MY177767A - Copper wire for bonding wire - Google Patents

Copper wire for bonding wire

Info

Publication number
MY177767A
MY177767A MYPI2016701080A MYPI2016701080A MY177767A MY 177767 A MY177767 A MY 177767A MY PI2016701080 A MYPI2016701080 A MY PI2016701080A MY PI2016701080 A MYPI2016701080 A MY PI2016701080A MY 177767 A MY177767 A MY 177767A
Authority
MY
Malaysia
Prior art keywords
wire
copper
bonding
copper wire
bonding wire
Prior art date
Application number
MYPI2016701080A
Inventor
Kumagai Satoshi
Gu Yu
Sato Yuji
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Publication of MY177767A publication Critical patent/MY177767A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01565—Thermally treating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Wire Bonding (AREA)
  • Metal Extraction Processes (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

A copper wire for a bonding wire for forming a bonding wire is disclosed, in which the copper wire is formed of high-purity copper having a purity of 99.9999 mass% or more, a wire diameter of the copper wire is 0.5 mm to 3.5 mm, and an area ratio of a (001) plane in a cross-section of the copper wire perpendicular to a wire-drawing direction is 15% to 30%.
MYPI2016701080A 2013-10-10 2014-09-30 Copper wire for bonding wire MY177767A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013213114A JP5747970B2 (en) 2013-10-10 2013-10-10 Copper wire for bonding wire

Publications (1)

Publication Number Publication Date
MY177767A true MY177767A (en) 2020-09-23

Family

ID=52812946

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2016701080A MY177767A (en) 2013-10-10 2014-09-30 Copper wire for bonding wire

Country Status (8)

Country Link
JP (1) JP5747970B2 (en)
KR (1) KR101558138B1 (en)
CN (1) CN104904000B (en)
MY (1) MY177767A (en)
PH (1) PH12016500617A1 (en)
SG (1) SG11201602116YA (en)
TW (1) TWI540212B (en)
WO (1) WO2015053128A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102167478B1 (en) * 2017-08-09 2020-10-19 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 Cu alloy bonding wire for semiconductor devices
JP6600121B2 (en) * 2017-08-09 2019-10-30 日鉄ケミカル＆マテリアル株式会社 Cu alloy bonding wire for semiconductor devices
KR102812812B1 (en) * 2022-03-08 2025-05-27 엘티메탈 주식회사 Manufacturing method of bonding wire and the wire boding manufactured thereby
KR102810270B1 (en) * 2022-03-08 2025-05-26 엘티메탈 주식회사 Manufacturing method of bonding wire and the wire boding manufactured thereby
KR102812817B1 (en) * 2022-12-14 2025-05-27 엘티메탈 주식회사 Manufacturing method of bonding wire and the wire boding manufactured thereby
KR102812809B1 (en) * 2022-12-14 2025-05-27 엘티메탈 주식회사 Manufacturing method of bonding wire and the wire boding manufactured thereby

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0786325A (en) * 1993-09-14 1995-03-31 Hitachi Cable Ltd Copper wire for electronic equipment
EP1903119B1 (en) * 2005-06-15 2015-09-23 JX Nippon Mining & Metals Corporation A method of manufacturing high purity copper
JP4885117B2 (en) * 2007-12-03 2012-02-29 新日鉄マテリアルズ株式会社 Bonding wires for semiconductor devices
US20130042949A1 (en) * 2011-08-17 2013-02-21 Hitachi Cable, Ltd. Method of manufacturing soft-dilute-copper-alloy-material

Also Published As

Publication number Publication date
JP5747970B2 (en) 2015-07-15
PH12016500617B1 (en) 2016-06-13
WO2015053128A1 (en) 2015-04-16
SG11201602116YA (en) 2016-05-30
JP2015076559A (en) 2015-04-20
TWI540212B (en) 2016-07-01
KR101558138B1 (en) 2015-10-06
KR20150085126A (en) 2015-07-22
CN104904000B (en) 2019-05-17
TW201522673A (en) 2015-06-16
CN104904000A (en) 2015-09-09
PH12016500617A1 (en) 2016-06-13

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