MY172097A - Molded article production apparatus, molded article production method, and molded article - Google Patents

Molded article production apparatus, molded article production method, and molded article

Info

Publication number
MY172097A
MY172097A MYPI2014000881A MYPI2014000881A MY172097A MY 172097 A MY172097 A MY 172097A MY PI2014000881 A MYPI2014000881 A MY PI2014000881A MY PI2014000881 A MYPI2014000881 A MY PI2014000881A MY 172097 A MY172097 A MY 172097A
Authority
MY
Malaysia
Prior art keywords
molded article
gate nozzle
resin
gate
liquid resin
Prior art date
Application number
MYPI2014000881A
Inventor
Kawakubo Kazuki
Tokuyama Hideki
hirata Yusuke
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Publication of MY172097A publication Critical patent/MY172097A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/03—Injection moulding apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/1742—Mounting of moulds; Mould supports
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

[OBJECT] To mold all kinds of products with liquid resin by using a movable gate nozzle in a molded article production apparatus. [SOLVING MEANS] A gate nozzle 15 for feeding liquid resm is provided movably upward and downward in a through passage 19 formed in a lower die 11. A gate nozzle driving mechanism 16 moves the gate nozzle 15 upward to an opening 23 of a substrate 22 located in the lower die 11 to communicate a resin flow passage 24, a gate 25, and the opening 23 with one another. Then, the liquid resin is injected into a cavity 1 7 provided in an upper die 7. The liquid resin is cured, and a chip electronic component 21 mounted on the substrate 22 is sealed with the cured resin. The gate nozzle 15 is moved downward to separate vicinity of the gate 25 of the gate nozzle 15 from the cured resin. The liquid resin in the gate nozzle 15 is cooled by a coolant flowing on the outer side of the wall of the resin flow passage 24.
MYPI2014000881A 2013-03-27 2014-03-25 Molded article production apparatus, molded article production method, and molded article MY172097A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013066872A JP6144085B2 (en) 2013-03-27 2013-03-27 Molded product production apparatus and molded product production method

Publications (1)

Publication Number Publication Date
MY172097A true MY172097A (en) 2019-11-13

Family

ID=51592444

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2014000881A MY172097A (en) 2013-03-27 2014-03-25 Molded article production apparatus, molded article production method, and molded article

Country Status (5)

Country Link
JP (1) JP6144085B2 (en)
KR (1) KR101559231B1 (en)
CN (1) CN104070634B (en)
MY (1) MY172097A (en)
TW (1) TWI527278B (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6440599B2 (en) 2015-08-28 2018-12-19 Ｔｏｗａ株式会社 Resin molding apparatus and resin molding method
CN107526996A (en) * 2016-06-21 2017-12-29 旭景科技股份有限公司 Fingerprint sensing chip packaging method and fingerprint sensing module manufactured by using same
TWI643310B (en) * 2017-02-18 2018-12-01 林立宸 Method for preparing package without substrate and application thereof
CN107399041B (en) * 2017-06-05 2019-04-16 湖北久祥电子科技有限公司 A kind of LED packaging technology of riveted sealing
JP2019034444A (en) * 2017-08-10 2019-03-07 Ｔｏｗａ株式会社 Conveying mechanism of resin molded product, resin molding apparatus, and manufacturing method of resin molded product
JP6891836B2 (en) * 2018-03-07 2021-06-18 住友電装株式会社 Connector and its manufacturing method
CN111791446A (en) * 2020-07-10 2020-10-20 陈勇成 Injection molding machine for large plastic products
TWI817277B (en) * 2021-12-03 2023-10-01 日商山田尖端科技股份有限公司 Resin supply mechanism and resin sealing device provided with same
JP7705831B2 (en) * 2022-07-22 2025-07-10 Ｔｏｗａ株式会社 Conveying device, resin molding device, and method for manufacturing resin molded product
CN115284553B (en) * 2022-07-28 2023-04-11 嘉兴精科科技有限公司 High-precision foldable mobile phone rotating shaft assembly forming device and technology
JP2024030454A (en) * 2022-08-24 2024-03-07 アピックヤマダ株式会社 Resin sealing equipment and resin sealing method

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04111768U (en) * 1991-03-14 1992-09-29 株式会社小糸製作所 Mold structure of modular type LED
JP3434924B2 (en) * 1994-12-29 2003-08-11 テイ・エス テック株式会社 Skin integral molding device
EP0971401B1 (en) * 1998-07-10 2010-06-09 Apic Yamada Corporation Method of manufacturing semiconductor devices and a resin molding machine therefor
JP2004207290A (en) 2002-12-24 2004-07-22 Seiko Epson Corp Semiconductor device manufacturing method and manufacturing apparatus
JP2006175771A (en) * 2004-12-24 2006-07-06 Prc:Kk Injection molding method and injection molding apparatus
JP4954171B2 (en) * 2008-09-30 2012-06-13 Ｔｏｗａ株式会社 Compressed resin sealing molding method and apparatus for electronic parts
KR101254860B1 (en) * 2008-09-30 2013-04-15 토와 가부시기가이샤 Resin sealing compression molding method for electronic component and device therefor

Also Published As

Publication number Publication date
KR20140118708A (en) 2014-10-08
CN104070634B (en) 2017-06-09
CN104070634A (en) 2014-10-01
KR101559231B1 (en) 2015-10-12
JP6144085B2 (en) 2017-06-07
TW201442297A (en) 2014-11-01
TWI527278B (en) 2016-03-21
JP2014192362A (en) 2014-10-06

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