MY180984A - Method for removing adhered metals from metal plate - Google Patents

Method for removing adhered metals from metal plate

Info

Publication number
MY180984A
MY180984A MYPI2020001781A MYPI2020001781A MY180984A MY 180984 A MY180984 A MY 180984A MY PI2020001781 A MYPI2020001781 A MY PI2020001781A MY PI2020001781 A MYPI2020001781 A MY PI2020001781A MY 180984 A MY180984 A MY 180984A
Authority
MY
Malaysia
Prior art keywords
metal plate
metal
deposited
removing adhered
metals
Prior art date
Application number
MYPI2020001781A
Inventor
Taisuke Matsui
Takashi MURONOSONO
Original Assignee
Matsuda Sangyo Company Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsuda Sangyo Company Ltd filed Critical Matsuda Sangyo Company Ltd
Publication of MY180984A publication Critical patent/MY180984A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F5/00—Electrolytic stripping of metallic layers or coatings

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

The present invention provides a method for stripping a metal deposited on a metal plate by use of an electrolytic apparatus with application of a flat DC voltage. The method includes immersing, in an electrolyte solution, a metal plate on which a metal has been deposited; and, subsequently, performing electrolysis by use of the metal plate as an anode at an anode potential of 0.1 to 3.0 V (Ag/AgCl reference electrode), to thereby strip the metal deposit from the metal plate. An object of the present invention is to realize simultaneous dissolution of one or more metals deposited on a metal plate and to shorten the metal deposit stripping time. Figure 1
MYPI2020001781A 2017-10-12 2018-09-28 Method for removing adhered metals from metal plate MY180984A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017198109 2017-10-12

Publications (1)

Publication Number Publication Date
MY180984A true MY180984A (en) 2020-12-15

Family

ID=66100619

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2020001781A MY180984A (en) 2017-10-12 2018-09-28 Method for removing adhered metals from metal plate

Country Status (4)

Country Link
JP (1) JP6748310B2 (en)
MY (1) MY180984A (en)
TW (1) TWI725345B (en)
WO (1) WO2019073819A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7330831B2 (en) 2019-09-17 2023-08-22 アサヒプリテック株式会社 Electrolytic device and stripping method

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54145322A (en) * 1978-05-04 1979-11-13 Furukawa Seimitsu Kinzoku Koug Electrolytic recover of silver from silver attached iron composite material
JPH02104699A (en) * 1988-10-11 1990-04-17 C Uyemura & Co Ltd Electrolytic peeling agent for silver and electrolytically peeling method
US6428683B1 (en) * 2000-12-15 2002-08-06 United Technologies Corporation Feedback controlled airfoil stripping system with integrated water management and acid recycling system
US7033466B2 (en) * 2002-09-27 2006-04-25 United Technologies Corporation Electrochemical stripping using single loop control
US20080202552A1 (en) * 2006-12-07 2008-08-28 Lawrence Bernard Kool Method for selectively removing coatings from metal substrates
JP2011149037A (en) * 2010-01-19 2011-08-04 Mitsubishi Shindoh Co Ltd Method for recycling scrap of copper or copper alloy plated with silver
TWI426157B (en) * 2011-05-18 2014-02-11 優勝奈米科技有限公司 Gold stripping composition and method of use
CN104419975A (en) * 2013-09-05 2015-03-18 通用电气公司 System and method for controlling electrochemical stripping process

Also Published As

Publication number Publication date
TW201923167A (en) 2019-06-16
WO2019073819A1 (en) 2019-04-18
JP6748310B2 (en) 2020-08-26
JPWO2019073819A1 (en) 2020-09-03
TWI725345B (en) 2021-04-21

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