MY177230A - Cutting apparatus - Google Patents

Cutting apparatus

Info

Publication number
MY177230A
MY177230A MYPI2015000515A MYPI2015000515A MY177230A MY 177230 A MY177230 A MY 177230A MY PI2015000515 A MYPI2015000515 A MY PI2015000515A MY PI2015000515 A MYPI2015000515 A MY PI2015000515A MY 177230 A MY177230 A MY 177230A
Authority
MY
Malaysia
Prior art keywords
vibration signal
unit
vibration
cutting blade
ultrasonic vibrator
Prior art date
Application number
MYPI2015000515A
Inventor
Kubo Masahiro
Nakanishi Yuji
Izumi Kuniharu
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of MY177230A publication Critical patent/MY177230A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Dicing (AREA)
  • Turning (AREA)

Abstract

A cutting apparatus (2) includes a vibration signal generating unit (68) for generating a vibration signal corresponding to the vibration of a cutting blade (60) and a control unit (78) for determining the condition of the cutting blade (60) according to the vibration signal generated by the vibration signal generating unit (68) . The vibration signal generating unit (68) includes an ultrasonic vibrator provided in a first flange member (46) for generating a voltage corresponding to the vibration signal corresponding to the vibration of the cutting blade (60) and a transmitting unit connected to the ultrasonic vibrator for transmitting the voltage to the control unit (78) . The ultrasonic vibrator is composed of a plurality of ultrasonic vibrators (70) different in resonance frequency, wherein the plural ultrasonic vibrators (70) are provided in the first flange member (46) and connected in parallel to a first coil unit constituting the transmitting unit. The most illustrative drawing is FIG. 3.
MYPI2015000515A 2014-03-07 2015-02-27 Cutting apparatus MY177230A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014044995A JP6223238B2 (en) 2014-03-07 2014-03-07 Cutting equipment

Publications (1)

Publication Number Publication Date
MY177230A true MY177230A (en) 2020-09-09

Family

ID=54023048

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2015000515A MY177230A (en) 2014-03-07 2015-02-27 Cutting apparatus

Country Status (5)

Country Link
JP (1) JP6223238B2 (en)
KR (1) KR102228491B1 (en)
CN (1) CN104889868B (en)
MY (1) MY177230A (en)
TW (1) TWI651179B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108297178B (en) * 2018-01-23 2021-05-07 东莞理工学院 Double-column cutting device with feedback function
CN115023317A (en) * 2020-01-29 2022-09-06 株式会社则武 AE signal detection device of grinding wheel
CN117260485A (en) * 2023-09-26 2023-12-22 中国航发沈阳黎明航空发动机有限责任公司 A sand belt polishing blade device
CN118664477A (en) * 2024-07-11 2024-09-20 吉林大学 Dual auxiliary wafer cutting equipment combining laser and ultrasound

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS474816Y1 (en) 1967-03-30 1972-02-21
US4514797A (en) * 1982-09-03 1985-04-30 Gte Valeron Corporation Worn tool detector utilizing normalized vibration signals
JPS6062464A (en) * 1983-09-10 1985-04-10 Kawasaki Steel Corp Side end grinding attachment for metallic belt by rotary grinding wheel
JPH0499946A (en) * 1990-08-20 1992-03-31 Sanko Control Kk Method and apparatus for measuring cutting ability of grinder wheel
JPH05154833A (en) * 1991-12-09 1993-06-22 Nikko Kyodo Co Ltd Dicing machine
JP3534338B2 (en) * 1999-10-07 2004-06-07 松下電器産業株式会社 Cutting equipment
JP2002066879A (en) * 2000-09-04 2002-03-05 Bosch Automotive Systems Corp Acoustic emission detecting device for machine tool
JP4658730B2 (en) * 2005-07-28 2011-03-23 株式会社ディスコ Cutting equipment
WO2007080699A1 (en) * 2006-01-12 2007-07-19 Tokyo Seimitsu Co., Ltd. Working system, contact detecting method, and ae contact detecting device
JP2007187512A (en) * 2006-01-12 2007-07-26 Nec Corp Monitoring device and monitoring system
JP4552883B2 (en) * 2006-04-19 2010-09-29 株式会社デンソー Vibration detection method
JP2008290203A (en) * 2007-05-25 2008-12-04 Nissan Diesel Motor Co Ltd Grinding work monitoring system and grinding work monitoring method
JP2009032726A (en) * 2007-07-24 2009-02-12 Disco Abrasive Syst Ltd Wafer division method
TW201226101A (en) * 2010-12-28 2012-07-01 Nat Univ Chung Hsing Method and device to detect the state of cutting tool in machine tool with multiple sensors
JP5258921B2 (en) * 2011-03-31 2013-08-07 株式会社小松製作所 Machine tool and its processing control device
JP5764031B2 (en) * 2011-10-06 2015-08-12 株式会社ディスコ Cutting equipment
JP5943578B2 (en) * 2011-10-11 2016-07-05 株式会社東京精密 Wafer chamfering apparatus, and method for detecting surface state of chamfering grindstone or processing state of wafer by chamfering grindstone
TW201332704A (en) * 2012-02-10 2013-08-16 中原大學 Cutting edge chip-buildup monitoring method

Also Published As

Publication number Publication date
KR20150105222A (en) 2015-09-16
CN104889868B (en) 2019-07-30
CN104889868A (en) 2015-09-09
TWI651179B (en) 2019-02-21
JP6223238B2 (en) 2017-11-01
TW201540457A (en) 2015-11-01
JP2015170744A (en) 2015-09-28
KR102228491B1 (en) 2021-03-15

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