MY168813A - A packaging apparatus and method for transferring integrated circuits to a packaging - Google Patents

A packaging apparatus and method for transferring integrated circuits to a packaging

Info

Publication number
MY168813A
MY168813A MYPI2014702936A MYPI2014702936A MY168813A MY 168813 A MY168813 A MY 168813A MY PI2014702936 A MYPI2014702936 A MY PI2014702936A MY PI2014702936 A MYPI2014702936 A MY PI2014702936A MY 168813 A MY168813 A MY 168813A
Authority
MY
Malaysia
Prior art keywords
packaging
integrated circuits
carrier
transferring
transfer units
Prior art date
Application number
MYPI2014702936A
Inventor
Meng Yeow Tan
Chin Sin Ng
Sing Keong Chang
Original Assignee
Kla Tencor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kla Tencor Corp filed Critical Kla Tencor Corp
Publication of MY168813A publication Critical patent/MY168813A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/16—Trays for chips

Abstract

A PACKAGING APPARATUS (100) AND METHOD FOR TRANSFERRING INTEGRATED CIRCUITS TO A PACKAGING, THE APPARATUS COMPRISING: A CARRIER (8) FOR CARRYING A PLURALITY OF INTEGRATED CIRCUITS (302) AND MOVING THE INTEGRATED CIRCUITS BETWEEN A LOCATION OF THE FIRST PACKAGING (301, 2300) AND A FIRST LOCATION, THE FIRST PACKAGING BEING CONFIGURED FOR HOLDING A PLURALITY OF INTEGRATED CIRCUITS; A FIRST PLURALITY OF TRANSFER UNITS (2), THE FIRST PLURALITY OF TRANSFER UNITS BEING CONFIGURED FOR TRANSFERRING ONE OR MORE INTEGRATED CIRCUITS FROM THE FIRST PACKAGING TO THE CARRIER; AND A SECOND PLURALITY OF TRANSFER UNITS, THE SECOND PLURALITY OF TRANSFER UNITS (10) BEING CONFIGURED FOR TRANSFERRING ONE OR MORE INTEGRATED CIRCUITS FROM THE CARRIER IN THE FIRST LOCATION TO ONE OR MORE RESPECTIVE HOLDERS IN A SECOND PACKAGING (6, 12), SAID CARRIER COMPRISING A PLURALITY OF SEATS (2101, 2102, 2103) FOR RECEIVING INTEGRATED CIRCUITS, SAID CARRIER BEING CONFIGURED FOR ADJUSTING EACH RECEIVED INTEGRATED CIRCUIT TO ASSUME AN ORIENTATION IF MISALIGNMENT FROM THE ORIENTATION OCCURS. FIGURE 1
MYPI2014702936A 2012-04-25 2013-04-25 A packaging apparatus and method for transferring integrated circuits to a packaging MY168813A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG2012030326A SG194255A1 (en) 2012-04-25 2012-04-25 A packaging apparatus and method for transferring integrated circuits to a packaging

Publications (1)

Publication Number Publication Date
MY168813A true MY168813A (en) 2018-12-04

Family

ID=49483603

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2014702936A MY168813A (en) 2012-04-25 2013-04-25 A packaging apparatus and method for transferring integrated circuits to a packaging

Country Status (4)

Country Link
MY (1) MY168813A (en)
SG (1) SG194255A1 (en)
TW (1) TWI578410B (en)
WO (1) WO2013162475A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109390267B (en) * 2017-08-09 2023-03-21 创新服务股份有限公司 Method and apparatus for transferring micro-components in batches
CN116331793B (en) * 2023-03-30 2023-09-26 芯朋半导体科技(如东)有限公司 Plastic package feeding device for integrated circuit back-end

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG75883A1 (en) * 1998-10-06 2000-10-24 Advanced Systems Automation Redistribution system
KR20030068703A (en) * 2002-02-16 2003-08-25 삼성전자주식회사 Semiconductor chip package multi feeding apparatus comprising multi heads and a rotary table
KR20030090842A (en) * 2002-05-22 2003-12-01 삼성전자주식회사 Semiconductor chip package multi feeding apparatus
KR20040009803A (en) * 2002-07-25 2004-01-31 삼성전자주식회사 Pick and place apparatus for semiconductor chip package that vacuum pad pitch setting is free
WO2007083360A1 (en) * 2006-01-17 2007-07-26 Ueno Seiki Co., Ltd. Semiconductor fabrication device and fabrication method
NL2001790C2 (en) * 2008-07-11 2010-01-12 Fico Bv Device and method for cutting electronic components.
CN201302987Y (en) * 2008-11-07 2009-09-02 华中科技大学 Vision-guided pick-and-place device
SG170645A1 (en) * 2009-11-02 2011-05-30 Semiconductor Tech & Instr Inc System and method for flexible high speed transfer of semiconductor components
KR101134918B1 (en) * 2009-12-09 2012-04-17 주식회사 고려반도체시스템 Picker apparatus for transporting semiconductor unit and control method thereof

Also Published As

Publication number Publication date
TWI578410B (en) 2017-04-11
SG194255A1 (en) 2013-11-29
TW201407690A (en) 2014-02-16
WO2013162475A1 (en) 2013-10-31

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