MY180233A - An assembly of apparatus for testing electronic components and a method thereof - Google Patents

An assembly of apparatus for testing electronic components and a method thereof

Info

Publication number
MY180233A
MY180233A MYPI2014000015A MYPI2014000015A MY180233A MY 180233 A MY180233 A MY 180233A MY PI2014000015 A MYPI2014000015 A MY PI2014000015A MY PI2014000015 A MYPI2014000015 A MY PI2014000015A MY 180233 A MY180233 A MY 180233A
Authority
MY
Malaysia
Prior art keywords
assembly
electronic components
testing electronic
testing
work pieces
Prior art date
Application number
MYPI2014000015A
Inventor
Chee Kin Leong
Original Assignee
Intotest Sdn Bhd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intotest Sdn Bhd filed Critical Intotest Sdn Bhd
Priority to MYPI2014000015A priority Critical patent/MY180233A/en
Priority to CN201410858346.5A priority patent/CN104764946A/en
Publication of MY180233A publication Critical patent/MY180233A/en

Links

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)
  • Specific Conveyance Elements (AREA)
  • User Interface Of Digital Computer (AREA)
  • General Factory Administration (AREA)

Abstract

The present invention envisages an apparatus (100) and method for placement and performing testing and subsequent packaging operations on multiple work pieces. The apparatus (100) reduces the cycle time involved in testing and packaging operations by processing two or more work pieces simultaneously using at least two pick and place units (110a, 110b). MOST ILLUSTRATIVE DRAWING: FIGURE 1
MYPI2014000015A 2014-01-03 2014-01-03 An assembly of apparatus for testing electronic components and a method thereof MY180233A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
MYPI2014000015A MY180233A (en) 2014-01-03 2014-01-03 An assembly of apparatus for testing electronic components and a method thereof
CN201410858346.5A CN104764946A (en) 2014-01-03 2014-12-24 Equipment assembly for testing electronic element and testing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
MYPI2014000015A MY180233A (en) 2014-01-03 2014-01-03 An assembly of apparatus for testing electronic components and a method thereof

Publications (1)

Publication Number Publication Date
MY180233A true MY180233A (en) 2020-11-25

Family

ID=53646904

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2014000015A MY180233A (en) 2014-01-03 2014-01-03 An assembly of apparatus for testing electronic components and a method thereof

Country Status (2)

Country Link
CN (1) CN104764946A (en)
MY (1) MY180233A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3687271A1 (en) * 2019-01-25 2020-07-29 Mycronic AB Eletrical verification of electronic components

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3847284A (en) * 1973-05-11 1974-11-12 Teledyne Inc Magnetic tape die sorting system
US6967475B2 (en) * 2004-01-22 2005-11-22 Asm Assembly Automation Ltd. Device transfer mechanism for a test handler
US7851721B2 (en) * 2009-02-17 2010-12-14 Asm Assembly Automation Ltd Electronic device sorter comprising dual buffers
JP2011154015A (en) * 2009-12-28 2011-08-11 Nippon Gaataa Kk Sorter for electronic component, and reading device of sorting information
US9519007B2 (en) * 2012-02-10 2016-12-13 Asm Technology Singapore Pte Ltd Handling system for testing electronic components

Also Published As

Publication number Publication date
CN104764946A (en) 2015-07-08

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