MY167806A - Adhesive sheet - Google Patents

Adhesive sheet

Info

Publication number
MY167806A
MY167806A MYPI2014002769A MYPI2014002769A MY167806A MY 167806 A MY167806 A MY 167806A MY PI2014002769 A MYPI2014002769 A MY PI2014002769A MY PI2014002769 A MYPI2014002769 A MY PI2014002769A MY 167806 A MY167806 A MY 167806A
Authority
MY
Malaysia
Prior art keywords
pressure
film
adhesive layer
sensitive adhesive
label
Prior art date
Application number
MYPI2014002769A
Inventor
Masami Aoyama
Hiromitsu Maruyama
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of MY167806A publication Critical patent/MY167806A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H10P72/7404—Wafer tapes, e.g. grinding or dicing support tapes the wafer tape being a laminate of three or more layers, e.g. including additional layers beyond a base layer and an uppermost adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/18—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet characterized by perforations in the adhesive tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7438—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support with parts of the auxiliary support remaining in the finished device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/744—Details of chemical or physical process used for separating the auxiliary support from a device or a wafer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PROVIDED IS AN ADHESIVE SHEET THAT CAN SUPPRESS VOID FORMATION BETWEEN AN ADHESIVE LAYER AND A PRESSURE-SENSITIVE ADHESIVE FILM AND CAN BE SUCCESSFULLY EXPANDED WITHOUT TEARING THE PRESSURE-SENSITIVE ADHESIVE FILM EVEN WHEN AMOUNT AND/OR RATE OF EXPANSION ARE/IS INCREASED. THE ADHESIVE SHEET 10 WOUND INTO A ROLL INCLUDES: A LONG RELEASE FILM 11; AN ADHESIVE LAYER 12 PROVIDED IN A LABEL FORM ON THE RELEASE FILM 11; AND A PRESSURE-SENSITIVE ADHESIVE FILM HAVING A LABEL PART 13A COVERING THE ADHESIVE LAYER 12 AND PROVIDED SO AS TO BE IN CONTACT WITH THE RELEASE FILM 11 AROUND THE ADHESIVE LAYER 12 AND A PERIPHERAL PART 13B SURROUNDING AN OUTSIDE OF THE LABEL PART 13A, WHEREIN A THROUGH HOLE PENETRATING THE PRESSURE-SENSITIVE ADHESIVE FILM 12 IS PROVIDED IN A PLACE THAT IS OUTSIDE A PORTION CORRESPONDING TO A PART C OF THE ADHESIVE LAYER 12 INTENDED TO BE ATTACHED TO AN ADHERENT AND INSIDE THE LABEL PART 13A AND THAT INCLUDES A PART R OF THE PRESSURE-SENSITIVE ADHESIVE FILM 13 INTENDED TO BE ATTACHED TO AN ADHERENT. (FIG 1)
MYPI2014002769A 2012-04-02 2013-03-28 Adhesive sheet MY167806A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012083642A JP5158908B1 (en) 2012-04-02 2012-04-02 Adhesive sheet

Publications (1)

Publication Number Publication Date
MY167806A true MY167806A (en) 2018-09-26

Family

ID=48013550

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2014002769A MY167806A (en) 2012-04-02 2013-03-28 Adhesive sheet

Country Status (7)

Country Link
JP (1) JP5158908B1 (en)
KR (1) KR101574910B1 (en)
CN (1) CN103781864B (en)
MY (1) MY167806A (en)
PH (1) PH12014502050B1 (en)
TW (1) TWI496868B (en)
WO (1) WO2013150963A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5158907B1 (en) 2012-04-02 2013-03-06 古河電気工業株式会社 Adhesive sheet
JP2016111160A (en) * 2014-12-04 2016-06-20 古河電気工業株式会社 Tape for wafer processing
JP7164841B2 (en) * 2017-01-12 2022-11-02 ナニワ化工株式会社 Sheet substrate for temporary fixing of electronic parts
WO2019146607A1 (en) * 2018-01-24 2019-08-01 リンテック株式会社 Long laminated sheet, and winding body thereof
JP7713860B2 (en) * 2021-11-08 2025-07-28 リンテック株式会社 SHEET FEEDING APPARATUS AND SHEET FEEDING METHOD

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4666887B2 (en) * 2003-03-03 2011-04-06 日立化成工業株式会社 Adhesive sheet and method for manufacturing semiconductor chip with adhesive
JP5063026B2 (en) * 2005-05-10 2012-10-31 リンテック株式会社 Semiconductor wafer processing sheet and semiconductor wafer processing method
AU2006276650A1 (en) * 2005-08-01 2007-02-08 Lintec Corporation Adhesive sheet
JP4999066B2 (en) * 2006-12-20 2012-08-15 古河電気工業株式会社 Wafer processing tape
JP4829802B2 (en) 2007-01-26 2011-12-07 Ｎｅｃディスプレイソリューションズ株式会社 Image quality improving apparatus and image quality improving method
JP2009256458A (en) * 2008-04-16 2009-11-05 Hitachi Chem Co Ltd Pressure-sensitive adhesive sheet and method for manufacturing semiconductor device
JP5453894B2 (en) * 2008-04-17 2014-03-26 日立化成株式会社 Adhesive sheet
JP5716322B2 (en) * 2010-08-30 2015-05-13 日立化成株式会社 Wafer processing tape
JP2012049474A (en) * 2010-08-30 2012-03-08 Hitachi Chem Co Ltd Wafer process tape
WO2012050134A1 (en) * 2010-10-15 2012-04-19 日立化成工業株式会社 Tape for processing wafer, method for manufacturing tape for processing wafer, and method for manufacturing semiconductor device

Also Published As

Publication number Publication date
JP5158908B1 (en) 2013-03-06
WO2013150963A1 (en) 2013-10-10
JP2013213128A (en) 2013-10-17
PH12014502050A1 (en) 2014-12-10
CN103781864B (en) 2015-09-30
KR101574910B1 (en) 2015-12-04
TWI496868B (en) 2015-08-21
CN103781864A (en) 2014-05-07
TW201348389A (en) 2013-12-01
KR20140035502A (en) 2014-03-21
PH12014502050B1 (en) 2023-03-17

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