MY168738A - Dicing film - Google Patents

Dicing film

Info

Publication number
MY168738A
MY168738A MYPI2015000477A MYPI2015000477A MY168738A MY 168738 A MY168738 A MY 168738A MY PI2015000477 A MYPI2015000477 A MY PI2015000477A MY PI2015000477 A MYPI2015000477 A MY PI2015000477A MY 168738 A MY168738 A MY 168738A
Authority
MY
Malaysia
Prior art keywords
dicing film
base layer
film
dicing
present
Prior art date
Application number
MYPI2015000477A
Other languages
English (en)
Inventor
Oda Naoya
Nagao Yoshinori
Original Assignee
Sumitomo Bakelite Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co filed Critical Sumitomo Bakelite Co
Publication of MY168738A publication Critical patent/MY168738A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2421/00—Presence of unspecified rubber
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2483/00—Presence of polysiloxane
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H10P72/742—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Laminated Bodies (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
MYPI2015000477A 2012-09-25 2013-09-18 Dicing film MY168738A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012210585 2012-09-25

Publications (1)

Publication Number Publication Date
MY168738A true MY168738A (en) 2018-11-29

Family

ID=50388063

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2015000477A MY168738A (en) 2012-09-25 2013-09-18 Dicing film

Country Status (6)

Country Link
JP (1) JP6160623B2 (ja)
KR (1) KR101948374B1 (ja)
CN (1) CN104428873B (ja)
MY (1) MY168738A (ja)
TW (1) TWI614323B (ja)
WO (1) WO2014050658A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI624527B (zh) * 2015-08-26 2018-05-21 feng qian Chen Polyethylene tape

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04196342A (ja) * 1990-11-28 1992-07-16 Mitsui Toatsu Chem Inc 半導体ウエハダイシング用フィルム
JP3984076B2 (ja) * 2002-02-27 2007-09-26 日東電工株式会社 ダイシング用粘着シート
JP2006310846A (ja) * 2005-04-28 2006-11-09 Ls Cable Ltd 半導体用ダイシングダイ接着フィルム
TW200800584A (en) * 2006-04-03 2008-01-01 Gunze Kk Surface protective tape used for back grinding of semiconductor wafer and base film for the surface protective tape
JP4993446B2 (ja) * 2006-09-08 2012-08-08 日東電工株式会社 ウエハ保持用粘着シート
JP2008117943A (ja) * 2006-11-06 2008-05-22 Nitto Denko Corp ウォータージェットレーザダイシング用粘着シート
EP2151858A2 (en) * 2008-08-04 2010-02-10 Nitto Denko Corporation Dicing die-bonding film
JP5561949B2 (ja) 2009-04-08 2014-07-30 日東電工株式会社 熱硬化型ダイボンドフィルム
JP5519189B2 (ja) * 2009-05-27 2014-06-11 日東電工株式会社 電子部品のダイシング用粘着シート
JP5580631B2 (ja) * 2010-03-19 2014-08-27 積水化学工業株式会社 硬化性組成物、ダイシング−ダイボンディングテープ、接続構造体及び粘接着剤層付き半導体チップの製造方法
JP5494075B2 (ja) * 2010-03-19 2014-05-14 住友ベークライト株式会社 ダイシングフィルム
JP2012094834A (ja) * 2010-09-13 2012-05-17 Sumitomo Bakelite Co Ltd ダイシングフィルム
JP4945014B1 (ja) * 2010-09-30 2012-06-06 三井化学株式会社 拡張性フィルム、ダイシングフィルム、および半導体装置の製造方法

Also Published As

Publication number Publication date
WO2014050658A1 (ja) 2014-04-03
JPWO2014050658A1 (ja) 2016-08-22
JP6160623B2 (ja) 2017-07-12
CN104428873A (zh) 2015-03-18
TW201418401A (zh) 2014-05-16
CN104428873B (zh) 2018-01-09
KR20150058100A (ko) 2015-05-28
KR101948374B1 (ko) 2019-02-14
TWI614323B (zh) 2018-02-11

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