MY177757A - Fixed abrasive grain wire saw and method for dressing fixed abrasive grain wire saw - Google Patents

Fixed abrasive grain wire saw and method for dressing fixed abrasive grain wire saw

Info

Publication number
MY177757A
MY177757A MYPI2016703868A MYPI2016703868A MY177757A MY 177757 A MY177757 A MY 177757A MY PI2016703868 A MYPI2016703868 A MY PI2016703868A MY PI2016703868 A MYPI2016703868 A MY PI2016703868A MY 177757 A MY177757 A MY 177757A
Authority
MY
Malaysia
Prior art keywords
fixed abrasive
abrasive grain
grain wire
workpiece
dressing
Prior art date
Application number
MYPI2016703868A
Other languages
English (en)
Inventor
Kumazawa Kenichi
Original Assignee
Read Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Read Co Ltd filed Critical Read Co Ltd
Publication of MY177757A publication Critical patent/MY177757A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0633—Grinders for cutting-off using a cutting wire
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/02—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
    • B28D1/08—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing with saw-blades of endless cutter-type, e.g. chain saws, i.e. saw chains, strap saws
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/042—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with blades or wires mounted in a reciprocating frame

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
MYPI2016703868A 2015-10-28 2016-10-21 Fixed abrasive grain wire saw and method for dressing fixed abrasive grain wire saw MY177757A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015212079A JP6270796B2 (ja) 2015-10-28 2015-10-28 固定砥粒ワイヤーソー及び固定砥粒ワイヤーのドレッシング方法

Publications (1)

Publication Number Publication Date
MY177757A true MY177757A (en) 2020-09-23

Family

ID=58710211

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2016703868A MY177757A (en) 2015-10-28 2016-10-21 Fixed abrasive grain wire saw and method for dressing fixed abrasive grain wire saw

Country Status (5)

Country Link
JP (1) JP6270796B2 (zh)
KR (1) KR20170049411A (zh)
CN (1) CN106626111B (zh)
MY (1) MY177757A (zh)
TW (1) TWI729010B (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6693460B2 (ja) * 2017-04-04 2020-05-13 信越半導体株式会社 ワークの切断方法
CN107457452A (zh) * 2017-09-28 2017-12-12 张家港天工机械制造有限公司 一种开刃复绕机用开刃装置
JP6819621B2 (ja) * 2018-01-25 2021-01-27 信越半導体株式会社 ワークの切断方法及びワイヤソー
CN110421213A (zh) * 2019-07-03 2019-11-08 苏州锦美川自动化科技有限公司 高速开刃复绕机

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1128654A (ja) * 1997-07-04 1999-02-02 Tokyo Seimitsu Co Ltd 固定砥粒ワイヤソーのドレッシング方法及び装置
EP2343155B1 (en) * 2003-10-27 2014-08-20 Mitsubishi Denki Kabushiki Kaisha Multi-wire saw
JP4411062B2 (ja) * 2003-12-25 2010-02-10 株式会社アライドマテリアル 超砥粒ワイヤソー巻き付け構造、超砥粒ワイヤソー切断装置および超砥粒ワイヤソーの巻き付け方法
JP2011031386A (ja) * 2009-07-10 2011-02-17 Mitsubishi Chemicals Corp 電着式固定砥粒ワイヤーおよびこれを用いた結晶スライス方法
WO2013172353A1 (ja) * 2012-05-15 2013-11-21 電気化学工業株式会社 積層体の加工装置及び加工方法
KR20140090906A (ko) * 2013-01-10 2014-07-18 주식회사 엘지실트론 와이어 쏘 장치 및 이를 이용한 잉곳 슬라이싱 방법
JP2015009346A (ja) * 2013-07-02 2015-01-19 パナソニック株式会社 電解ドレッシング方法、及び電解ドレッシング装置

Also Published As

Publication number Publication date
CN106626111B (zh) 2020-01-07
KR20170049411A (ko) 2017-05-10
TW201726323A (zh) 2017-08-01
JP2017080849A (ja) 2017-05-18
TWI729010B (zh) 2021-06-01
CN106626111A (zh) 2017-05-10
JP6270796B2 (ja) 2018-01-31

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