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Application filed by Showa Denko Materials Co LtdfiledCriticalShowa Denko Materials Co Ltd
Priority to MYPI2017000996ApriorityCriticalpatent/MY180582A/en
Priority claimed from PCT/JP2016/086456external-prioritypatent/WO2018105070A1/en
Publication of MY180582ApublicationCriticalpatent/MY180582A/en
The present invention provides a resin varnish, a prepreg, a laminate and a printed wiring board, using a thermosetting resin composition having high heat resistance, low relative permittivity, high metal foil adhesion, high glass transition temperature and low thermal expansion and excellent in moldability and platability. Specifically, the resin varnish contains (A) a maleimide compound, (B) an epoxy resin, (C) a copolymer resin having a structural unit derived from an aromatic vinyl compound and a structural unit derived from a maleic anhydride, (D) a silica treated with an aminosilane coupling agent, and (G) an organic solvent.
MYPI2017000996A2016-12-072016-12-07Resin varnish, prepreg, laminate, and printed wiring board
MY180582A
(en)
Polyphenylene ether derivative having n-substituted maleimide group, and heat curable resin composition, resin varnish, prepreg, metal-clad laminate, and multilayer printed wiring board using same
High thermal conductivity, high glass transition temperature (tg) resin composition and its pre-impregnated and coating materials for printed circuit boards