MY177272A - Mold cleaner composition and mold cleaning material, and mold cleaning method using the same - Google Patents

Mold cleaner composition and mold cleaning material, and mold cleaning method using the same

Info

Publication number
MY177272A
MY177272A MYPI2010003374A MYPI2010003374A MY177272A MY 177272 A MY177272 A MY 177272A MY PI2010003374 A MYPI2010003374 A MY PI2010003374A MY PI2010003374 A MYPI2010003374 A MY PI2010003374A MY 177272 A MY177272 A MY 177272A
Authority
MY
Malaysia
Prior art keywords
mold
mold cleaning
same
cleaner composition
cleaning method
Prior art date
Application number
MYPI2010003374A
Inventor
Takashima Kouichi
Fujimaki Kaname
Oka Jouji
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2009169331A external-priority patent/JP5604822B2/en
Priority claimed from JP2009169330A external-priority patent/JP6116789B2/en
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of MY177272A publication Critical patent/MY177272A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D17/00—Detergent materials or soaps characterised by their shape or physical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/70—Maintenance
    • B29C33/72—Cleaning
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D17/00—Detergent materials or soaps characterised by their shape or physical properties
    • C11D17/06—Powder; Flakes; Free-flowing mixtures; Sheets
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50—Solvents

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

The present invention relates to a mold cleaning composition for heat molding in which molding is repeatedly performed using a molding material, including: at least one of a synthetic rubber and a synthetic resin which serves as a base material; at least one of an alkali metal salt and an alkali metal hydroxide; and at least one of water and an organic solvent.
MYPI2010003374A 2009-07-17 2010-07-16 Mold cleaner composition and mold cleaning material, and mold cleaning method using the same MY177272A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009169331A JP5604822B2 (en) 2009-07-17 2009-07-17 Semiconductor device molding die cleaning composition, semiconductor device molding die cleaning material, and semiconductor device molding die cleaning method using the same
JP2009169330A JP6116789B2 (en) 2009-07-17 2009-07-17 Semiconductor device molding die cleaning sheet and semiconductor device molding die cleaning method using the same

Publications (1)

Publication Number Publication Date
MY177272A true MY177272A (en) 2020-09-10

Family

ID=43483445

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2010003374A MY177272A (en) 2009-07-17 2010-07-16 Mold cleaner composition and mold cleaning material, and mold cleaning method using the same

Country Status (5)

Country Link
KR (2) KR101788859B1 (en)
CN (1) CN101955858B (en)
MY (1) MY177272A (en)
SG (1) SG168489A1 (en)
TW (1) TWI499668B (en)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013011876A1 (en) * 2011-07-15 2013-01-24 日本カーバイド工業株式会社 Mold-cleaning resin composition
KR101334251B1 (en) * 2012-03-08 2013-11-29 재단법인 대구테크노파크 Composition for EMC mold cleaning comprising nano sized inorganic filler
KR101334249B1 (en) * 2012-03-08 2013-11-29 재단법인 대구테크노파크 Composition for EMC mold cleaning comprising cleaning agent grafted inorganic filler
CN102864458B (en) * 2012-08-31 2014-04-16 昆山艾森半导体材料有限公司 Environment protection type weakly acidic deburring softening solution and preparation method and use method thereof
JP6265918B2 (en) * 2013-01-31 2018-01-24 日本カーバイド工業株式会社 Mold cleaning resin composition and mold cleaning method
CN103526214B (en) * 2013-09-05 2015-12-09 汉中锌业有限责任公司 The method for cleaning of zinc ingot metal mould in a kind of zinc hydrometallurgy
CN104450302A (en) * 2014-11-17 2015-03-25 厦门市钰林丰橡塑科技有限公司 Flame-retardant high-temperature resistant environment-friendly cleaning product
JP6715627B2 (en) * 2016-03-18 2020-07-01 日本カーバイド工業株式会社 Mold cleaning resin composition
CN105773882A (en) * 2016-04-19 2016-07-20 上海东恒化工有限公司 Composition for die cleaning and die cleaning method
CN108431197B (en) * 2016-08-25 2021-06-29 化研科技株式会社 Cleaning agent composition and cleaning method
CN109735116B (en) * 2019-01-04 2021-03-30 山西大学 A kind of oily cleaning cotton and preparation method thereof
CN111423630A (en) * 2020-04-23 2020-07-17 江苏多肯新材料有限公司 Rubber mixture for cleaning self-adhesive mold, preparation method and use method thereof
CN112080347B (en) * 2020-07-27 2023-12-08 中国电力科学研究院有限公司 A cleaning agent for removing contamination on the surface of silicone rubber insulation and its preparation method
CN112847973A (en) * 2021-01-06 2021-05-28 珠海格力新元电子有限公司 Mold cleaning method
CN114456884A (en) * 2021-12-30 2022-05-10 安莱博医药(苏州)有限公司 ICP component cleaning agent
CN115093620A (en) * 2022-06-30 2022-09-23 江阴鼎言密封件有限公司 Mold washing glue for rubber vulcanization forming mold and processing technology thereof
CN115181612A (en) * 2022-08-05 2022-10-14 惠州市百世杰喜庆用品有限公司 Mahjong cleaning agent and preparation method thereof

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2933285B2 (en) * 1990-04-27 1999-08-09 有限会社ファインテック研究所 Cleaning agent used for cleaning plastic molding machines
JP3764239B2 (en) * 1996-12-10 2006-04-05 日東電工株式会社 Mold cleaning composition for molding semiconductor device and mold cleaning method using the same
JP2949574B2 (en) * 1997-01-09 1999-09-13 花王株式会社 Cleaning composition for resin stains
US7531490B2 (en) * 2004-10-01 2009-05-12 Kao Corporation Detergent composition comprising calcium gluconate and a mixture of calcium ion sequestering agents
JP4943225B2 (en) * 2006-05-25 2012-05-30 日東電工株式会社 Mold cleaning composition
MY148591A (en) * 2006-05-25 2013-05-15 Nitto Denko Corp Mold cleaning composition
JP2008213313A (en) * 2007-03-05 2008-09-18 Nitto Denko Corp Mold regeneration sheet and mold cleaning method using the same
WO2009057479A1 (en) * 2007-10-29 2009-05-07 Nippon Carbide Kogyo Kabushiki Kaisha Mold cleaning rubber compositon

Also Published As

Publication number Publication date
TWI499668B (en) 2015-09-11
CN101955858B (en) 2013-01-30
KR20170091558A (en) 2017-08-09
TW201107462A (en) 2011-03-01
KR20110007983A (en) 2011-01-25
SG168489A1 (en) 2011-02-28
CN101955858A (en) 2011-01-26
KR101788859B1 (en) 2017-10-20

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