MY173967A - Cutting apparatus, sucking mechanism, and apparatus mounted with the sucking mechanism - Google Patents

Cutting apparatus, sucking mechanism, and apparatus mounted with the sucking mechanism

Info

Publication number
MY173967A
MY173967A MYPI2015002168A MYPI2015002168A MY173967A MY 173967 A MY173967 A MY 173967A MY PI2015002168 A MYPI2015002168 A MY PI2015002168A MY PI2015002168 A MYPI2015002168 A MY PI2015002168A MY 173967 A MY173967 A MY 173967A
Authority
MY
Malaysia
Prior art keywords
sucking
sucking mechanism
vacuum
sucking member
holes
Prior art date
Application number
MYPI2015002168A
Inventor
Okamoto Jun
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Publication of MY173967A publication Critical patent/MY173967A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks

Landscapes

  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Jigs For Machine Tools (AREA)

Abstract

In an sucking member of a cutting apparatus, a vibration absorbing material is used to increase a frictional force on the surface of the sucking member. [Solution] In a cutting apparatus, a base (17) with a vacuum sucking jig (7) attached thereon is used as a cutting table (16). On the cutting table (16), a plurality of suction holes (13) formed in a sucking member (9), a plurality of through holes (14) formed in a metal plate (18), and a space (18) present on the base (17) are in communication with one another. By using a vacuum pump (21), air is suctioned sequentially via the space (18), through holes (14), and suction holes (13) to suck a sealed substrate (1) or a plurality of product regions (6). A vibration absorbing material is used in the sucking member (9) to lessen vibration on the surface of the sucking member (9) to consequently increase a frictional force on the surface of the vacuum sucking jig (7). This may allow the vacuum sucking jig (7) to hold the sealed substrate (1) or the product regions (6) with a greater holding power.
MYPI2015002168A 2014-09-04 2015-09-03 Cutting apparatus, sucking mechanism, and apparatus mounted with the sucking mechanism MY173967A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014180254A JP6382039B2 (en) 2014-09-04 2014-09-04 Cutting apparatus, adsorption mechanism and apparatus using the same

Publications (1)

Publication Number Publication Date
MY173967A true MY173967A (en) 2020-02-28

Family

ID=55471207

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2015002168A MY173967A (en) 2014-09-04 2015-09-03 Cutting apparatus, sucking mechanism, and apparatus mounted with the sucking mechanism

Country Status (5)

Country Link
JP (1) JP6382039B2 (en)
KR (1) KR20160028953A (en)
CN (1) CN105405805A (en)
MY (1) MY173967A (en)
TW (1) TWI566291B (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101899653B1 (en) * 2016-10-05 2018-09-18 주식회사 포스코 Workpiece setting apparatus
JP6791581B2 (en) * 2016-11-11 2020-11-25 株式会社ディスコ Jig table for cutting package substrate
JP6626027B2 (en) * 2017-03-16 2019-12-25 Ｔｏｗａ株式会社 Manufacturing apparatus and electronic component manufacturing method
JP2019016700A (en) * 2017-07-07 2019-01-31 Ｔｏｗａ株式会社 Holding member, method for manufacturing holding member, holding device, conveyance device, and device for manufacturing electronic component
JP6886379B2 (en) * 2017-09-28 2021-06-16 Ｔｏｗａ株式会社 Holding member, manufacturing method of holding member, inspection device and cutting device
JP7102157B2 (en) * 2018-02-08 2022-07-19 Ｔｏｗａ株式会社 Cutting device and manufacturing method of cut products
CN108435714B (en) * 2018-04-12 2023-08-29 环维电子(上海)有限公司 Novel dry ice cleaning base and cleaning method thereof
JP6746756B1 (en) * 2019-05-24 2020-08-26 Ｔｏｗａ株式会社 Suction plate, cutting device and cutting method
JP7390855B2 (en) * 2019-10-24 2023-12-04 株式会社ディスコ Chuck table of cutting equipment
JP7423161B2 (en) * 2020-06-30 2024-01-29 株式会社ディスコ chuck table
KR102888135B1 (en) * 2021-03-18 2025-11-19 토와 가부시기가이샤 Processing device and method for manufacturing processed products
US11993066B2 (en) * 2021-03-31 2024-05-28 Taiwan Semiconductor Manufacturing Company, Ltd. Chuck, lamination process, and manufacturing method of semiconductor package using the same
KR102675684B1 (en) * 2022-10-21 2024-06-18 가부시끼가이샤 도꼬 다까오까 work inspection device
JP7822348B2 (en) * 2023-07-26 2026-03-02 Ｔｏｗａ株式会社 Holding member, cutting table, cutting device, and method for manufacturing semiconductor device

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62234686A (en) * 1986-04-02 1987-10-14 Mitsubishi Electric Corp Cutting method for working material
JPS62234685A (en) * 1986-04-02 1987-10-14 Mitsubishi Electric Corp Cutting method for working material
KR20040084128A (en) * 2003-03-26 2004-10-06 한미반도체 주식회사 Chuck table of Sawing equipment
JP2004330417A (en) * 2003-04-30 2004-11-25 Towa Corp Board cutting method, board cutting device and board sucking and fixing mechanism
JP2006229129A (en) * 2005-02-21 2006-08-31 Fujitsu Ltd Vacuum suction apparatus
JP2006344827A (en) * 2005-06-09 2006-12-21 Renesas Technology Corp Manufacturing method of semiconductor device
FR2893873B1 (en) * 2005-11-25 2008-12-12 Air Liquide PROCESS FOR CUTTING WITH A STAINLESS STEEL FIBER LASER
JP2008221391A (en) * 2007-03-13 2008-09-25 Matsushita Electric Ind Co Ltd Substrate adsorption fixing mechanism
JP5086690B2 (en) * 2007-05-18 2012-11-28 日本特殊陶業株式会社 Manufacturing method of ceramic substrate
JP5117772B2 (en) * 2007-06-28 2013-01-16 株式会社ディスコ Cutting equipment
JP2011040542A (en) 2009-08-10 2011-02-24 Disco Abrasive Syst Ltd Dividing method of package substrate
JP2011216704A (en) * 2010-03-31 2011-10-27 Furukawa Electric Co Ltd:The Adhesive tape for semiconductor wafer processing

Also Published As

Publication number Publication date
KR20160028953A (en) 2016-03-14
JP2016054256A (en) 2016-04-14
TWI566291B (en) 2017-01-11
CN105405805A (en) 2016-03-16
TW201616566A (en) 2016-05-01
JP6382039B2 (en) 2018-08-29

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