MY180515A - Printable semiconductor structures and related methods of making and assembling - Google Patents
Printable semiconductor structures and related methods of making and assemblingInfo
- Publication number
- MY180515A MY180515A MYPI2013003185A MYPI2013003185A MY180515A MY 180515 A MY180515 A MY 180515A MY PI2013003185 A MYPI2013003185 A MY PI2013003185A MY PI2013003185 A MYPI2013003185 A MY PI2013003185A MY 180515 A MY180515 A MY 180515A
- Authority
- MY
- Malaysia
- Prior art keywords
- making
- present
- printable semiconductor
- compositions
- substrates
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 5
- 238000000034 method Methods 0.000 title abstract 3
- 239000000758 substrate Substances 0.000 abstract 3
- 238000004519 manufacturing process Methods 0.000 abstract 2
- 239000000203 mixture Substances 0.000 abstract 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 238000003491 array Methods 0.000 abstract 1
- 230000010354 integration Effects 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 238000003913 materials processing Methods 0.000 abstract 1
- 230000037361 pathway Effects 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- 239000002520 smart material Substances 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 abstract 1
Landscapes
- Junction Field-Effect Transistors (AREA)
Abstract
The present invention provides a high yield pathway for the fabrication, transfer and assembly of high quality printable semiconductor elements (300) having selected physical dimensions, shapes, compositions and spatial orientations. The compositions and methods of the present invention provide high precision registered transfer and integration of arrays of microsized and/or nanosized semiconductor structures (290) onto substrates, including large area substrates and/or flexible substrates. In addition, the present invention provides methods of making printable semiconductor elements (300) from low cost bulk materials, such as bulk silicon wafers (320), and smart-materials processing strategies that enable a versatile and commercially attractive printing-based fabrication platform for making a broad range of functional semiconductor devices. Figure 1A
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/145,574 US7622367B1 (en) | 2004-06-04 | 2005-06-02 | Methods and devices for fabricating and assembling printable semiconductor elements |
| US11/145,542 US7557367B2 (en) | 2004-06-04 | 2005-06-02 | Stretchable semiconductor elements and stretchable electrical circuits |
| PCT/US2005/019354 WO2005122285A2 (en) | 2004-06-04 | 2005-06-02 | Methods and devices for fabricating and assembling printable semiconductor elements |
| US79010406P | 2006-04-07 | 2006-04-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY180515A true MY180515A (en) | 2020-12-01 |
Family
ID=87569321
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI2013003185A MY180515A (en) | 2005-06-02 | 2011-08-08 | Printable semiconductor structures and related methods of making and assembling |
Country Status (1)
| Country | Link |
|---|---|
| MY (1) | MY180515A (en) |
-
2011
- 2011-08-08 MY MYPI2013003185A patent/MY180515A/en unknown
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| MY151572A (en) | Printable semiconductor structures and related methods of making and assembling | |
| WO2006130721A3 (en) | Printable semiconductor structures and related methods of making and assembling | |
| WO2006099171A3 (en) | NOVEL GeSiSn-BASED COMPOUNDS, TEMPLATES, AND SEMICONDUCTOR STRUCTURES | |
| TW200625702A (en) | Integrated thermoelectric cooling devices and methods for fabricating same | |
| WO2008066894A3 (en) | Substrate for a flexible microelectronic assembly | |
| WO2007014294A3 (en) | Solutions integrated circuit integration of alternative active area materials | |
| AU2003286572A8 (en) | Processes for hermetically packaging wafer level microscopic structures | |
| EP2165362A4 (en) | Low resistance through-wafer via | |
| IL184780A0 (en) | Compositions for processing of semiconductor substrates | |
| AU2003272205A1 (en) | Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs | |
| WO2007046852A3 (en) | Discretized processing and process sequence integration of substrate regions | |
| EP1962342A4 (en) | SUBSTRATE WITH INTEGRATED CHIP AND METHOD FOR MANUFACTURING THE SAME | |
| MY159064A (en) | Semiconductor die package and method for making the same | |
| AU2003234260A1 (en) | Robot for handling semiconductor wafers | |
| WO2003054592A3 (en) | Optical device | |
| TW200511422A (en) | Treatment or processing of substrate surfaces | |
| WO2008045165A3 (en) | In-line furnace conveyors with integrated wafer retainers | |
| SG116648A1 (en) | Surface protecting film for semiconductor wafer and method of protecting semiconductor wafer using the same. | |
| AU2003263727A1 (en) | Fabrication of semiconductor devices | |
| WO2006096639A3 (en) | Semiconductor package fabrication | |
| ITBO20020793A1 (en) | DEVICE FOR THE SINGULARIZATION OF COMING ARTICLES | |
| WO2008067098A3 (en) | Applications of polycrystalline wafers | |
| EP1933120A3 (en) | Radiation sensor | |
| TWI367245B (en) | Method for laser marking the inactive surface of a semiconductor silicon die or wafer | |
| WO2007006166A3 (en) | Device for storing substrates |