MY173371A - Conductive material - Google Patents

Conductive material

Info

Publication number
MY173371A
MY173371A MYPI2013701775A MYPI2013701775A MY173371A MY 173371 A MY173371 A MY 173371A MY PI2013701775 A MYPI2013701775 A MY PI2013701775A MY PI2013701775 A MYPI2013701775 A MY PI2013701775A MY 173371 A MY173371 A MY 173371A
Authority
MY
Malaysia
Prior art keywords
conductive material
mass
resin binder
conductive
conductive particle
Prior art date
Application number
MYPI2013701775A
Inventor
Yasuo Tsuruoka
Takeshi Nojiri
Shuuichirou Adachi
Takahiro Fukutomi
Waka INOUE
Kenzou Takemura
Michio Uruno
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of MY173371A publication Critical patent/MY173371A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
    • H10F19/90—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers
    • H10F19/902—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers for series or parallel connection of photovoltaic cells
    • H10F19/906—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers for series or parallel connection of photovoltaic cells characterised by the materials of the structures
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/547—Monocrystalline silicon PV cells

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Photovoltaic Devices (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Powder Metallurgy (AREA)

Abstract

A conductive material used for connecting electrodes of a solar battery cell (100) and wiring members ( 4 ), the conductive material comprising a resin binder; and a conductive particle dispersed in the resin binder, wherein the conductive particle comprises a phosphorous-containing copper alloy having a phosphorus content of 0.01 % by mass or more and 8% by mass or less.
MYPI2013701775A 2011-07-21 2012-07-20 Conductive material MY173371A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011159988 2011-07-21

Publications (1)

Publication Number Publication Date
MY173371A true MY173371A (en) 2020-01-21

Family

ID=47558246

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2013701775A MY173371A (en) 2011-07-21 2012-07-20 Conductive material

Country Status (4)

Country Link
JP (1) JP6167900B2 (en)
CN (1) CN103563011B (en)
MY (1) MY173371A (en)
WO (1) WO2013012071A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107591460B (en) * 2017-09-27 2020-06-09 西安泰力松新材料股份有限公司 Photovoltaic solder strip and preparation method thereof
US20250089381A1 (en) * 2023-09-08 2025-03-13 3Sun S.R.L. Photovoltaic module with improved photovoltaic cell interconnection conductivity and related manufacturing process

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4244466B2 (en) * 1999-10-13 2009-03-25 株式会社村田製作所 Conductive paste and semiconductor ceramic electronic component using the same
US7108806B2 (en) * 2003-02-28 2006-09-19 National Starch And Chemical Investment Holding Corporation Conductive materials with electrical stability and good impact resistance for use in electronics devices
JP4158713B2 (en) * 2004-02-03 2008-10-01 住友金属鉱山株式会社 Copper paste composition for external electrodes
JP2007019106A (en) * 2005-07-05 2007-01-25 Kyocera Chemical Corp Conductive paste for forming electrode, and photovoltaic cell
JP5121181B2 (en) * 2006-07-28 2013-01-16 三洋電機株式会社 Photovoltaic element and manufacturing method thereof
JP5350384B2 (en) * 2007-09-13 2013-11-27 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン Conductive composition
JP2010013730A (en) * 2008-06-05 2010-01-21 Mitsui Mining & Smelting Co Ltd Copper powder for conductive paste, and conductive paste
JP2010059469A (en) * 2008-09-03 2010-03-18 Asahi Glass Co Ltd Method for producing copper nanoparticle, metal paste and article having metal film
PH12012500718A1 (en) * 2009-10-15 2012-10-29 Hitachi Chemical Co Ltd Conductive adhesive, solar cell, method for manufacturing solar cell, and solar cell module
JP5633286B2 (en) * 2010-01-25 2014-12-03 日立化成株式会社 Electrode paste composition and solar cell
JP2011171270A (en) * 2010-01-25 2011-09-01 Hitachi Chem Co Ltd Paste composition for electrode, and solar cell
JP5633285B2 (en) * 2010-01-25 2014-12-03 日立化成株式会社 Electrode paste composition and solar cell
CN101887767B (en) * 2010-06-11 2011-08-17 山东大学 Method for preparing conductive paste by taking copper powder with surface coverage silver nanostructures as packing

Also Published As

Publication number Publication date
JPWO2013012071A1 (en) 2015-02-23
CN103563011B (en) 2016-11-09
CN103563011A (en) 2014-02-05
JP6167900B2 (en) 2017-07-26
WO2013012071A1 (en) 2013-01-24

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