOXIDE, A PHOSPHORUS-CONTAINING COMPOUND CONTAINING AT LEAST ONE COMPOUND SELECTED FROM A SPECIFIC GROUP, AMMONIUM SALT CONTAINING AT LEAST ONE SALT PRODUCED BY A NEUTRALIZATION REACTION OF EACH OF SPECIFIC ACID WITH AMMONIA, HYDROGEN PEROXIDE, AND WATER.
MYPI20041159A 2003-03-31 2004-03-30 Polishing composition MY164438A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003097252A JP4202172B2 (en) 2003-03-31 2003-03-31 Polishing composition

Publications (1)

Publication Number Publication Date
MY164438A true MY164438A (en) 2017-12-15

Family

ID=32212185

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20041159A MY164438A (en) 2003-03-31 2004-03-30 Polishing composition

Country Status (4)

Country Link
JP (1) JP4202172B2 (en)
CN (1) CN100389161C (en)
GB (1) GB2401109B8 (en)
MY (1) MY164438A (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4202201B2 (en) * 2003-07-03 2008-12-24 株式会社フジミインコーポレーテッド Polishing composition
JP2006077127A (en) * 2004-09-09 2006-03-23 Fujimi Inc Polishing composition and polishing method using the composition
JP4523935B2 (en) * 2006-12-27 2010-08-11 昭和電工株式会社 An aqueous polishing slurry for polishing a silicon carbide single crystal substrate and a polishing method.
CN103131330B (en) 2008-02-01 2015-09-23 福吉米株式会社 Composition for polishing and use its Ginding process
KR101908280B1 (en) * 2010-09-08 2018-10-16 바스프 에스이 Aqueous polishing composition and process for chemically mechanically polishing substrates for electrical, mechanical and optical devices
JP6015931B2 (en) * 2011-12-15 2016-10-26 Jsr株式会社 Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method
CN104471016B (en) * 2012-07-17 2018-06-22 福吉米株式会社 Composition for polishing alloy material and method for producing alloy material using same
CN102796458B (en) * 2012-07-17 2014-04-23 清华大学 Chemical mechanical polishing aqueous composite and chemical mechanical polishing process of titanium substrate
CN103897604B (en) * 2012-12-28 2015-12-02 上海新安纳电子科技有限公司 A kind of chemical mechanical polishing liquid of hard disc of computer
KR102611598B1 (en) * 2017-04-27 2023-12-08 주식회사 동진쎄미켐 Aqueous slurry composition for chemical mechanical polishing
WO2018199453A1 (en) * 2017-04-27 2018-11-01 주식회사 동진쎄미켐 Slurry composition for chemical mechanical polishing
KR102422952B1 (en) * 2017-06-12 2022-07-19 삼성전자주식회사 Slurry composition for polishing a metal layer and method for fabricating semiconductor device using the same
JP7058097B2 (en) * 2017-09-29 2022-04-21 株式会社フジミインコーポレーテッド Method for manufacturing polishing composition and magnetic disk substrate

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG54606A1 (en) * 1996-12-05 1998-11-16 Fujimi Inc Polishing composition
US6051870A (en) * 1997-12-17 2000-04-18 Advanced Micro Devices Process for fabricating semiconductor device including improved phosphorous-doped silicon dioxide dielectric film
US6258140B1 (en) * 1999-09-27 2001-07-10 Fujimi America Inc. Polishing composition
JP3877924B2 (en) * 2000-01-24 2007-02-07 昭和電工株式会社 Magnetic disk substrate polishing composition
TW471057B (en) * 2000-06-09 2002-01-01 Macronix Int Co Ltd Method for reducing dishing effect during chemical mechanical polishing
JP4231632B2 (en) * 2001-04-27 2009-03-04 花王株式会社 Polishing liquid composition
JP3997152B2 (en) * 2002-12-26 2007-10-24 花王株式会社 Polishing liquid composition
US7147682B2 (en) * 2002-12-26 2006-12-12 Kao Corporation Polishing composition

Also Published As

Publication number Publication date
GB2401109A (en) 2004-11-03
GB0407024D0 (en) 2004-04-28
CN1536046A (en) 2004-10-13
GB2401109B8 (en) 2007-11-14
GB2401109B (en) 2007-10-10
JP4202172B2 (en) 2008-12-24
JP2004300348A (en) 2004-10-28
GB2401109A8 (en) 2007-11-14
CN100389161C (en) 2008-05-21

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